JPS58192400A - 平形半導体素子の保持装置 - Google Patents

平形半導体素子の保持装置

Info

Publication number
JPS58192400A
JPS58192400A JP58068253A JP6825383A JPS58192400A JP S58192400 A JPS58192400 A JP S58192400A JP 58068253 A JP58068253 A JP 58068253A JP 6825383 A JP6825383 A JP 6825383A JP S58192400 A JPS58192400 A JP S58192400A
Authority
JP
Japan
Prior art keywords
recess
semiconductor element
pressurizing body
cooling
cooling body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58068253A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6327861B2 (2
Inventor
クルト・グロ−スマン
ユルゲン・ブリ−スナ−
ヨアヒム・シツカ−
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens Schuckertwerke AG
Siemens Corp
Original Assignee
Siemens Schuckertwerke AG
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Schuckertwerke AG, Siemens Corp filed Critical Siemens Schuckertwerke AG
Publication of JPS58192400A publication Critical patent/JPS58192400A/ja
Publication of JPS6327861B2 publication Critical patent/JPS6327861B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
    • H10W40/611—Bolts or screws
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W78/00—Detachable holders for supporting packaged chips in operation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/231—Arrangements for cooling characterised by their places of attachment or cooling paths

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Lubricants (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Forklifts And Lifting Vehicles (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
  • Load-Engaging Elements For Cranes (AREA)
JP58068253A 1982-04-23 1983-04-18 平形半導体素子の保持装置 Granted JPS58192400A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19823215192 DE3215192A1 (de) 1982-04-23 1982-04-23 Einspannvorrichtung fuer scheibenfoermige halbleiter-bauelemente
DE3215192.6 1982-04-23

Publications (2)

Publication Number Publication Date
JPS58192400A true JPS58192400A (ja) 1983-11-09
JPS6327861B2 JPS6327861B2 (2) 1988-06-06

Family

ID=6161750

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58068253A Granted JPS58192400A (ja) 1982-04-23 1983-04-18 平形半導体素子の保持装置

Country Status (7)

Country Link
US (1) US4638404A (2)
EP (1) EP0092720B1 (2)
JP (1) JPS58192400A (2)
AT (1) ATE15733T1 (2)
BR (1) BR8302014A (2)
DE (2) DE3215192A1 (2)
IN (1) IN158361B (2)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3446569C2 (de) * 1984-12-20 1996-05-02 Siemens Ag Einspannvorrichtung für mehrere, scheibenförmige Halbleiterbauelemente
US4792204A (en) * 1987-06-08 1988-12-20 Siemens Aktiengesellschaft Process and apparatus for elimination of tolerance dependent variations of a selectable spacing between components in optical communication equipment
DE3853197T2 (de) * 1987-12-07 1995-06-29 Nippon Electric Co Kühlungssystem für integrierte Schaltungspackung.
CA1304830C (en) * 1988-09-20 1992-07-07 Toshifumi Sano Cooling structure
US5060115A (en) * 1990-09-28 1991-10-22 The United States Of America As Represented By The Secretary Of The Navy Heat sink device for electronics modules packaged in cylindrical casings
JP2728105B2 (ja) * 1991-10-21 1998-03-18 日本電気株式会社 集積回路用冷却装置
JPH05327283A (ja) * 1992-02-18 1993-12-10 Samsung Electron Co Ltd 半導体パッケージの垂直実装装置及びその実装方法
US5184281A (en) * 1992-03-03 1993-02-02 Digital Equipment Corporation Heat dissipation apparatus
IT1292590B1 (it) * 1997-05-30 1999-02-08 El Bo Mec S R L Dissipatore di calore, in particolare per componenti elettronici.
US6038156A (en) * 1998-06-09 2000-03-14 Heart Interface Corporation Power inverter with improved heat sink configuration
US6304449B1 (en) * 1999-07-06 2001-10-16 Chaojiong Zhang Heat sink mounting for power semiconductors
TWI303973B (en) * 2006-09-06 2008-12-01 Delta Electronics Inc Heat sink fastening device and manufacturing method thereof
EP2787529B1 (en) * 2011-11-30 2018-05-23 Mitsubishi Electric Corporation Semiconductor device, and on-board power conversion device
DE102015206992A1 (de) * 2015-04-17 2016-10-20 Zf Friedrichshafen Ag Anbindung eines Leistungsbauteils an einen Kühlkörper
US11076477B2 (en) * 2017-10-03 2021-07-27 Mks Instruments, Inc. Cooling and compression clamp for short lead power devices

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1439304B2 (de) * 1963-10-31 1972-02-24 Siemens AG, 1000 Berlin u. 8000 München Halbleiterbauelement
CH440464A (de) * 1966-07-14 1967-07-31 Bbc Brown Boveri & Cie Kühlkörper für Halbleiterelemente
US3735206A (en) * 1971-10-28 1973-05-22 Nasa Circuit board package with wedge shaped covers
BE814391A (fr) * 1973-05-14 1974-08-16 Module semi-conducteur
DE2602589C2 (de) * 1976-01-22 1982-02-18 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Vorrichtung zum Einspannen eines Scheibenthyristors zwischen zwei Kühlkörpern
US4246597A (en) * 1979-06-29 1981-01-20 International Business Machines Corporation Air cooled multi-chip module having a heat conductive piston spring loaded against the chips
SU997140A1 (ru) * 1981-06-22 1983-02-15 За витель Полупроводникова выпр мительна установка
US4459639A (en) * 1982-07-12 1984-07-10 Rockwell International Corporation Circuit board heatsink clamping assembly and technique
EP0103068B1 (de) * 1982-09-09 1989-01-04 Siemens Aktiengesellschaft Einrichtung zum Kühlen einer Mehrzahl von zu Flachbaugruppen zusammengefassten integrierten Bausteinen

Also Published As

Publication number Publication date
IN158361B (2) 1986-10-25
DE3360822D1 (en) 1985-10-24
EP0092720B1 (de) 1985-09-18
US4638404A (en) 1987-01-20
DE3215192A1 (de) 1983-10-27
EP0092720A1 (de) 1983-11-02
BR8302014A (pt) 1983-12-27
JPS6327861B2 (2) 1988-06-06
ATE15733T1 (de) 1985-10-15

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