JPS5821990U - Socket for semiconductor devices - Google Patents

Socket for semiconductor devices

Info

Publication number
JPS5821990U
JPS5821990U JP11694181U JP11694181U JPS5821990U JP S5821990 U JPS5821990 U JP S5821990U JP 11694181 U JP11694181 U JP 11694181U JP 11694181 U JP11694181 U JP 11694181U JP S5821990 U JPS5821990 U JP S5821990U
Authority
JP
Japan
Prior art keywords
socket
semiconductor devices
external lead
semiconductor element
contacts
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11694181U
Other languages
Japanese (ja)
Inventor
長廻 勇
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP11694181U priority Critical patent/JPS5821990U/en
Publication of JPS5821990U publication Critical patent/JPS5821990U/en
Pending legal-status Critical Current

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Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は従来の半導体素子用ソケット、第2図は本考案
の一実施例によるソケットの構造図、第3図は本考案の
他の実施例でa、  bは夫々その上面図と側面図、第
4図は更に他の実施例の取り付は構造図である。 1・・・・・・下型、2・・・・・・金属板、3・・・
・・・上型、4゜4′・・・・・・押え部、5・・・・
・・バネ、6・・・・・・端子、7・・・・・・凹部、
8・・・・・・網状導体、10・・・・・・ストリップ
基板、11・・・・・・網状導体、12・・・・・・素
子、13・・・・・・蓋、14・・・・・・ピン。
Fig. 1 is a conventional socket for semiconductor devices, Fig. 2 is a structural diagram of a socket according to an embodiment of the present invention, Fig. 3 is another embodiment of the present invention, and a and b are respectively a top view and a side view thereof. , FIG. 4 is a structural diagram showing the installation of still another embodiment. 1...Lower mold, 2...Metal plate, 3...
...Upper die, 4゜4'...Press section, 5...
...Spring, 6...Terminal, 7...Recess,
8...Mesh conductor, 10...Strip board, 11...Mesh conductor, 12...Element, 13...Lid, 14... ·····pin.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 半導体素子の外部リードと接触する部分を有し前記半導
体素子を固定するソケットにおいて、前記接触する部分
は前記外部リードに対して複数の線もしくは点接触する
ように構成されていることを特徴とする半導体素子用ソ
ケット。
A socket for fixing the semiconductor element that has a part that contacts an external lead of a semiconductor element, characterized in that the contact part is configured to make a plurality of line or point contacts with the external lead. Socket for semiconductor devices.
JP11694181U 1981-08-05 1981-08-05 Socket for semiconductor devices Pending JPS5821990U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11694181U JPS5821990U (en) 1981-08-05 1981-08-05 Socket for semiconductor devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11694181U JPS5821990U (en) 1981-08-05 1981-08-05 Socket for semiconductor devices

Publications (1)

Publication Number Publication Date
JPS5821990U true JPS5821990U (en) 1983-02-10

Family

ID=29911149

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11694181U Pending JPS5821990U (en) 1981-08-05 1981-08-05 Socket for semiconductor devices

Country Status (1)

Country Link
JP (1) JPS5821990U (en)

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