JPS5831424Y2 - hybrid igniter - Google Patents
hybrid igniterInfo
- Publication number
- JPS5831424Y2 JPS5831424Y2 JP1978183344U JP18334478U JPS5831424Y2 JP S5831424 Y2 JPS5831424 Y2 JP S5831424Y2 JP 1978183344 U JP1978183344 U JP 1978183344U JP 18334478 U JP18334478 U JP 18334478U JP S5831424 Y2 JPS5831424 Y2 JP S5831424Y2
- Authority
- JP
- Japan
- Prior art keywords
- hybrid
- power transistor
- inner frame
- igniter
- electronic components
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
- H10W72/874—On different surfaces
- H10W72/884—Die-attach connectors and bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/753—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between laterally-adjacent chips
Landscapes
- Ignition Installations For Internal Combustion Engines (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
【考案の詳細な説明】
本考案は電装品のように環境が極めて厳しい条件下で使
用されるハイブリッド部品を収納したハイブリッド・イ
グナイターの改良に関し、極めて簡単な構成で高度の信
頼性を得ようとするものである。[Detailed description of the invention] This invention aims to improve a hybrid igniter that houses hybrid parts that are used in extremely harsh environments such as electrical equipment, and to obtain a high degree of reliability with an extremely simple configuration. It is something to do.
従来の樹脂注型タイプのハイブリッド・イグナイターの
構成例を第１図に示す。Figure 1 shows an example of the configuration of a conventional resin-cast hybrid igniter.
モノシリツクＩＣ等の電子部品１を装着したハイブリッ
ド基板２は、部品装着面を上側にして接着剤３等で金属
ケース４に接着され、これとは別に放熱ベースに半田６
により接続された出力用パワートランジスタ７が、絶縁
基板８を介して、金属ケース４に接着されていた。A hybrid board 2 on which an electronic component 1 such as a monolithic IC is mounted is adhered to a metal case 4 with an adhesive 3 or the like with the component mounting surface facing upward, and separately solder 6 is attached to a heat dissipation base.
An output power transistor 7 connected to the metal case 4 was bonded to the metal case 4 via an insulating substrate 8.
又、各半導体チップは、ポンチ゛ングポスト９との間を
Ａｌ、Ａｕ等のワイヤー１０によって超音波溶接等の手
法により結線され、外部へは、導体１１に半田６により
接続された端子１２を介してリード線１３等によって配
線されている。Further, each semiconductor chip is connected to a punching post 9 by a method such as ultrasonic welding using a wire 10 made of Al, Au, etc., and is connected to the outside through a terminal 12 connected to a conductor 11 by solder 6. It is wired by lead wires 13 and the like.
さらに、上記構成品の上を、エポキシ等の注型樹脂１４
で充填していた。Furthermore, cast resin 14 such as epoxy is applied over the above components.
It was filled with.
しかし、上記構成では、温度サイクル等によって生じる
ケース４と注型樹脂１４間の剥離や、注型樹脂１４自身
の吸湿等による湿気の浸入が、モノシリツクＩＣなどの
電子部品１のような繊細な素子の表面を腐食し、特性劣
化を生じるという問題があった。However, with the above configuration, peeling between the case 4 and the casting resin 14 caused by temperature cycles, etc., and moisture infiltration due to moisture absorption of the casting resin 14 itself may occur in delicate elements such as electronic components 1 such as monolithic ICs. There was a problem in that the surface of the material corroded, resulting in deterioration of characteristics.
又、注型樹脂１４の温度サイクル等によって生じる樹脂
応力からハイブリッド基板２上の電子部品１を保護する
目的で、第１図に示すように、樹脂応力の小さいシリコ
ン樹脂１５を下層に充填する構成が多く用いられていた
。In addition, in order to protect the electronic components 1 on the hybrid board 2 from resin stress caused by temperature cycles of the casting resin 14, etc., as shown in FIG. was often used.
しかし、この場合、シリコン樹脂１５と注型樹脂１４の
相性が極めて悪いため、壁面を毛細管現象で上昇するシ
リコン樹脂１５によって、エポキシなどの注型樹脂１４
が剥離するという問題も生じていた。However, in this case, since the compatibility between the silicone resin 15 and the casting resin 14 is extremely poor, the silicone resin 15 rising on the wall surface due to capillary action causes the casting resin 14, such as epoxy, to
There was also a problem of peeling off.
さらに、パワートランジスタ７に大電流を通じる場合、
その発熱がハイブリッド基板２上の電子部品１に影響を
与えることも多く、熱分離のできる構成とする必要があ
った。Furthermore, when a large current is passed through the power transistor 7,
The heat generated often affects the electronic components 1 on the hybrid board 2, so it was necessary to have a configuration that allows for thermal isolation.
