JPS5828101A - Composition for semiconductor electric layer of power cable - Google Patents
Composition for semiconductor electric layer of power cableInfo
- Publication number
- JPS5828101A JPS5828101A JP12632081A JP12632081A JPS5828101A JP S5828101 A JPS5828101 A JP S5828101A JP 12632081 A JP12632081 A JP 12632081A JP 12632081 A JP12632081 A JP 12632081A JP S5828101 A JPS5828101 A JP S5828101A
- Authority
- JP
- Japan
- Prior art keywords
- weight
- composition
- parts
- power cable
- electric layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
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- Conductive Materials (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
本発明はプム、fラスチック電カケープル用外部半導電
層形成組成物の改良に関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an improvement in a composition for forming an outer semiconducting layer for a plastic electrical cable.
従来高電圧架橋ポリエチレン絶縁電カケ−プル(以下C
vケーブルという)における外部半導電層としては電気
特性並に安定性に優れしかも水トリー現象を発生しない
という観点から導電性/ IJエチレン混和物を押出被
覆して形成することか広〈実施されている。然しなから
近時、中、低圧Cvケーブルにおいては外部導電層とし
て、上記の特性を必要とするのみでなく、そのほかに接
続作業並に端末作業を容易に行いうろことが要求されて
いる。即ち常時においては絶縁体層とよく密着し且つ接
着しているが、接続作業や端末作業を必要とする場合K
Fi、逆に絶縁体層から容易に剥取ル除去できるいわゆ
るフリーストリッビンダ性の導電層であることが必須条
件となっているものである。Conventional high voltage cross-linked polyethylene insulated cable (hereinafter referred to as C
As an external semiconducting layer in a V-cable, it has been widely proposed to extrude and coat a conductive/IJ ethylene mixture from the viewpoint of excellent electrical properties and stability and not causing water tree phenomenon. There is. Recently, however, in medium and low voltage Cv cables, the outer conductive layer not only requires the above-mentioned characteristics, but also is required to facilitate connection work and terminal work. In other words, it adheres well and adheres to the insulating layer at all times, but when connection work or terminal work is required, K
In contrast, it is essential that the conductive layer be a so-called free strip binder conductive layer that can be easily peeled off from the insulating layer.
而して仁のフリースドリッピング型押出導電層としては
通常塩化ビニル、塩素化ぼりエチレン。The fleece dripping type extruded conductive layer is usually made of vinyl chloride or chlorinated ethylene.
エチレン−酢酸ビニル−塩化ビニルターfリマー岬の如
きハロダン系極性基を有するIリマ−を基体とする半導
電性混和物が使用されている。Semiconducting mixtures based on I-rimers having halodane polar groups such as ethylene-vinyl acetate-vinyl chloride tar F-rimers have been used.
然しなからこれらの半導電性混和物は剥取性について4
優れているが、押出加工性差に耐熱′性に劣るという欠
点を有している。即ち遅蒔架橋方式として水蒸気架橋方
式に代えてN2ガスなど不活性なガスを用いる乾式架橋
方式〜が採用されているものであるが、この方式は水蒸
気架橋方式に比して架橋温度を高温度において実施して
いるものである。従って乾式架橋方式によりケーブルを
製造するに際し、上記混和物の一部が熱分解し、ケーブ
ルの外観を阻害し且つ特性をも低下せしめるものであっ
たユ
本発明はかかる現状に鑑み鋭意研究を行った結果、架I
!ii/リエテレン絶縁電カケ−プル又は架橋EPR絶
縁電カケープルにおいて、フグ−ストリッピング型外部
導電層組成物として剥離性、押出加工性、耐熱性に優れ
たものを見出したものである。即ち本発明はクロロスル
ホン化ポリエチレン20〜80重量襲とエチレン酢酸ビ
ニル共重合体80〜20重1外とからなる混和物100
重量部に導電性カーlンブラック5〜70重量部を均一
に練和したことを%微とするものである。However, these semiconductive admixtures have a peelability of 4.
Although it is excellent, it has the disadvantages of poor extrusion processability and poor heat resistance. That is, as a slow-sowing crosslinking method, a dry crosslinking method using an inert gas such as N2 gas is used in place of the steam crosslinking method, but this method requires a higher crosslinking temperature than the steam crosslinking method. This is what is being carried out at. Therefore, when manufacturing cables using the dry crosslinking method, some of the above-mentioned admixtures thermally decompose, impairing the appearance of the cables and deteriorating their properties.The present invention has been developed by conducting extensive research in view of the current situation. As a result, frame I
! ii/A puffer stripping type outer conductive layer composition has been found that has excellent peelability, extrusion processability, and heat resistance in the Lietelene insulating capeple or crosslinked EPR insulating capeple. That is, the present invention provides a mixture of 100% by weight of chlorosulfonated polyethylene and 80% to 20% by weight of ethylene-vinyl acetate copolymer.
% fine means that 5 to 70 parts by weight of conductive carbon black are uniformly kneaded into parts by weight.
本発明においてクロロスルホン化?リエチレンを20〜
80重量≦に限定した理由は、20重量%未満の組成物
の場合には絶縁体層からの剥取性が劣り、又801ij
1%を越えた組成物の場合には押出加工性が困難となる
ためである。Chlorosulfonation in the present invention? Liethylene 20~
The reason why the composition was limited to 80% by weight is that peelability from the insulating layer is poor when the composition is less than 20% by weight, and 801ij
This is because if the content exceeds 1%, extrusion processability becomes difficult.
