JPS58130551A - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS58130551A
JPS58130551A JP57144629A JP14462982A JPS58130551A JP S58130551 A JPS58130551 A JP S58130551A JP 57144629 A JP57144629 A JP 57144629A JP 14462982 A JP14462982 A JP 14462982A JP S58130551 A JPS58130551 A JP S58130551A
Authority
JP
Japan
Prior art keywords
terminals
lead
semiconductor device
circuit
main body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57144629A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6347352B2 (2
Inventor
Okimitsu Yasuda
安田　興光
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP57144629A priority Critical patent/JPS58130551A/ja
Publication of JPS58130551A publication Critical patent/JPS58130551A/ja
Publication of JPS6347352B2 publication Critical patent/JPS6347352B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP57144629A 1982-08-23 1982-08-23 半導体装置 Granted JPS58130551A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57144629A JPS58130551A (ja) 1982-08-23 1982-08-23 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57144629A JPS58130551A (ja) 1982-08-23 1982-08-23 半導体装置

Publications (2)

Publication Number Publication Date
JPS58130551A true JPS58130551A (ja) 1983-08-04
JPS6347352B2 JPS6347352B2 (2) 1988-09-21

Family

ID=15366483

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57144629A Granted JPS58130551A (ja) 1982-08-23 1982-08-23 半導体装置

Country Status (1)

Country Link
JP (1) JPS58130551A (2)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53763U (2) * 1976-06-23 1978-01-06

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53763U (2) * 1976-06-23 1978-01-06

Also Published As

Publication number Publication date
JPS6347352B2 (2) 1988-09-21

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