特に、電装品のように極めて厳しい条件下で使用される
場合、上記欠点は信頼性を損う重要な問題であった。In particular, when used under extremely severe conditions such as in electrical equipment, the above-mentioned drawbacks are a serious problem that impairs reliability.
本考案は極めて簡単な構成で上記欠点を解決したもので
ある。The present invention solves the above drawbacks with an extremely simple configuration.
以下、第２図、第３図に示す実施例によって本考案の詳
細な説明を行なう。Hereinafter, the present invention will be explained in detail with reference to the embodiments shown in FIGS. 2 and 3.
１６は金属ケースで、この金属ケース１６の内底部には
上方に突出する内枠１７が設けられており、この内枠１
７の外側の内底面には放熱ベース１８に半田１９により
接続されたパワートランジスタ２０が放熱ベース１８を
絶縁板２１に結合して接着剤２２により固着されている
。Reference numeral 16 denotes a metal case, and an inner frame 17 that protrudes upward is provided at the inner bottom of the metal case 16.
A power transistor 20 is connected to the heat dissipation base 18 by solder 19 on the outer inner bottom surface of the heat dissipation base 18 , and the heat dissipation base 18 is bonded to an insulating plate 21 and fixed with an adhesive 22 .
また、上記内枠１７の上端には、下面にモノシリツクＩ
Ｃなどの電子部品２３、ボンディングポスト２４、導体
層２５を形成したハイブリッド基板２６が内枠１７内を
密閉するように接着剤２２により固着されている。In addition, the upper end of the inner frame 17 has a monolith I on the lower surface.
A hybrid board 26 on which electronic components 23 such as C, bonding posts 24, and conductor layers 25 are formed is fixed with an adhesive 22 so as to seal the interior of the inner frame 17.
さらに、このハイブリッド基板２６には上面に貫通する
外部配線用端子２７が設けられ、この外部配線用端子２
７の上端面は上記パワートランジスタ２０とＡｌ、Ａｕ
などのワイヤー２８で接続されたり、外部リード線２９
が接続されている。Further, this hybrid board 26 is provided with an external wiring terminal 27 that penetrates through the upper surface.
The upper end surface of 7 is connected to the power transistor 20 with Al and Au.
Connected with wire 28 such as or external lead wire 29
is connected.
なお、内枠１７内の空間３０はそのま・であってもよい
し、必要に応じてハイブリッド基板２６に注入孔を設け
てシリコン樹脂３１を注入してもよい。Note that the space 30 within the inner frame 17 may be left as is, or an injection hole may be provided in the hybrid substrate 26 and the silicone resin 31 may be injected as needed.
さらに、金属ケース１６内にはエポキシ樹脂などの注型
樹脂３２を充填して構成されている。Further, the metal case 16 is filled with a casting resin 32 such as epoxy resin.
上記構成によれば、湿気の浸入からハブリッド基板２６
上の繊細な電子部品２３の素子を保護することができ、
又、シリコン樹脂３１を用いても注型樹脂３２と直接触
れることがないので、毛細管現象による金属ケース１６
と注型樹脂３２の剥離もなくなる。According to the above configuration, the hybrid substrate 26 is protected from moisture intrusion.
It is possible to protect the delicate electronic components 23 on the top.
Furthermore, even if the silicone resin 31 is used, it does not come into direct contact with the casting resin 32, so the metal case 16 due to capillary action
Peeling of the casting resin 32 also disappears.
さらに、内枠１７内の空間３０が、完全気密、又はシリ
コン樹脂３１充填の構成になるので、温度サイクル等に
よる注型樹脂３２の内部応力からハイブリッド基板２６
上の電子部品２３を保護することができる。Furthermore, since the space 30 within the inner frame 17 is completely airtight or filled with silicone resin 31, the hybrid substrate 26 is protected from internal stress in the casting resin 32 due to temperature cycles, etc.
The upper electronic component 23 can be protected.
又、パワートランジスタ２０の発熱は、内枠１７を経て
、ハイブリッド基板２６の端部から電子部品２３へ伝わ
るため、パワートランジスタ２０とハイブリッド基板２
６上の電子部品２３間の熱抵抗は極めて大きくすること
ができる。Furthermore, since the heat generated by the power transistor 20 is transmitted from the end of the hybrid board 26 to the electronic component 23 via the inner frame 17, the power transistor 20 and the hybrid board 2
The thermal resistance between electronic components 23 on 6 can be made extremely large.
