JPS58106970U - Printed board - Google Patents
Printed boardInfo
- Publication number
- JPS58106970U JPS58106970U JP522982U JP522982U JPS58106970U JP S58106970 U JPS58106970 U JP S58106970U JP 522982 U JP522982 U JP 522982U JP 522982 U JP522982 U JP 522982U JP S58106970 U JPS58106970 U JP S58106970U
- Authority
- JP
- Japan
- Prior art keywords
- printed board
- circuit board
- printed circuit
- resist
- parts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structure Of Printed Boards (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来プリント基板の部分平面図、第２図は第１
因の■一■断面図、第３図は本案プリント基板の部分平
面図、第４図は第３因のＩＶ−ＩＶ断面図である。
１・・・・・・基板、２・・・・・・銅箔部、３・・・
・・・ハンダ、４・・・・・・レジスト部、５・・・・
・・非レジスト部。Figure 1 is a partial plan view of a conventional printed circuit board, and Figure 2 is a partial plan view of a conventional printed circuit board.
3 is a partial plan view of the printed circuit board according to the present invention, and FIG. 4 is a sectional view taken along line IV-IV of the third factor. 1... Board, 2... Copper foil part, 3...
...Solder, 4...Resist part, 5...
...Non-registration part.
Claims (1)
の非レジスト部に分割し、デイツピングにて前記非レジ
スト部にハンダ層を形成してなるプリント基板。A printed circuit board in which a copper foil part of a printed circuit board is divided into a plurality of non-resist parts at a resist part, and a solder layer is formed on the non-resist parts by dipping.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP522982U JPS58106970U (en) | 1982-01-18 | 1982-01-18 | Printed board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP522982U JPS58106970U (en) | 1982-01-18 | 1982-01-18 | Printed board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS58106970U true JPS58106970U (en) | 1983-07-21 |
Family
ID=30018040
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP522982U Pending JPS58106970U (en) | 1982-01-18 | 1982-01-18 | Printed board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58106970U (en) |
-
1982
- 1982-01-18 JP JP522982U patent/JPS58106970U/en active Pending
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