JPS58202995A - Brazing alloy of low karat gold having golden color - Google Patents
Brazing alloy of low karat gold having golden colorInfo
- Publication number
- JPS58202995A JPS58202995A JP8681782A JP8681782A JPS58202995A JP S58202995 A JPS58202995 A JP S58202995A JP 8681782 A JP8681782 A JP 8681782A JP 8681782 A JP8681782 A JP 8681782A JP S58202995 A JPS58202995 A JP S58202995A
- Authority
- JP
- Japan
- Prior art keywords
- alloy
- gold
- low
- brazing
- golden color
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550°C
- B23K35/3013—Au as the principal constituent
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Adornments (AREA)
Abstract
Description
【発明の詳細な説明】
本発明は低カラツト金ろう合金に関し、詳細には、金含
有量が少ないにもかかわらず高ガラット金ろう合金と同
程度の黄金色を呈し、且つ銀ろう並みの低い融点を有す
る低カラット金ろう合金に関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a low karat gold solder alloy, and more particularly, the present invention relates to a low karat gold solder alloy, which exhibits a golden color similar to that of a high karat gold solder alloy despite having a low gold content, and a low gold color comparable to that of silver solder. It relates to a low carat gold solder alloy having a melting point.
通常の金ろう合金は、金−銀一鋼一亜鉛をベース合金と
し、これにインジウム、錫、ガU17A、カドミウム等
を適量配合することに二って融点を下げると共に流ろう
性の向上を図り、あるいはろう付強度や機械的明度の改
善を図っている。この檜の金ろう合金のうち歯科用や装
飾用等として汎用されているのは、例えば特開昭52−
139620号公報や向55−103298号公報に示
されている様に、金含有率が584(直lt憾:以下同
じ)程度の14カラツト金ろう合金であり、これらは優
れ之ろう付性岨を示すと共に美麗な黄金色を呈しておシ
且つ耐食性も良好であるので、前述の様な用途に極めて
適したものと言える。しかしながら金の価格は最近ます
です高騰する煩同にあるので、この様な世情に対処する
為金含有率を少なくした低カラツト金ろう合金に関する
研究も盛んに」められており、例えば特開昭58−29
225号公報に見られる様に、金含有率を大幅に低減す
ると共に銀含有率を普めた銀ろう合金等も提供されてい
る。ところが銀ろう合金はもとよシ、金含有率を30〜
45チ程度に抑えた低カラット金ろう合金では、合金元
素の檀頬や配合率等を調整することに二りろう付性等は
改善されるが、金傍位特有の賃金色が減退すると共に耐
食性が低下するという致命的な欠点があり、貴金属ろう
材とじての部品価値が者しく損なわれる。しかも公知の
低カラット金ろう合金の融点は一般に720〜800℃
を程度と比較的高いので、ろう付性目体の向上も要求さ
れている。Ordinary gold solder alloys have a base alloy of gold, silver, steel, and zinc, and incorporate appropriate amounts of indium, tin, Ga U17A, cadmium, etc. to lower the melting point and improve flowability. , or to improve brazing strength and mechanical brightness. Among these cypress gold solder alloys, those commonly used for dental and decorative purposes are, for example,
As shown in Publication No. 139620 and Publication No. 55-103298, it is a 14-karat gold brazing alloy with a gold content of about 584 (the same shall apply hereinafter), and these have excellent brazing properties. It has a beautiful golden color and good corrosion resistance, so it can be said to be extremely suitable for the above-mentioned uses. However, the price of gold has been increasing rapidly recently, and in order to cope with the current situation, research into low-karat gold solder alloys with a reduced gold content is being actively pursued. 58-29
As seen in Japanese Patent No. 225, silver solder alloys and the like have been provided in which the gold content is significantly reduced and the silver content is increased. However, silver solder alloys have a gold content of 30~
In low carat gold solder alloys, which are kept to about 45 mm, brazing properties can be improved by adjusting the alloy elements and their blending ratio, but the characteristic characteristic of gold alloys is diminished and the It has the fatal disadvantage of reduced corrosion resistance, and the value of the component as a noble metal brazing filler metal is seriously impaired. Moreover, the melting point of known low carat gold solder alloys is generally 720 to 800°C.
