JPS5799358A - Film-forming device for semiconductor wafer - Google Patents

Film-forming device for semiconductor wafer

Info

Publication number
JPS5799358A
JPS5799358A JP55174252A JP17425280A JPS5799358A JP S5799358 A JPS5799358 A JP S5799358A JP 55174252 A JP55174252 A JP 55174252A JP 17425280 A JP17425280 A JP 17425280A JP S5799358 A JPS5799358 A JP S5799358A
Authority
JP
Japan
Prior art keywords
wafer
head
side wall
scattered
wax
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP55174252A
Other languages
Japanese (ja)
Inventor
Shigeru Honjo
Shoichi Kitane
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP55174252A priority Critical patent/JPS5799358A/en
Publication of JPS5799358A publication Critical patent/JPS5799358A/en
Pending legal-status Critical Current

Links

Landscapes

  • Coating Apparatus (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Abstract

PURPOSE: To exactly prevent a semiconductor wafer from readherence of scattered liquid by inclining at a specific angle the side wall part of a receiving plate to collect liquid scattered from the upper end part of the wafer by centrifugal force resulting from the rotation of spinner head.
CONSTITUTION: A semiconductor wafer 11 is horizontally placed on a spinner head 12 and then adsorbed on the head 12 by sucking air in the direction of arrow (a). Under the condition, an appropriate amount of a liquid substance, e.g.. a wax 13, is dropped on the center of the surface of the wafer 11, and then the head 12 is turned at a revolving number determined from the viscosity of the wax 13 or its desired thickness in such a way as to uniformly coat on the surface of the wafer 11. In this case, excessive wax 13 scattered about the surrounding collides with the side wall 14S of the receiving plate 14 but flows out toward an outlet port 14D without reflecting toward the wafer 11 because the inclined angle θ of the side wall 14S to the wafer 11 is 30° or less.
COPYRIGHT: (C)1982,JPO&Japio
JP55174252A 1980-12-10 1980-12-10 Film-forming device for semiconductor wafer Pending JPS5799358A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP55174252A JPS5799358A (en) 1980-12-10 1980-12-10 Film-forming device for semiconductor wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55174252A JPS5799358A (en) 1980-12-10 1980-12-10 Film-forming device for semiconductor wafer

Publications (1)

Publication Number Publication Date
JPS5799358A true JPS5799358A (en) 1982-06-21

Family

ID=15975370

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55174252A Pending JPS5799358A (en) 1980-12-10 1980-12-10 Film-forming device for semiconductor wafer

Country Status (1)

Country Link
JP (1) JPS5799358A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002166216A (en) * 2000-11-29 2002-06-11 Shibaura Mechatronics Corp Spin processing device and scattering prevention cup

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002166216A (en) * 2000-11-29 2002-06-11 Shibaura Mechatronics Corp Spin processing device and scattering prevention cup

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