JPS58197832A - Fitting method for pellet - Google Patents

Fitting method for pellet

Info

Publication number
JPS58197832A
JPS58197832A JP57079985A JP7998582A JPS58197832A JP S58197832 A JPS58197832 A JP S58197832A JP 57079985 A JP57079985 A JP 57079985A JP 7998582 A JP7998582 A JP 7998582A JP S58197832 A JPS58197832 A JP S58197832A
Authority
JP
Japan
Prior art keywords
gold
pellet
wire
wires
gold wires
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP57079985A
Other languages
Japanese (ja)
Inventor
Junichi Nakamura
順一 中村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP57079985A priority Critical patent/JPS58197832A/en
Publication of JPS58197832A publication Critical patent/JPS58197832A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/011—Apparatus therefor
    • H10W72/0113—Apparatus for manufacturing die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/013—Manufacture or treatment of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07173—Means for moving chips, wafers or other parts, e.g. conveyor belts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07337—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/352—Materials of die-attach connectors comprising metals or metalloids, e.g. solders
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Die Bonding (AREA)

Abstract

PURPOSE:To fit even the large-sized pellet positively and rapidly by a small amount of gold by using a minute gold wire in place of gold foil. CONSTITUTION:The two minute gold wires 3 are fixed into the pellet fitting region of a lead frame 1, and the pellet 4 is fixed by utilizing the gold wires. The two minute gold wires 3 are connected to the lead frame 1 by a gold-wire fixture. A bonding tool 16 has two parallel guide holes 17 guiding two gold wires 14. When fitting the gold wires, the two gold wires 14 are clamped by a wire clamper 18, the bonding tool 16 is dropped, and the tips of the gold wires 14 are fixed to the lead frame 1. The wire clamper 18 is released, the bonding tool 16 and the wire clamper 18 are elevated under the state in which the clamping of the gole wires 14 is stopped, the wire clamper 18 is closed on its midway of elevation again, and the gold wires 14 are cut in the vicinity of the connecting sections.

Description

【発明の詳細な説明】 本発明は半導体装置の組立におけるベレット取付方法に
関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for attaching a pellet in the assembly of a semiconductor device.

半導体装置の組立において、リードフレーム等の基板に
半導体素子（ベレット）を象り付ける方法として、第１
図に示すように、リードフレームｌのベレット取付領域
に金箔２を取り付けたり、あるいは第２図に示すように
リードフレームｌのベレット取付領域に微小金線３を＃
１層したりした後に、これら金箔２または微小金Ｉｍ３
よに熱圧着によってベレット４を固定している。In the assembly of semiconductor devices, the first method is to imprint a semiconductor element (vellet) onto a substrate such as a lead frame.
As shown in the figure, a gold foil 2 is attached to the pellet attachment area of the lead frame l, or a fine gold wire 3 is attached to the pellet attachment area of the lead frame l as shown in FIG.
After applying one layer, these gold foils 2 or fine gold Im3
The pellet 4 is fixed by thermocompression bonding.

金箔付けの場合は、たとえは第３図で示すように、リー
ル５から解オ出した帯状金箔６を金箔供給チャック７で
スポットウェルド装置８の下電極９士に配設したリード
フレームｌのベレット取付領域上に供給し、リードフレ
ーム１上の上電極ｌＯと下電極９によるスポットウェル
ドによって帯状金箔６の先端部を固定し、その後、カッ
ター１１で帯状金箔６をその溶接近傍で切断することに
よって金箔付けを行なっている。また、微小金線付けの
場合は、第４図で示すように、ヒートブロック１２士を
間欠移動するリードフレームｌに対して、金線スプール
１３から解き出した金縁１４の先端部をカム駆動部１５
で昇降するボンディングツール１６で保持し、ボンディ
ングツール１６で金線先端をリードフレーム１のペレッ
）３１付領域に熱圧瑠した後、金線１４を掴んで引っ張
り、圧看部近傍で切断させることによって、微小金線付
けを行なっ℃いる。In the case of gold foil attachment, for example, as shown in FIG. 3, a strip of gold foil 6 unrolled from a reel 5 is placed on the lower electrodes of a spot welding device 8 using a gold foil supply chuck 7, and then a pellet of a lead frame l is placed. By supplying it onto the mounting area and fixing the tip of the strip gold foil 6 by spot welding with the upper electrode IO and lower electrode 9 on the lead frame 1, the strip gold foil 6 is then cut with a cutter 11 near the weld. Gold leaf is applied. In addition, in the case of fine gold wire attachment, as shown in FIG. 15
The gold wire 14 is held by a bonding tool 16 that moves up and down, and after hot pressing the tip of the gold wire with the bonding tool 16 onto the area where the pellet 31 of the lead frame 1 is attached, the gold wire 14 is grabbed and pulled to be cut near the pressed part. Fine gold wire was attached at ℃.

