JPS5820559U - Electronic components for mounting - Google Patents
Electronic components for mountingInfo
- Publication number
- JPS5820559U JPS5820559U JP11545681U JP11545681U JPS5820559U JP S5820559 U JPS5820559 U JP S5820559U JP 11545681 U JP11545681 U JP 11545681U JP 11545681 U JP11545681 U JP 11545681U JP S5820559 U JPS5820559 U JP S5820559U
- Authority
- JP
- Japan
- Prior art keywords
- mounting
- electronic components
- recurable
- resin
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Details Of Resistors (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図は従来の実装工程を示すプリント配線板の斜視図
、第2図は電子部品の載置状態の斜視図、第3図は実装
過程を示す断面図、第4図はモールド状態の断面図、第
5図ははんだ付は後の電子部品の裏面の状態を示す斜視
図、第6図はこの考案の二実施例における電子部品の載
置状態の断面図、第7図は接着状態の断面図、第8図は
電子部品の裏側を示す斜視図である。
12・・・部品本体、14・・・載置面、16・・・再
硬化性樹脂。Fig. 1 is a perspective view of a printed wiring board showing the conventional mounting process, Fig. 2 is a perspective view of electronic components mounted, Fig. 3 is a cross-sectional view showing the mounting process, and Fig. 4 is a cross-section of the molded state. Figure 5 is a perspective view showing the state of the back side of the electronic component after soldering, Figure 6 is a sectional view of the electronic component placed in the second embodiment of this invention, and Figure 7 is the adhesive state. The sectional view and FIG. 8 are perspective views showing the back side of the electronic component. 12... Component body, 14... Placement surface, 16... Recurable resin.
Claims (2)
置面に埋設されて加熱によりプリント基板に接着させる
再硬化性樹脂とを備えた実装用電子部品。(1) An electronic component for mounting comprising a component body and a recurable resin that is embedded in the printed circuit board mounting surface of the component body and is bonded to the printed circuit board by heating.
切るように埋設されている実用新案登録請求の範囲第(
1)項記載の実装用電子部品。−(2) The recurable resin is buried so as to partition the leads of the main station part body.
Electronic components for mounting as described in section 1). −
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11545681U JPS5820559U (en) | 1981-07-31 | 1981-07-31 | Electronic components for mounting |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11545681U JPS5820559U (en) | 1981-07-31 | 1981-07-31 | Electronic components for mounting |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5820559U true JPS5820559U (en) | 1983-02-08 |
Family
ID=29909715
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11545681U Pending JPS5820559U (en) | 1981-07-31 | 1981-07-31 | Electronic components for mounting |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5820559U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6020110U (en) * | 1983-07-18 | 1985-02-12 | ロ−ム株式会社 | chip resistor |
-
1981
- 1981-07-31 JP JP11545681U patent/JPS5820559U/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6020110U (en) * | 1983-07-18 | 1985-02-12 | ロ−ム株式会社 | chip resistor |
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