JPS58140642U - ハイブリツドｉｃのケ−ス封入構造 - Google Patents

ハイブリツドｉｃのケ−ス封入構造

Info

Publication number
JPS58140642U
JPS58140642U JP3671782U JP3671782U JPS58140642U JP S58140642 U JPS58140642 U JP S58140642U JP 3671782 U JP3671782 U JP 3671782U JP 3671782 U JP3671782 U JP 3671782U JP S58140642 U JPS58140642 U JP S58140642U
Authority
JP
Japan
Prior art keywords
hybrid
enclosure structure
case enclosure
case
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP3671782U
Other languages
English (en)
Other versions
JPS6225891Y2 (ja
Inventor
和泉　裕昭
月原　保久
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP3671782U priority Critical patent/JPS58140642U/ja
Publication of JPS58140642U publication Critical patent/JPS58140642U/ja
Application granted granted Critical
Publication of JPS6225891Y2 publication Critical patent/JPS6225891Y2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Casings For Electric Apparatus (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図、第２図は従来におけるＩＣの封入構造の一例を
示す一部断面斜視図、第３図は本考案によるハイブリッ
ドＩＣの封入構造の一実施例を示す一部断面斜視図、第
４図は本考案による一実施例の断面図である。 １・・・ハイブリッドＩＣ基板、２・・・基板端部、３
・・・ケース封入樹脂、４・・・ケース、５・・・接着
性シリコン樹脂、６・・・大型部品、７・・・無接着性
シリコン樹脂、訃・・プライマ、９・・・部品と基板間
空間。

Claims (1)

    【実用新案登録請求の範囲】
  1. 金属製あるいは樹脂製ケース内部に、プライマを塗布後
    、無接着性シリコン樹脂によりポツティングを行なうこ
    とを特徴とするハイブリッドＩＣのケース封入構造。
JP3671782U 1982-03-15 1982-03-15 ハイブリツドｉｃのケ−ス封入構造 Granted JPS58140642U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3671782U JPS58140642U (ja) 1982-03-15 1982-03-15 ハイブリツドｉｃのケ−ス封入構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3671782U JPS58140642U (ja) 1982-03-15 1982-03-15 ハイブリツドｉｃのケ−ス封入構造

Publications (2)

Publication Number Publication Date
JPS58140642U true JPS58140642U (ja) 1983-09-21
JPS6225891Y2 JPS6225891Y2 (ja) 1987-07-02

Family

ID=30048137

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3671782U Granted JPS58140642U (ja) 1982-03-15 1982-03-15 ハイブリツドｉｃのケ−ス封入構造

Country Status (1)

Country Link
JP (1) JPS58140642U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6177346A (ja) * 1984-09-25 1986-04-19 Matsushita Electric Works Ltd 多重伝送機器の端末器

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5222051A (en) * 1975-08-13 1977-02-19 Shin Etsu Chem Co Ltd Autohesive silicone rubber composition
JPS566456A (en) * 1979-06-26 1981-01-23 Mitsubishi Electric Corp Packaging method of semiconductor device
JPS569183A (en) * 1979-07-04 1981-01-30 Seiko Instr & Electronics Airtight chamber

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5222051A (en) * 1975-08-13 1977-02-19 Shin Etsu Chem Co Ltd Autohesive silicone rubber composition
JPS566456A (en) * 1979-06-26 1981-01-23 Mitsubishi Electric Corp Packaging method of semiconductor device
JPS569183A (en) * 1979-07-04 1981-01-30 Seiko Instr & Electronics Airtight chamber

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6177346A (ja) * 1984-09-25 1986-04-19 Matsushita Electric Works Ltd 多重伝送機器の端末器

Also Published As

Publication number Publication date
JPS6225891Y2 (ja) 1987-07-02

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