又エチレン酢酸ビニル共重合体t−80〜20重1幡に
限定した理由は、80重量%を越えた組成物の場合には
絶縁体層からの剥取性が劣り、又20重量%未満の組成
物の場合(は押出加工性が困難となるためである。Moreover, the reason for limiting the amount of ethylene vinyl acetate copolymer t-80 to 20 weight is that if the composition exceeds 80 weight %, the peelability from the insulating layer is poor, and if the composition exceeds 80 weight %, the peelability from the insulating layer is poor. This is because extrusion processability becomes difficult in the case of compositions.
又導電性カーメンブラックとしては例えはアセチレンブ
ラック、ファーネスブラクク、ケッチェンブラックを使
用するものであり、その添加量を5〜70重1″部に限
定した理由は、5重量部未満の添加では所定の導電度の
ものをうろことが出来ず、又70重量部を越えて添加し
た場合′には得られる組成物の押出加工性を著しく困難
にするためである。Examples of conductive carmen black include acetylene black, furnace black, and ketjen black.The reason why the amount added is limited to 5 to 70 parts by weight is that if less than 5 parts by weight is added, This is because it is not possible to obtain a material with a predetermined conductivity, and if more than 70 parts by weight is added, the extrusion processability of the resulting composition becomes extremely difficult.
なお本発明組成物にはその他の添加剤として酸化防止剤
、安定剤、滑剤、充てん剤などを必要に応じて配合して
もよく、特にリサージ、鉛白叫の安定剤の添加は得られ
る組成物の安定性向上の九めに望ましいものである。In addition, other additives such as antioxidants, stabilizers, lubricants, fillers, etc. may be added to the composition of the present invention as necessary, and in particular, the addition of stabilizers such as Lissage and Lead Baikou improves the composition obtained. This is the ninth most desirable thing for improving the stability of things.
次に本発明の実施例について説明する。Next, examples of the present invention will be described.
実施例(1)〜(2)、及び比較例(1)〜(2)第1
表に示す如き組成により本発明組成物及び比較例組成物
全作製し、その緒特性を測定し九結果を第1表に併記し
た。なお部とあるのは何れも重量部°を示す。Examples (1) to (2) and Comparative Examples (1) to (2) 1st
All compositions of the present invention and comparative compositions were prepared according to the compositions shown in the table, and their properties were measured. The results are also listed in Table 1. Note that all parts indicate parts by weight.
第 1 表
1m(1) Aはキヤlット社 パルカンXC−12
(2)Bはアクゾ社 ケッチェンブラックEC(3)酸
化防止剤は4,4′−チれ!X−0−t@ y−ブチに
3メチルフ凰ノールである。Table 1 1m(1) A is Palcan XC-12 manufactured by Catalyst Co., Ltd.
(2) B is Akzo Ketjen Black EC (3) Antioxidant is 4,4'-chire! X-0-t@y-buty is 3-methylphenol.
斯くして得た本発明組成物及び比較例組成物ヲ架橋ポリ
エチレン絶縁電カケ−プルの外部半導電層に適用して3
3 kV架橋ポリエチレン電カケ−プルを作製し、その
緒特性を測定した結果は第2表に示す通りである。The thus obtained compositions of the present invention and comparative compositions were applied to the outer semiconductive layer of a crosslinked polyethylene insulated electrical cable.
A 3 kV crosslinked polyethylene electrical cable was prepared and its mechanical properties were measured. The results are shown in Table 2.
第 2 表
@(1)剥離強度は架橋/’Jエチレン絶縁体層からの
数値である。Table 2 @ (1) Peel strength values are from crosslinked/'J ethylene insulation layer.
第1表及びflcz表より明らかの如く本発明組成物に
よれは溶融粘度が小さく押出加装置が良好であると共に
外部導電層として絶縁体層よシ容易に剥取ることが出来
る。従って亀カケープルにおけるストリッピング型外部
半導電層として極めて有用なものである。As is clear from Table 1 and the flcz table, the composition of the present invention has a low melt viscosity and is suitable for extrusion processing equipment, and can be easily peeled off from the insulating layer as an external conductive layer. Therefore, it is extremely useful as a stripped-type outer semiconducting layer in a turtle caple.
Claims (1)
レン酢酸ビニル共重合体80〜20重量襲とからなる混
和物100重量部に導電性カーぎノブ2225〜フ0重
量部を均一に練和したことを特徴とする電カケープル用
外部半導電層形成組成物。It is characterized by uniformly kneading 2225 to 0 parts by weight of conductive car knob to 100 parts by weight of a mixture consisting of 20 to 80 parts by weight of chlorosulfonated polyethylene and 80 to 20 parts by weight of ethylene vinyl acetate copolymer. An external semiconducting layer forming composition for an electric cable.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12632081A JPS5828101A (en) | 1981-08-12 | 1981-08-12 | Composition for semiconductor electric layer of power cable |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12632081A JPS5828101A (en) | 1981-08-12 | 1981-08-12 | Composition for semiconductor electric layer of power cable |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5828101A true JPS5828101A (en) | 1983-02-19 |
Family
ID=14932262
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12632081A Pending JPS5828101A (en) | 1981-08-12 | 1981-08-12 | Composition for semiconductor electric layer of power cable |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5828101A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63297025A (en) * | 1987-05-29 | 1988-12-05 | Toppan Printing Co Ltd | Method and apparatus for rotary hollow molding |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5425630A (en) * | 1977-07-29 | 1979-02-26 | Hitachi Ltd | Crt diaplay system |
-
1981
- 1981-08-12 JP JP12632081A patent/JPS5828101A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5425630A (en) * | 1977-07-29 | 1979-02-26 | Hitachi Ltd | Crt diaplay system |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63297025A (en) * | 1987-05-29 | 1988-12-05 | Toppan Printing Co Ltd | Method and apparatus for rotary hollow molding |
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