しかし、このような方法ではっぎのような欠点がある。However, this method has some drawbacks.

（１）金箔付は方法では金の使用量が大巾に低減できな
い。(1) Gold leafing cannot significantly reduce the amount of gold used.

（２）ｗ極やカッターの摩耗等による故障が多発する。(2) Failures occur frequently due to wear of the w pole or cutter.

（３）銅に銀メッキしたリードフレーム上にカッターの
傷がつくことにより銅が表面に現われシリコン（８１）
であるペレットの中に鋼（Ｏｕ）が浸透し易くなるため
、ＳｔとＯｕの膨張率の違いによるペレットのクラック
が発生する一因となる。(3) Copper appears on the surface due to scratches made by the cutter on the silver-plated copper lead frame and becomes silicon (81)
Steel (Ou) easily penetrates into the pellet, which is one of the causes of cracks in the pellet due to the difference in expansion coefficients between St and O.

（４）微小金線のような１点のスポットボンディングで
は０．６１ａｍロ以上のペレットサイズのものにはヌレ
面積が少なく、ペレット（トランジスタ）の特性機能が
得られないため使用できない。(4) One-point spot bonding, such as a fine gold wire, cannot be used for pellets with a pellet size of 0.61 am or more because the wetting area is small and the characteristic function of the pellet (transistor) cannot be obtained.

したがって、本発明の目的は大型のペレットにおいても
少量の金で確実にかつ迅速にペレットの取り付けが行な
えるペレット取付方法を提供することにある。Therefore, an object of the present invention is to provide a method for attaching pellets, which can reliably and quickly attach even large pellets with a small amount of gold.

以下、実施例により本発明を説明する。The present invention will be explained below with reference to Examples.

第５図乃至第８図（ａｌ〜（ｅｌは本発明の一寮施例に
よるペレット取付方法を示す図であって、ＷＬ５図はペ
レット取付状態を示す平面図、第６図は金線取付機の斜
視図、第７図（ａｔ、　（ｂｌは金線付は用のボンディ
ングツールを示す正面図および断面図、第８図（ａｌ〜
（ｅｌは金線取付動作を示す説明図である。5 to 8 (al to el are diagrams showing the pellet mounting method according to the one-dormitory embodiment of the present invention, WL5 is a plan view showing the pellet mounting state, and FIG. 6 is a wire mounting machine. Figure 7 (at, (bl) is a front view and sectional view showing a bonding tool with gold wire, Figure 8 (al~
(El is an explanatory diagram showing the gold wire attachment operation.

このｖ４施例では、ＩＪｉ４５図に示すように、リード
フレーム１σ）ペレット取付領域に２本の微小金線３を
固定した後、この２本の微小金Ｉｍ３を利用し又ペレッ
ト４を固定している。２本の微小金線３のリードフレー
ム１への接続は、第６図に示す金線取付動作で行なう。In this v4 example, as shown in Figure IJi45, after fixing two fine gold wires 3 to the pellet mounting area of the lead frame (1σ), these two fine gold wires Im3 are used to fix the pellet 4. There is. The two fine gold wires 3 are connected to the lead frame 1 by the gold wire attachment operation shown in FIG.