したがって、モノジノツクＩＣ等の電子部品２３は、パ
ワートランジスタ２０から熱分離され、信頼性が向上す
る。Therefore, electronic components 23 such as monolithic ICs are thermally isolated from power transistors 20, improving reliability.
以上のように、本考案によれば、電装品のように極めて
厳しい環境下で使用されるハイブリッド・イグナイター
において簡単な構成で確実な電子部品の保護ができ、高
度の信頼性を確保することができる。As described above, according to the present invention, it is possible to reliably protect electronic components with a simple configuration and ensure a high degree of reliability in hybrid igniters that are used in extremely harsh environments such as electrical equipment. can.
以上により、本考案は、極めて実用的価値が大きいもの
である。As described above, the present invention has extremely great practical value.
第１図は従来のハイブリッド・イグナイターの断面図、
第２図は本考案のハイブリッド・イグナイターの一実施
例を示す断面図、第３図は注型樹脂を充填する前の斜視
図である。
１６・・・・・・金属ケース、１７・・・・・・内枠、
１８・・・・・・放熱ベース、１９・・・・・・半田、
２０・・・・・・パワートランジスタ、２１・・・・・
・絶縁板、２２・・・・・・接着剤、２３・・・・・・
電子部品、２４・・・・・・ボンディングポスト、２５
・・・・・・導電層、２６・・・・・・ハイブリッド基
板、２７・・・・・・外部配線用端子、２８・・・・・
・ワイヤー、２９・・・・・・外部リード線、３０・・
・・・・空間、３１・・・・・・シリコン樹脂、３２・
・・・・・注型樹脂。Figure 1 is a cross-sectional view of a conventional hybrid igniter.
FIG. 2 is a sectional view showing an embodiment of the hybrid igniter of the present invention, and FIG. 3 is a perspective view of the hybrid igniter before being filled with casting resin. 16...Metal case, 17...Inner frame,
18... Heat dissipation base, 19... Solder,
20...Power transistor, 21...
・Insulating plate, 22...Adhesive, 23...
Electronic parts, 24...Bonding post, 25
... Conductive layer, 26 ... Hybrid board, 27 ... External wiring terminal, 28 ...
・Wire, 29...External lead wire, 30...
...space, 31... silicone resin, 32.
...Casting resin.
Claims (2)
ツクＩＣなどの電子部品を組込たハイブリッド基板を収
納するとともに注型樹脂を充填して構成したハイブリッ
ド・イグナイターにおいて、上記金属ケースの内底部の
一部に上方に突出する内枠を設け、この内枠外にパワー
トランジスタを配置し、この内枠の上端に下面に電子部
品を組込んだハイブリッド基板を結合してなるハイブリ
ッド・イグナイター。(1) In a hybrid igniter configured by housing a power transistor and a hybrid board incorporating electronic components such as a monolithic IC in a metal case and filling it with casting resin, a part of the inner bottom of the metal case A hybrid igniter has an inner frame that protrudes upward, a power transistor is placed outside the inner frame, and a hybrid board with electronic components installed on the bottom is connected to the upper end of the inner frame.
け、この外部配線用端子にパワートランジスタまたは外
部リード線を接続してなる実用新案登録請求の範囲第１
項記載のハイブリッド・イグナイター０(2) Utility model registration claim 1 in which a hybrid board is provided with a penetrating external wiring terminal, and a power transistor or an external lead wire is connected to the external wiring terminal.
Hybrid igniter 0 described in section
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1978183344U JPS5831424Y2 (en) | 1978-12-27 | 1978-12-27 | hybrid igniter |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1978183344U JPS5831424Y2 (en) | 1978-12-27 | 1978-12-27 | hybrid igniter |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5599163U JPS5599163U (en) | 1980-07-10 |
| JPS5831424Y2 true JPS5831424Y2 (en) | 1983-07-12 |
Family
ID=29195009
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1978183344U Expired JPS5831424Y2 (en) | 1978-12-27 | 1978-12-27 | hybrid igniter |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5831424Y2 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2777464B2 (en) * | 1990-07-18 | 1998-07-16 | 株式会社日立製作所 | Electronic device and engine ignition device using the same |
| JP2590601B2 (en) * | 1990-09-28 | 1997-03-12 | 松下電器産業株式会社 | Electronic ignition device |
| JP2539819Y2 (en) * | 1991-03-12 | 1997-07-02 | 国産電機株式会社 | Ignition unit with throttle opening sensor |
-
1978
- 1978-12-27 JP JP1978183344U patent/JPS5831424Y2/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5599163U (en) | 1980-07-10 |
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