JPS579875A - Etching solution for nickel - Google Patents
Etching solution for nickelInfo
- Publication number
- JPS579875A JPS579875A JP8171880A JP8171880A JPS579875A JP S579875 A JPS579875 A JP S579875A JP 8171880 A JP8171880 A JP 8171880A JP 8171880 A JP8171880 A JP 8171880A JP S579875 A JPS579875 A JP S579875A
- Authority
- JP
- Japan
- Prior art keywords
- compound
- soln
- aliphatic
- etching
- org
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 title abstract 9
- 238000005530 etching Methods 0.000 title abstract 4
- 229910052759 nickel Inorganic materials 0.000 title abstract 2
- -1 aliphatic amine compound Chemical class 0.000 abstract 6
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 abstract 4
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 abstract 4
- 150000003464 sulfur compounds Chemical class 0.000 abstract 2
- 230000007774 longterm Effects 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 abstract 1
- 239000002184 metal Substances 0.000 abstract 1
- 229910052751 metal Inorganic materials 0.000 abstract 1
- 150000002739 metals Chemical class 0.000 abstract 1
- 238000002156 mixing Methods 0.000 abstract 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/10—Etching compositions
- C23F1/14—Aqueous compositions
- C23F1/16—Acidic compositions
- C23F1/28—Acidic compositions for etching iron group metals
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/44—Compositions for etching metallic material from a metallic material substrate of different composition
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/067—Etchants
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- ing And Chemical Polishing (AREA)
Abstract
PURPOSE:To maintain the power for selectively etching Ni over a long term by properly blending sulfuric acid, an aqueous hydrogen peroxide soln., an aliphatic amine compound, an aliphatic carboxylic acid compound, an org. sulfur compound and an aromatic nitro compound. CONSTITUTION:This etching soln. for nickel consists of 2.6-9.1wt% sulfuric acid, 1.5-5.6% aqueous hydrogen peroxide soln., 2.5-5% aliphatic amine compound, 0.5-1% aliphatic carboxylic acid compound, 0.25-0.5% org. sulfur compound, 0.15-0.3% aliphatic nitro compound and the balance water. When the soln. is used to selectively etch Ni among >=2 kinds of metals including Ni, it can etch Ni independently of the purity of Ni. Accordingly, the etching soln. can be utilized effectively in the manufacture of a printed wiring plate having a through hole and a circuit pattern, etc.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8171880A JPS579875A (en) | 1980-06-17 | 1980-06-17 | Etching solution for nickel |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8171880A JPS579875A (en) | 1980-06-17 | 1980-06-17 | Etching solution for nickel |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS579875A true JPS579875A (en) | 1982-01-19 |
| JPS5749632B2 JPS5749632B2 (en) | 1982-10-22 |
Family
ID=13754183
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8171880A Granted JPS579875A (en) | 1980-06-17 | 1980-06-17 | Etching solution for nickel |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS579875A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0337352U (en) * | 1989-08-18 | 1991-04-11 |
-
1980
- 1980-06-17 JP JP8171880A patent/JPS579875A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5749632B2 (en) | 1982-10-22 |
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