すなわち、この装置では、ヒートブロック１２上を間欠
移動するリードフレーム１Ｆ対して、２個の金線スプー
ル１３から解き出した２本の金＠３の先端部をカム駆動
部１５で昇降する１本のボンディングツール１６で保持
し、ボンディングツール１６で２本の金線先遣をリード
フレームｌのペレット取付領域に熱圧着した後、金ｆｆ
１Ｊ１４を掴んで引っ張り、圧着部近傍で切断させるこ
とにより℃、２本の微小金線付けを行すっている。ボン
ディングツール１６は第７図ｔａ）、　（ｂ）に示すよ
うに、２本の金＃ｉ１４を案内する２本の平行なガイド
孔１７を有している。金線付けの際は第８図（ａｌ　ｉ
ｃ示すよ５に、ワイヤクランパ１８で２本の金＠１４を
クランパした後、同図（ｂｌｋ示すように、ボンディン
グツーニル１６を降下させ−”（１７−ドフレームｌに
金９１４先端を固定する。That is, in this device, for the lead frame 1F that moves intermittently on the heat block 12, the tips of two gold wires 3 uncoiled from the two gold wire spools 13 are moved up and down by the cam drive unit 15. The bonding tool 16 is used to thermo-compress the two gold wires to the pellet attachment area of the lead frame L, and then the gold ff is held by the bonding tool 16.
By grasping and pulling 1J14 and cutting it near the crimped part, two fine gold wires are attached at ℃. As shown in FIGS. 7a) and 7(b), the bonding tool 16 has two parallel guide holes 17 for guiding two pieces of gold #i14. When attaching gold wire, refer to Figure 8 (al i
After clamping the two pieces of gold @14 with the wire clamper 18 as shown in c, lower the bonding tool 16 as shown in the same figure (blk) and fix the tip of the gold 914 to the gold frame l. do.

その後、ワイヤクランパ１８を開放動作させて金線１４
のクランプを停止した状態でボンディングツール１６お
よびワイヤクランパ１８を上昇させる（同図（ｃｌ参照
）。その後、同図（ｄ）、　（ｅ）で示すように、再び
ワイヤクランパ１８を上昇途中で閉動作させ、金線１４
をその接ａ郁近傍で切断させる。After that, the wire clamper 18 is opened and the gold wire 14 is
With the clamp of Operate, gold wire 14
is cut near the contact point.

このような方法によれば、金の使用量の多い金箔に代え
℃金線を使用することから、２本の微小　。According to this method, two minute gold wires are used instead of gold leaf, which uses a large amount of gold.

金線３の使用でも金の使用蓋を軽減できる。このことか
ら、ペレットボンディングぞストの低減が図れる。The use of gold wire 3 can also reduce the amount of gold used. From this, pellet bonding costs can be reduced.

また、この実施例では、カッターによってリードフレー
ムを傷付けたりすることはないことから、リードフレー
ム表面への銅の露出もなくなり、銅が原因となるペレッ
トクラックは防止できる。Further, in this embodiment, since the cutter does not damage the lead frame, there is no exposure of copper to the surface of the lead frame, and pellet cracks caused by copper can be prevented.

また、この実施例ではスポットウェルド装置を用いない
ことから、スポットウェルド電極の摩耗や、カッターの
摩耗等による装置の故障の発生は少なくなり、ペレット
ボンダの稼動率が向上する。Furthermore, since this embodiment does not use a spot welding device, the occurrence of device failures due to spot weld electrode wear, cutter wear, etc. is reduced, and the operating rate of the pellet bonder is improved.

さらに、この実施例では２本の微小金線を用いることか
ら、０．６１Ｗロ以上のペレットの取り付けも可能とな
る。Furthermore, since two fine gold wires are used in this embodiment, it is also possible to attach pellets of 0.61 W or more.

なお、本発明は前記実施例に＠足されない。すなわち、
ボンディングツールにはさらに多くの金線を案内するガ
イド孔を設けてもよい。また、１本の金線を接続するボ
ンディングツールで必賛回数ポンディングして、所望本
数の微小金線の接続を行なってもよい。また、１本の金
線を通すボンディングツールを所望本数用いて、四時に
所望本数の微小金線の接続を行なってもよい。Note that the present invention is not added to the above embodiments. That is,
The bonding tool may be provided with guide holes for guiding more gold wires. Alternatively, a desired number of fine gold wires may be connected by bonding the same number of times using a bonding tool that connects one gold wire. Alternatively, a desired number of bonding tools for passing one gold wire may be used to connect a desired number of fine gold wires at the same time.

