JPS58220492A - 複合回路装置 - Google Patents

複合回路装置

Info

Publication number
JPS58220492A
JPS58220492A JP57104206A JP10420682A JPS58220492A JP S58220492 A JPS58220492 A JP S58220492A JP 57104206 A JP57104206 A JP 57104206A JP 10420682 A JP10420682 A JP 10420682A JP S58220492 A JPS58220492 A JP S58220492A
Authority
JP
Japan
Prior art keywords
composite
substrate
circuit device
board
terminal electrodes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57104206A
Other languages
English (en)
Japanese (ja)
Other versions
JPH035677B2 (2
Inventor
野中　和志
涼 木村
口羽　健介
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP57104206A priority Critical patent/JPS58220492A/ja
Publication of JPS58220492A publication Critical patent/JPS58220492A/ja
Publication of JPH035677B2 publication Critical patent/JPH035677B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Parts Printed On Printed Circuit Boards (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Combinations Of Printed Boards (AREA)
JP57104206A 1982-06-16 1982-06-16 複合回路装置 Granted JPS58220492A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57104206A JPS58220492A (ja) 1982-06-16 1982-06-16 複合回路装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57104206A JPS58220492A (ja) 1982-06-16 1982-06-16 複合回路装置

Publications (2)

Publication Number Publication Date
JPS58220492A true JPS58220492A (ja) 1983-12-22
JPH035677B2 JPH035677B2 (2) 1991-01-28

Family

ID=14374494

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57104206A Granted JPS58220492A (ja) 1982-06-16 1982-06-16 複合回路装置

Country Status (1)

Country Link
JP (1) JPS58220492A (2)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09123449A (ja) * 1995-07-26 1997-05-13 Seiko Epson Corp インクジェット式記録ヘッド
JP2004087959A (ja) * 2002-08-28 2004-03-18 Fujitsu Ltd 複合キャパシタ
JP2016171184A (ja) * 2015-03-12 2016-09-23 株式会社村田製作所 複合電子部品および抵抗素子
JP2018041929A (ja) * 2016-09-09 2018-03-15 株式会社村田製作所 複合電子部品および抵抗素子
JP2018041931A (ja) * 2016-09-09 2018-03-15 株式会社村田製作所 複合電子部品
JP2018041930A (ja) * 2016-09-09 2018-03-15 株式会社村田製作所 複合電子部品および抵抗素子
JP2020004950A (ja) * 2018-06-29 2020-01-09 サムソン エレクトロ−メカニックス カンパニーリミテッド． 積層型電子部品及びその実装基板

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09123449A (ja) * 1995-07-26 1997-05-13 Seiko Epson Corp インクジェット式記録ヘッド
JP2004087959A (ja) * 2002-08-28 2004-03-18 Fujitsu Ltd 複合キャパシタ
JP2016171184A (ja) * 2015-03-12 2016-09-23 株式会社村田製作所 複合電子部品および抵抗素子
JP2018041929A (ja) * 2016-09-09 2018-03-15 株式会社村田製作所 複合電子部品および抵抗素子
JP2018041931A (ja) * 2016-09-09 2018-03-15 株式会社村田製作所 複合電子部品
JP2018041930A (ja) * 2016-09-09 2018-03-15 株式会社村田製作所 複合電子部品および抵抗素子
JP2020004950A (ja) * 2018-06-29 2020-01-09 サムソン エレクトロ−メカニックス カンパニーリミテッド． 積層型電子部品及びその実装基板
US10910163B2 (en) 2018-06-29 2021-02-02 Samsung Electro-Mechanics Co., Ltd. Multilayer electronic component and board having the same mounted thereon

Also Published As

Publication number Publication date
JPH035677B2 (2) 1991-01-28

Similar Documents

Publication Publication Date Title
KR930010076B1 (ko) 다층혼성집적회로
US20030161090A1 (en) Ceramic chip capacitor of conventional volume and external form having increased capacitance from use of closely spaced interior conductive planes reliably connecting to positionally tolerant exterior pads through multiple redundant vias
CA1037615A (en) Functional package for complex electronic systems and method of fabrication
JPH0234184B2 (2)
JP2001085592A (ja) 半導体装置及びその製造方法、回路基板並びに電子機器
JPH113969A (ja) チップ部品が積層された基板部品
JP3201681B2 (ja) 表面実装型混成集積回路装置
US9728507B2 (en) Cap chip and reroute layer for stacked microelectronic module
US5740010A (en) Printing and adhering patterned metal on laid-up multi-layer green wafer before firing so as to later form precise integral co-fired conductive traces and pads on top and bottom surfaces of monolithic, buried-substrate, capacitors
JPS58220492A (ja) 複合回路装置
JP2003204242A (ja) Ｓａｗフィルタモジュール
US6011684A (en) Monolithic integrated multiple electronic components internally interconnected and externally connected by conductive side castellations to the monolith that are of varying width particularly monolithic multiple capacitors
US8324727B2 (en) Low profile discrete electronic components and applications of same
JPH08191186A (ja) 多層配線基板
JPS5994856A (ja) 複合回路装置とその実装方法
JP2946261B2 (ja) 積層電子部品の製造方法
JPH02164096A (ja) 多層電子回路基板とその製造方法
JPS56129348A (en) Semiconductor device
JPS59197120A (ja) 微小フイルムコンデンサ
JPH06216492A (ja) 電子装置
JP2002359343A (ja) 半導体装置
JPH01500866A (ja) 多層構造中に埋設された受動部品のトリミング
JPH0735389Y2 (ja) 半導体装置
JP2671527B2 (ja) マイクロ波回路モジュール
JPS62101064A (ja) 高密度集積回路装置