JPS58109251U - Semiconductor parts packaging - Google Patents
Semiconductor parts packagingInfo
- Publication number
- JPS58109251U JPS58109251U JP625682U JP625682U JPS58109251U JP S58109251 U JPS58109251 U JP S58109251U JP 625682 U JP625682 U JP 625682U JP 625682 U JP625682 U JP 625682U JP S58109251 U JPS58109251 U JP S58109251U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor parts
- parts packaging
- semiconductor component
- component packaging
- abstract
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004806 packaging method and process Methods 0.000 title claims description 4
- 239000004065 semiconductor Substances 0.000 title claims description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims 1
- 229910052799 carbon Inorganic materials 0.000 claims 1
Landscapes
- Packaging Frangible Articles (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図および第２図は従来の包装体事例を示す平面図お
よび断面図、第３図および第４図はこの考案の実施例を
示す平面図および断面−である。
２・・・・・・弁部、３・・・・・・半導体部品、４・
・・・・・封帯、５・・・・・・孔、１０・・・・・・
プラスチック体。1 and 2 are a plan view and a sectional view showing an example of a conventional packaging body, and FIGS. 3 and 4 are a plan view and a sectional view showing an embodiment of this invention. 2...Valve part, 3...Semiconductor parts, 4.
... bandage, 5 ... hole, 10 ...
plastic body.
Claims (1)
羅列的に設けたことを特徴とする半導体部品包装体。A semiconductor component packaging body characterized in that semiconductor component packaging bodies are arranged in a row on a carbon-containing thin plastic plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP625682U JPS58109251U (en) | 1982-01-19 | 1982-01-19 | Semiconductor parts packaging |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP625682U JPS58109251U (en) | 1982-01-19 | 1982-01-19 | Semiconductor parts packaging |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS58109251U true JPS58109251U (en) | 1983-07-25 |
Family
ID=30019039
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP625682U Pending JPS58109251U (en) | 1982-01-19 | 1982-01-19 | Semiconductor parts packaging |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58109251U (en) |
-
1982
- 1982-01-19 JP JP625682U patent/JPS58109251U/en active Pending
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