JPS5797659A - Lead frame - Google Patents

Lead frame

Info

Publication number
JPS5797659A
JPS5797659A JP55174298A JP17429880A JPS5797659A JP S5797659 A JPS5797659 A JP S5797659A JP 55174298 A JP55174298 A JP 55174298A JP 17429880 A JP17429880 A JP 17429880A JP S5797659 A JPS5797659 A JP S5797659A
Authority
JP
Japan
Prior art keywords
lead frame
bonded part
semiconductor element
linear expansion
cut
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP55174298A
Other languages
Japanese (ja)
Inventor
Yoshio Okubo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electronics Corp
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electronics Corp, Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electronics Corp
Priority to JP55174298A priority Critical patent/JPS5797659A/en
Publication of JPS5797659A publication Critical patent/JPS5797659A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/411—Chip-supporting parts, e.g. die pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07351—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting
    • H10W72/07353—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting changes in shapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07551—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/321—Structures or relative sizes of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/331—Shapes of die-attach connectors
    • H10W72/334—Cross-sectional shape, i.e. in side view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Die Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To reduce the difference of linear expansion between a semiconductor element piece and a lead frame by providing a cut in the bonded part or dividing the bonded part. CONSTITUTION:The bonded part of lead frame semiconductor element by brazing filler 6 is divided into two part, 21, 22. By the dividing gap d, 21 and 22 do not come in contact even by linear expansion in actual operation, thus reducing the difference of linear expansion along the length of the semiconductor element piece 1 at the both ends. A cut in the bonded part will also brings the same effect.
JP55174298A 1980-12-10 1980-12-10 Lead frame Pending JPS5797659A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP55174298A JPS5797659A (en) 1980-12-10 1980-12-10 Lead frame

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55174298A JPS5797659A (en) 1980-12-10 1980-12-10 Lead frame

Publications (1)

Publication Number Publication Date
JPS5797659A true JPS5797659A (en) 1982-06-17

Family

ID=15976213

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55174298A Pending JPS5797659A (en) 1980-12-10 1980-12-10 Lead frame

Country Status (1)

Country Link
JP (1) JPS5797659A (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6294632U (en) * 1985-12-03 1987-06-17
JPS62136056A (en) * 1985-12-09 1987-06-19 Nec Corp Lead frame
JPS6366941A (en) * 1986-09-08 1988-03-25 Mitsubishi Electric Corp Semiconductor device
JPS63249342A (en) * 1987-04-06 1988-10-17 Tomoegawa Paper Co Ltd Semiconductor device
JPS63254759A (en) * 1987-04-13 1988-10-21 Tomoegawa Paper Co Ltd Semiconductor device
JPS63254758A (en) * 1987-04-13 1988-10-21 Tomoegawa Paper Co Ltd Semiconductor device
JPS6457566A (en) * 1987-08-26 1989-03-03 Matsushita Electric Industrial Co Ltd Thermobattery
JPH0415947A (en) * 1990-05-09 1992-01-21 Hitachi Cable Ltd Semiconductor device lead frame and semiconductor device

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6294632U (en) * 1985-12-03 1987-06-17
JPS62136056A (en) * 1985-12-09 1987-06-19 Nec Corp Lead frame
JPS6366941A (en) * 1986-09-08 1988-03-25 Mitsubishi Electric Corp Semiconductor device
JPS63249342A (en) * 1987-04-06 1988-10-17 Tomoegawa Paper Co Ltd Semiconductor device
JPS63254759A (en) * 1987-04-13 1988-10-21 Tomoegawa Paper Co Ltd Semiconductor device
JPS63254758A (en) * 1987-04-13 1988-10-21 Tomoegawa Paper Co Ltd Semiconductor device
JPS6457566A (en) * 1987-08-26 1989-03-03 Matsushita Electric Industrial Co Ltd Thermobattery
JPH0415947A (en) * 1990-05-09 1992-01-21 Hitachi Cable Ltd Semiconductor device lead frame and semiconductor device

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