Since the degree of brazing is relatively high, improvement in brazing properties is also required.
本発明者等はこうした事情に着目し、低カラット金ろう
合金であシながら優れた強度を有すると共に、14方ラ
ツト金ろう合金に匹敵する黄金色と1酎食性を有し、且
つ低融点でろう付性の良好な金ろう合金を開発し二うと
じて鋭意研究を進めてきた。本発明はかかる研究の結果
完成されたものであって、その構成は、金:30〜40
1、銀:25〜40q&、インジヴム=5〜15儂、銅
:15〜25傷及び亜鉛:1〜15壬よりなり、融点を
約700’C以下としてなるところに要旨が存在する。The inventors of the present invention have focused on these circumstances, and have developed a low-carat gold solder alloy that has excellent strength, has a golden color comparable to a 14-way rat gold solder alloy, has a hardness to eat, and has a low melting point. Since then, we have been conducting intensive research to develop a gold brazing alloy with good brazing properties. The present invention was completed as a result of such research, and its composition is as follows:
1. Silver: 25 to 40 q&, indium = 5 to 15 ml, copper: 15 to 25 scratches, and zinc: 1 to 15 ml, and the gist is that the melting point is about 700'C or less.
以下本発明において合金元素の種類及び配合系を定めた
埋田?説明する計
金二30〜40係
これは金ろう合金として不可欠の元素であるが、低カラ
ツト化によるコストダウンふいう当初の目的を連取する
為、40%を一応の上畝と定の念。In the following, the types of alloying elements and compounding system are determined in the present invention. The total amount to be explained is 30 to 40. This is an essential element for a gold solder alloy, but in order to maintain the original purpose of reducing costs by reducing carat weight, 40% was set aside as an upper layer.
−万下限は14カラット労ろう合金に匹敵する黄金色と
1尉友性を確保する為に定めたもので、30暢未員では
、後述する様な他の合金成分′5e−適正に調整した場
合でも、l−足し福る′程度の黄金色と11討食性を得
ることができなくなる。- The lower limit of 10,000 was set to ensure a golden color and compatibility comparable to 14 carat alloy, and for 30 carats, other alloy components as described below were adjusted appropriately. Even in this case, you will not be able to obtain the golden color and the 11 degradability of l-plus '.
m:25〜40%
銀は、金合金の場合、銅と並び非常に良く合金化する元
素であるが、組成範囲を限定したのは、金及び池のイン
ジヴム、銅、亜at−最小必要量添加構成された場合の
銀の有9111に範囲であり、金合金の低カラツト化に
必要な元素である。m: 25-40% Silver is an element that alloys very well with copper in the case of gold alloys, but the composition range was limited by the minimum required amount of gold and Ike's indium, copper, and zinc. When added, the content of silver is in the range of 9111, and is an element necessary for reducing the karat of gold alloys.
インジケム=5〜15幅
本発明において最も重要な合金元素であって、金含有″
4が低くとも安定した黄金色を発揮させると共に、融点
を低下させてろう付性を改善するのに不可欠の元素でめ
シ、これらの効果を有効に発 □□−エゆ5−
よオヨう、ヶゆゎイヶ、ヶ 1い。しかも多すぎると
合金が脆弱になるので15係以下に抑える必要がある。Indichem = 5 to 15 width The most important alloying element in the present invention, containing gold
It is an essential element that exhibits a stable golden color even when the number 4 is low, lowers the melting point, and improves brazing properties, and effectively produces these effects.
Yooyo, gayuwaiiga, ga 1i. Moreover, if it is too large, the alloy becomes brittle, so it is necessary to keep it below 15%.
