JPS58193642U - lead frame - Google Patents
lead frameInfo
- Publication number
- JPS58193642U JPS58193642U JP1982091984U JP9198482U JPS58193642U JP S58193642 U JPS58193642 U JP S58193642U JP 1982091984 U JP1982091984 U JP 1982091984U JP 9198482 U JP9198482 U JP 9198482U JP S58193642 U JPS58193642 U JP S58193642U
- Authority
- JP
- Japan
- Prior art keywords
- outer frame
- mounting section
- lead frame
- insulating part
- approximately
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は、従来のリードフレームの上面図、第２図は、
本考案リードフレームの上面図、第５図乃至第５図は本
考案リードフレームを用いて樹脂封止半導体装置を製造
するときの製造工程を示す要部断面図である。
１・・・ペレット載置部、２・・・外枠、３・・・外部
リード端子、４・・・絶縁部、５・・・導電路。Fig. 1 is a top view of a conventional lead frame, and Fig. 2 is a top view of a conventional lead frame.
The top view of the lead frame of the present invention and FIGS. 5A and 5B are cross-sectional views of main parts showing the manufacturing process when manufacturing a resin-sealed semiconductor device using the lead frame of the present invention. DESCRIPTION OF SYMBOLS 1... Pellet mounting part, 2... Outer frame, 3... External lead terminal, 4... Insulating part, 5... Conductive path.
Claims (1)
裏両面に載置される載置部と、外枠からこの載置部周辺
まで延在された外部リード端子と、前記載置部周囲に外
部端子と略同じ厚みの非導電性物質で形成された絶縁部
と、この絶縁部に貫通した状態で埋め込み形成された導
電路と、から成るリードフレーム。An outer frame, a mounting section provided approximately at the center of the outer frame and on which semiconductor substrates are placed on both front and back surfaces, external lead terminals extending from the outer frame to the periphery of the mounting section, and the mounting section described above. A lead frame consisting of an insulating part made of a non-conductive material with approximately the same thickness as an external terminal around the part, and a conductive path embedded and penetrating through the insulating part.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1982091984U JPS58193642U (en) | 1982-06-18 | 1982-06-18 | lead frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1982091984U JPS58193642U (en) | 1982-06-18 | 1982-06-18 | lead frame |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58193642U true JPS58193642U (en) | 1983-12-23 |
| JPS6236299Y2 JPS6236299Y2 (en) | 1987-09-16 |
Family
ID=30100202
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1982091984U Granted JPS58193642U (en) | 1982-06-18 | 1982-06-18 | lead frame |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58193642U (en) |
-
1982
- 1982-06-18 JP JP1982091984U patent/JPS58193642U/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6236299Y2 (en) | 1987-09-16 |
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