JPS5797657A - Manufacture of semiconductor device - Google Patents

Manufacture of semiconductor device

Info

Publication number
JPS5797657A
JPS5797657A JP55175461A JP17546180A JPS5797657A JP S5797657 A JPS5797657 A JP S5797657A JP 55175461 A JP55175461 A JP 55175461A JP 17546180 A JP17546180 A JP 17546180A JP S5797657 A JPS5797657 A JP S5797657A
Authority
JP
Japan
Prior art keywords
sintering
tubular body
semiconductor
manufacture
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP55175461A
Other languages
Japanese (ja)
Other versions
JPS5811735B2 (en
Inventor
Hisatoshi Watanabe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
Original Assignee
Rohm Co Ltd
Toyo Electronics Industry Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm Co Ltd, Toyo Electronics Industry Corp filed Critical Rohm Co Ltd
Priority to JP55175461A priority Critical patent/JPS5811735B2/en
Publication of JPS5797657A publication Critical patent/JPS5797657A/en
Publication of JPS5811735B2 publication Critical patent/JPS5811735B2/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

PURPOSE:To obtain constantly uniform external shape by sintering a semiconductor laminate, having a semiconductor pellet between a pair of electrodes, inserted in a tube. CONSTITUTION:A tube 8 is made of powdered glass and binder that decomposes and evaporates in the process of sintering, it is then pressed into the shape. A semiconductor laminate 4, having at least one semiconductor pellet 3 between a pair of electrodes 1, 2, is inserted in the tubular body 8. The tubular body 8 and the semiconductor laminate 4 are closely bonded covering the gap in between by sintering the tubular body 8.
JP55175461A 1980-12-11 1980-12-11 Manufacturing method for semiconductor devices Expired JPS5811735B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP55175461A JPS5811735B2 (en) 1980-12-11 1980-12-11 Manufacturing method for semiconductor devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55175461A JPS5811735B2 (en) 1980-12-11 1980-12-11 Manufacturing method for semiconductor devices

Publications (2)

Publication Number Publication Date
JPS5797657A true JPS5797657A (en) 1982-06-17
JPS5811735B2 JPS5811735B2 (en) 1983-03-04

Family

ID=15996465

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55175461A Expired JPS5811735B2 (en) 1980-12-11 1980-12-11 Manufacturing method for semiconductor devices

Country Status (1)

Country Link
JP (1) JPS5811735B2 (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51135468A (en) * 1975-05-20 1976-11-24 Sanken Electric Co Ltd Production system of glass mold type semi-conductor unit

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51135468A (en) * 1975-05-20 1976-11-24 Sanken Electric Co Ltd Production system of glass mold type semi-conductor unit

Also Published As

Publication number Publication date
JPS5811735B2 (en) 1983-03-04

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