銅: 15〜25憾
合金の強度向上元素として極めて重要な元素であると共
に、流ろう性を而める作用があシ、目的4成の為には1
5慢以上含有させなければならない。しかし25嗟を越
えると融点が扁(なると共に4食性が乏しくなシ、短期
間のうちに黄金色を喪失する。Copper: It is an extremely important element to improve the strength of 15-25 alloys, and also has the effect of reducing the flowability.
Must contain 5 or more. However, if the temperature exceeds 25 minutes, the melting point becomes flat, the food becomes less palatable, and it loses its golden color in a short period of time.
亜鉛:l〜15幡 脱酸効果と署しい融点降下作用を有しておや。Zinc: 1~15 meters It has a deoxidizing effect and a significant melting point lowering effect.
殊に本発明では後者の作用に期待するところが大きく、
他の合金元素の含有率にも二るが、約700℃程度以下
の融点を得る為には1幅以上含有させなければならない
。しかし15慢を越えると合金が者しく脆化する。In particular, the present invention has great expectations for the latter effect,
The content of other alloying elements also depends on the content, but in order to obtain a melting point of approximately 700°C or less, it is necessary to contain at least one range. However, when the temperature exceeds 15%, the alloy becomes noticeably brittle.
本発明に係る金ろう合金の個々の構成元素の含有率は上
記の通りであるが、これら構成元素の作用効果は、夫々
の含有率のみで規定することは必ずしも適当ではないの
で、実際の調合に当ってはすべての構成元素の相互作用
も考慮しながら、前記各好適含有率の中から最適のi[
を選択して決定すべきである。Although the contents of the individual constituent elements of the gold solder alloy according to the present invention are as described above, it is not necessarily appropriate to define the effects of these constituent elements only by their respective contents, so it may be difficult to determine the actual formulation. When considering the interaction of all the constituent elements, the optimum i[
should be selected and decided.
次に本発明の構成及び作用効果をm−明確にする為、公
知の金ろう合金と対比しなから相違点全説明する。Next, in order to clarify the structure, function, and effect of the present invention, all differences will be explained by comparing it with a known gold solder alloy.
第1表は、公知の余ろう合金及び不発明の金ろう合金の
放任組成、浴融1a度並びに色調を示したものである。Table 1 shows the free composition, bath melting temperature 1a degree, and color tone of the known surplus solder alloy and the uninvented gold solder alloy.
合金41:こり金ろう合斂は、14カラツ)&ろう合金
の金の一部′!!−Pdで置換すると共に、Agに代え
てNiを配合したMItF!5Lとなって込るが、14
カラツト金ろう合金特有の黄金色が弱く、また溶融温度
が1000℃程度と高い為ろう付性が悪い。Alloy 41: Gold alloy is 14 karats) & part of the gold in the brazing alloy'! ! - MItF with Pd substitution and Ni added instead of Ag! It will be 5L, but 14
The golden color characteristic of karat gold brazing alloy is weak, and the melting temperature is as high as about 1000°C, so brazing properties are poor.
何れKしてもこの合金は中カラット金ろう合金に分類さ
れるもので金含有率が高く、本発明の低カラット金ろう
合金とは区別さるべきものである。Regardless of the K, this alloy is classified as a medium-karat gold solder alloy, has a high gold content, and should be distinguished from the low-karat gold solder alloy of the present invention.
合金42.8ニ一般の14fjyツト金ろう合金であり
、溶融温度が比較的低く且つ黄金色を呈しているが、こ
れは金含有峯プ高いことに二る当然の性能である。尚合
金42では合金元素として少量のinが含まれているが
、これは主KfiItろう性。Alloy 42.8 is a general 14fjy gold solder alloy, and has a relatively low melting temperature and a golden color, which is a natural result of its high gold content. Alloy 42 contains a small amount of in as an alloying element, but this is mainly KfiIt waxy.
