JPS5812478A - Manufacture of solid state image pickup device - Google Patents

Abstract

PURPOSE:To minimize thermal strain applied to a translucent glass plate, and to obtain a highly reliable solid image pickup device, by previously depositing a soldering material on at least either one of a metallic frame body of a package side or that on a cap side. CONSTITUTION:On a metallic frame body 11 on the side of a package 1, an Au/ Sn soldering material 12 is deposited previously. Consequently, metallic frame bodies 9 and 11 are seam-welded together with a small welding current, and the heating value during the welding is reduced to reduce residual thermal strain to a transparent glass plate 7. Further, the soldering material 12 is stuck previously on the metallic frame body 11 on the package 1 to eliminate a splash of the soldering material 12 completely during the welding to the metallic frame 9 on the side of a cap 10. Further, the sticking of black stains, etc., on the internal surface of the glass plate 7 or on the surface of a photodetecting element 5 is prevented securely and completely to perform stable welding operation.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for manufacturing a solid-state imaging device, and particularly to a method for packaging a solid-state imaging device.

Figure @1 is a cross-sectional configuration diagram of essential parts of an example of a solid-state imaging device that has been proposed in recent years. In the figure, a package 1 made of ceramic or the like has a stepped portion 1a and a bottom portion 1 at its center.
A bonding pad 2 is formed at a predetermined position of the stepped portion 1a. This bonding pad 2 is connected to a metal conductive pattern 3 laminated inside the package 1, and further connected to an external connection lead terminal 4 fixed to the side surface of the package 1. Further, inside the recess 1c of this package 1, a solid-state image sensor (hereinafter referred to as a light receiving element) 5 is located at the bottom 1.
The bonding pad 5a of the light receiving element 5 is connected to the bonding pad 2 formed on the stepped portion 1a of the package 1 via a bonding wire Stt. The package 1 is made up of a translucent glass plate T, a ceramic frame 8, and a metal frame 9 made of Kovar or the like on its open end side, that is, on its front side, in order to prevent the housed light-receiving element 5 from deteriorating. cap 1
The metal frame S of this cap 10 and the metal frame 11 formed and arranged in the upper part of the package 1, such as copal, are locally welded by seam welding etc. with an Au/Sn brazing material 12 interposed. Hermetically sealed by welding using heat.

However, in the solid-state imaging device with the above configuration,
When performing seam weld sealing by interposing the Am/8m four-material 12 between the metal frames 9 and 11, Au/Inn
- Since the material 12 needs to be melted and welded to both sides of the metal frames 1 and 11 at the same time, a large welding current is required. For this reason, thermal distortion remains in the translucent glass plate T due to the heat generated during welding, and the translucent glass plate T is sealed under stress, and depending on the heat history during subsequent use, the translucent glass plate T Clutter may occur, which poses a major problem in terms of reliability.

Therefore, the present invention minimizes the thermal strain applied to the translucent glass plate by welding the metal material to at least one of the metal frame on the package side and the metal frame on the cap side in advance, thereby achieving reliable reliability. The present invention aims to provide a manufacturing method that allows a solid-state imaging device with high performance to be obtained.

Embodiments of the present invention will be described in detail below with reference to the drawings.

FIG. 2 is a cross-sectional configuration diagram of essential parts for explaining an example of a method for manufacturing a field imaging device according to the present invention. Since the same symbols as those in the above-mentioned figures represent the same elements, the explanation thereof will be omitted. In FIG. 112, an Am/Bn brazing material 12 is welded and bonded in advance on a metal frame 11 formed and arranged in the upper part of the package 1.

Then, the metal frame 9 of the middle cover 10 is placed on the mu/8na material 12 adhesively placed on the metal frame 11 of the package 1, and the metal frames 8 and 11 are welded to form a seam weld. let

According to such a method, the metal frame 1 on the package 1 side
Since the A u/8 m brazing material 12 is welded on the metal frame 1 in advance, it is possible to seam weld the metal frame 1 and the metal frame 11 with a small welding current, and therefore the amount of heat generated during welding is also small. Therefore, residual thermal strain on the translucent glass plate T is also reduced.

Moreover, since the An/8nF1-material 12 is fixedly placed on the metal frame 9 on the package 1 in advance, the Am/8n brazing material 12 is fixedly placed on the metal frame 9 on the cap 10 side.
Since there is no splash and it is possible to reliably and completely prevent the adhesion of black dirt and the like on the inner placement of the translucent glass plate T and the surface of the light receiving element 5, stable welding work is possible.

In the above embodiment, a case has been described in which the Mu/8N brazing material 12 is welded and fixed on the metal frame 11 of the package 1 in advance. 12 may be welded and fixed in advance, and the metal frame openings of both may be welded and fixed in advance.

Even when the An/Sn brazing material 1 was welded and fixed on No. 11 and then welded, exactly the same effect as described above was obtained.

In addition, in the above embodiment, MuC8m4 was used as the brazing material.
Although the case where a material is used has been described, the present invention is not limited to this, and it goes without saying that the same effect as described above can be obtained even if a material with a low melting point such as solder is used. be.

As explained above, according to the method of manufacturing a solid-state imaging device according to the present invention, the thermal strain generated in the front side translucent glass plate is drastically reduced, and the heat distortion on the inner surface of the translucent glass plate and the surface of the light receiving element is reduced. This method has extremely excellent effects such as no material splash adhesion, a highly reliable solid-state imaging device, and a significant improvement in yield.

[Brief explanation of the drawing]

Figure 111 is a cross-sectional configuration diagram of main parts showing an example of a solid-state imaging device;
FIG. 1112 is a sectional view of a main part showing an example of a method for using the solid-state imaging device according to the present invention. 1...package, 11...stepped section, lb...
@bottom, 1c...concavity, 2φ...bond pad, 3...fist/metal conductive pattern, 4/11Φ/lead terminal for external connection, 5...solid-state image sensor (light receiving element)
, 5a... bonding pad, 6... bonding wire, T... translucent glass plate, 8...
Ceramic frame body, 9... Metal frame body, 10... Au Yap, 11---Fist metal frame body, 1211... Au/
s! 10-Material.

Claims (1)

[Claims] A method for manufacturing a solid-state imaging device in which a package in which a solid-state imaging device is housed and fixed in a recessed part and a cap covering an open end of the package are hermetically sealed with a brazing material that is melted and fixed by local heating, wherein the brazing material is A method for producing a solid-state imaging device, characterized in that at least one of the open end of the package and the cap is welded solid in advance and hermetically sealed by local heating.