さらｋ、金線の接続は熱圧着でなく超音波圧着あるいは
超音波熱圧着でもよい。Furthermore, the gold wire may be connected by ultrasonic compression bonding or ultrasonic thermocompression bonding instead of thermocompression bonding.

以上のように、本発明によれは、大型のペレットを少量
の金で確実にかつ迅速に固定することができる。As described above, according to the present invention, large pellets can be fixed reliably and quickly with a small amount of gold.

【図面の簡単な説明】[Brief explanation of drawings]

ＩＪｇ１図および第２図は従来のペレットボンディング
状態を示す平面図、 第３図および第４図は同じく金箔あるいは微小金線の取
付製蓋の斜視図、 第５図乃至第８図（ａｔ〜ｔｅｌは本発明の一実施例に
よるペレット取付方法を示す図であって、９５図はペレ
ット取付状聾を示す平面図、 第６図は金線取付機の斜視図、 第７図（ａｔ、　（ｂｌは金線付は用のボンディングツ
ールを示す正面図および断面図、 第８図（ａｌ〜（ｅｌは金線取付動作を示す説明図であ
る。 １・・・リードフレーム、２・・・金箔、３・・・微小
金線、４・・・ペレット、７・・・金箔供給チャック、
８・・・スポットウェルド装置、１１・・・カッター、
１３・・・金線スプール、１４・・・金線、１６・φ・
ボンディングツール、１７・・・ガイド孔、１８・・・
ワイヤクランパ。 代理人　弁理士　　薄　１）利　ｉケ。 １１　　　図　　　　　　　　　第　　２　　間第　　
３　　図 第　　４　　図 第　　６　　図　　　　　　　　　　第　　７　　図べ ｒｔＬ）　　　　　　　　　　　　　　　（１）　　　
　　　　　　（ｃ　７（乙）　　／４　　　　　（ｅ）Figures IJg1 and 2 are plan views showing the conventional pellet bonding state, Figures 3 and 4 are perspective views of the lid made of gold foil or fine gold wire, and Figures 5 to 8 (at to tel. 95 is a plan view showing a pellet attachment method according to an embodiment of the present invention, FIG. 6 is a perspective view of a wire attachment machine, and FIG. 7 (at, (bl) 8 is a front view and a cross-sectional view showing a bonding tool with gold wire, and FIG. 8 is an explanatory diagram showing the gold wire attachment operation. 3... Fine gold wire, 4... Pellet, 7... Gold foil supply chuck,
8... spot welding device, 11... cutter,
13...Gold wire spool, 14...Gold wire, 16・φ・
Bonding tool, 17... Guide hole, 18...
wire clamper. Agent Patent Attorney Susuki 1) Li ike. 11 Figure 2nd room
(1) (1)
(c 7 (Otsu) /4 (e)

Claims (1)

【特許請求の範囲】[Claims] １、基板に微小金線を溶接した後、この微小金線を利用
してベレットを基板に熱圧着するベレット取付方法にお
いて、前記基板のベレット取付領域！ＩＣ微小金線を複
数本１！１接した後、ベレットを取り付けることを特徴
とするペレット取付方法。1. In a bullet mounting method in which a fine gold wire is welded to a board and then the bullet is thermocompression bonded to the board using this fine gold wire, the bullet mounting area of the board! A pellet attachment method characterized by attaching a pellet after a plurality of IC fine gold wires are brought into contact one by one.
JP57079985A 1982-05-14 1982-05-14 Fitting method for pellet Pending JPS58197832A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57079985A JPS58197832A (en) 1982-05-14 1982-05-14 Fitting method for pellet

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57079985A JPS58197832A (en) 1982-05-14 1982-05-14 Fitting method for pellet

Publications (1)

Publication Number Publication Date
JPS58197832A true JPS58197832A (en) 1983-11-17

Family

ID=13705602

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57079985A Pending JPS58197832A (en) 1982-05-14 1982-05-14 Fitting method for pellet

Country Status (1)

Country Link
JP (1) JPS58197832A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01270324A (en) * 1988-04-22 1989-10-27 Mitsubishi Electric Corp Fixation of semiconductor chip

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01270324A (en) * 1988-04-22 1989-10-27 Mitsubishi Electric Corp Fixation of semiconductor chip

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