溶融点を調整する目的で配合されたものであり、もとも
と黄金色を呈するものであるから少なくとも黄金色の低
下抑制という8M能は全く期待しておらず、またその様
な機能自体は本合金の場合−切J込要でない。It is blended for the purpose of adjusting the melting point, and since it is originally golden in color, we do not expect the 8M ability to suppress the decline in golden color at all, and such a function itself is not expected of this alloy. Case - No cutting required.
合4!!!ム4:金言萼率を抑え銀含有量を大幅に高め
た。張ろう合金に属するものであり、¥価ではあるが蛍
特育の貫斂色が傳られず、外観、性能共に商品1IiI
iaは低い。また本例でも合金元素として9竃のInが
含まれているが、これによって黄金色を与えるという機
能は期待し慢べくもない。Match 4! ! ! Mu4: The golden calyx rate was suppressed and the silver content was significantly increased. It is a type of brazing alloy, and although it is priced at ¥, it does not have the piercing color of Hotaru Tokuiku, and is a product of 1IiI in terms of appearance and performance.
ia is low. In this example as well, 9 pieces of In are included as an alloying element, but I cannot be proud of the fact that I expected it to have the function of imparting a golden color.
合金ム5,6,7:何れも台金1r藁が本発明のものと
同程度の低カラット余ろう合金であり、溶HA tm度
が比較的低くろう付性も良好であるが、黄金色を有して
いないので商品価値は低い。Alloys 5, 6, and 7: The base metal 1r straw is a low-carat surplus brazing alloy similar to that of the present invention, and the molten HA tm degree is relatively low and the brazeability is good, but the gold color The product value is low because it does not have
合金48:14方ラツト金ろう合金に匹敵する量の金が
含まれているにもかかわらず黄金色を呈しておらず、外
観上の商品価値は低い。この例より金倉f藁が高い場合
でも、他の合金元素の種類や含有率に二つでは、黄金色
が傳られtぐなることが分かる。Alloy 48: Although it contains an amount of gold comparable to that of a 14-way rat gold solder alloy, it does not have a golden color and its commercial value in terms of appearance is low. From this example, it can be seen that even if the Kanakura f.
合金/I69,10:何れも本発明の要件を満足する低
カラット金ろう合金であシ、金含有率が極めて低いにも
かかわらず14力ラツト品なみの黄金色を呈しており、
また溶崗編度も700 ’C以下の低い値を示している
。同この賽施例合金については、史に後述する様な変色
試験及びろう付試験を行なったところ、何れも啄めて艮
好な結果が得られた。Alloy / I69, 10: Both are low carat gold solder alloys that satisfy the requirements of the present invention, and despite having an extremely low gold content, they exhibit a golden color similar to that of 14-karat gold products.
Furthermore, the granite braiding degree also shows a low value of 700'C or less. When this sample alloy was subjected to a discoloration test and a brazing test as described later in the history, excellent results were obtained in both cases.
各酋ろう合金を、0.1係の硫化ナトリウム水溶液中に
37℃で72時間浸漬し、表面の変色の有無をfiべた
’とcろ(JIS−T6107 )、何れも変色は認め
られなかった。この実験結果から、本発明の合金が耐食
性においても優れたものであることが立証される。Each wax alloy was immersed in a 0.1% aqueous sodium sulfide solution at 37°C for 72 hours, and the presence or absence of surface discoloration was examined (JIS-T6107), and no discoloration was observed. . This experimental result proves that the alloy of the present invention is also excellent in corrosion resistance.
母材として0.3■厚の歯科用ニッケルークロム合金板
(JIS−76101)を用b1各金ろう合金によりJ
IS−T6107に準拠してろう付けを行なった後引張
試験を行なった。その結果、ろう件部の剥離は全(gめ
られず何れも母材部で破断しておシ、力強強度はすべて
5゜kg f、−ヨ上、示家。1″:1:。。2験、果
より、4発明の金ろう合金がろう付性及び機械的強度の
いずれにおいても・4れたものであることが■証される
。J
After brazing in accordance with IS-T6107, a tensile test was conducted. As a result, there was no peeling of the solder parts, all of them broke at the base metal part, and the mechanical strength was 5°kg f, -Y, 1":1:. The results of the two experiments prove that the gold brazing alloy of the fourth invention is superior in both brazing properties and mechanical strength.
本発明は概略以上の様にa成されており、金と共に配合
される合金元素の種類及び含葺藁を厳密に規定すること
によって、低カラット金ろう合金であるにもかかわらず
従来の14カラツト金ろう合金に匹敵する外観(黄金色
)や耐食性及び機械的強度を有すると共に、溶S温度が
低ぐろう付性の優れた金ろう合金を提供し得ることKな
った。The present invention has been roughly constructed as described above, and by strictly specifying the types of alloying elements mixed with gold and the content of thatch, even though it is a low carat gold brazing alloy, It has become possible to provide a gold solder alloy that has an appearance (golden color), corrosion resistance, and mechanical strength comparable to gold solder alloys, has a low melting temperature, and has excellent brazing properties.
従って金合金を使用した各種装研品のろう付けや穴埋め
等に要する材料費を大幅に低減することができる。、ま
た本発明合金における最も特徴的合金元素はインジウム
であるがこれは人体に無害であり、従来のカドミケ・ム
含有金合金の様に有害元素が含まれていないので、歯科
用の金ろう合金としても極めて有用である。Therefore, the cost of materials required for brazing, hole filling, etc. of various polished products using gold alloy can be significantly reduced. In addition, the most characteristic alloying element in the alloy of the present invention is indium, which is harmless to the human body and does not contain harmful elements like conventional gold alloys containing cadmium, so it is suitable for dental use. It is also extremely useful.
出−人 三金工業抹式会社Source: Sankin Kogyo Mashiki Company
Claims (1)
〜40傷、インジウム:5〜15優、銅二15〜25俤
及び亜鉛:1〜15俸よシなシ、重点が約700℃以下
であることを特徴とする、黄金色を呈する低カラツト金
ろう合金。ill gold: 30-40 (same for weight 11 and below), silver = 25
~ 40 scratches, indium: 5-15 yen, copper 2 15-25 yen, zinc: 1-15 yen si, low karat gold with a golden color, characterized by a temperature of about 700°C or less. Brazing alloy.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8681782A JPS58202995A (en) | 1982-05-21 | 1982-05-21 | Brazing alloy of low karat gold having golden color |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8681782A JPS58202995A (en) | 1982-05-21 | 1982-05-21 | Brazing alloy of low karat gold having golden color |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS58202995A true JPS58202995A (en) | 1983-11-26 |
Family
ID=13897353
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8681782A Pending JPS58202995A (en) | 1982-05-21 | 1982-05-21 | Brazing alloy of low karat gold having golden color |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58202995A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6457996A (en) * | 1987-08-29 | 1989-03-06 | Tokuriki Honten Kk | Gold alloy filler metal |
| JPS6457997A (en) * | 1987-08-29 | 1989-03-06 | Tokuriki Honten Kk | Gold alloy filler metal |
| NL9401960A (en) * | 1994-11-23 | 1996-07-01 | Schoene Edelmetaal B V | Cadmium-free solder alloys for soldering jewellery |
-
1982
- 1982-05-21 JP JP8681782A patent/JPS58202995A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6457996A (en) * | 1987-08-29 | 1989-03-06 | Tokuriki Honten Kk | Gold alloy filler metal |
| JPS6457997A (en) * | 1987-08-29 | 1989-03-06 | Tokuriki Honten Kk | Gold alloy filler metal |
| NL9401960A (en) * | 1994-11-23 | 1996-07-01 | Schoene Edelmetaal B V | Cadmium-free solder alloys for soldering jewellery |
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