JPS5843232Y2 - transistor mounting device - Google Patents

Description

[Detailed description of the invention] The present invention relates to a transistor mounting device in which the tip of the lead is inserted into the board and stands free on the board. The purpose of soldering the foil stretched to the board with the lead is to prevent the part from lifting off the board when an external force is applied to the lead without increasing the area occupied by the part on the board.

FIG. 1 shows a state in which a conventional transistor is inserted into a substrate.

In the figure, 1 is a board, 2 is a lead hole drilled in the board 1, and a copper foil (not shown) is placed around the lead hole 2 on the back side of the board.

Reference numeral 3 denotes the transistor body, and 4 denotes emitter, collector, and base leads that protrude straight from the base end surface of the transistor body 3, and are inserted into the passage 2, respectively.

In such a structure, since the leads 4 have a straight shape, after the leads 4 are inserted into the inlet 2, the transistor main body 3 sinks together with the leads 4 more than necessary.

Even if you somehow prevent the leads from sinking, if a force is applied to the leads in the insertion direction due to a fall after soldering to the foil on the board, the foil soldered to the leads will be damaged by that force. It may float off the board.

Conventionally, in order to prevent this fall and make the transistor independent on the substrate, as shown in FIG. Bend the leads 6 and 8 in opposite directions in the shape of a .
A method has been proposed in which the tips of the leads are respectively inserted into lead passages 2 formed in the substrate 1.

It is true that a transistor with bent leads 6, 7, and 8 as described above can be made freestanding on the substrate 1, but as described above, if the leads 7 and 6.8 are shaped in opposite directions, Since the leads 6, 7, and 8 occupy an enlarged area on the board 1 due to their bent ends being open, the leads 6, 7, and 8 are unsuitable for a board in which circuit components are installed in a high density.

In addition, the leads, which are bent before being attached to the substrate so that their tips are open, are easily deformed and cannot be easily stored.

For this reason, as shown in Fig. 3, the middle glue lead 11 is left straight, and only the glue leads 9 and 10 on both sides are bent at right angles at their tips to minimize the area occupied by the leads. However, when force is applied to the lead due to a fall, etc., since the middle lead 11 is straight, that force is directly transmitted to the copper foil soldered to the lead 11, causing the same foil lifting as described above. was.

The present invention eliminates the above-mentioned drawbacks of the conventional art, and embodiments thereof will be described below with reference to the drawings.

FIG. 4 shows an embodiment of the present invention, and j2, 13, and 14 are leads respectively protruding from the base end surface of the transistor body 3, and the tips of each lead are covered with copper foil (not shown) on the lower surface. The lead passage 2 is inserted into a lead passage 2 drilled in a printed circuit board 1.

Lead 1 located on both sides of leads 12, 13, and 14
2.14 has each tip bent at right angles in the same direction, and the bent portion along the substrate 1 is long enough to be locked to the substrate 1, and the lead located in the middle. 13 has elasticity and is bent in a dogleg shape at approximately the center thereof so that the tip is located approximately on an extension of the base.

Since the middle glue 13 is bent in a dogleg shape, the nodes 12 and 1 inserted into the lead passage 2 are
3. Even if force is applied in the lead insertion direction after the tip of 14 is soldered to the copper foil on the back side of the board 1, the bent part forms an elastic part and absorbs the force as described above. However, for this reason, the force is not directly transmitted to the tips of the leads soldered to the copper foil, and as a result, the copper foil portions soldered to the leads 13 are not lifted off the board 1.

At the same time, as described above, the lead 13 is bent so that its tip is located almost on the extension of the base, and as a result, the area occupied by the lead tip inserted into the passage 2 on the board is almost expanded. remains unresolved.

Note that an elastic portion having the same effect can also be obtained by forming a plurality of dogleg-shaped bends in a wavy shape, a semicircular shape, or a coil shape.

As explained above, according to the present invention, of the three leads protruding from the base end surface of the transistor body, two on both sides have their tips bent in the same direction in an L-shape, and are bent so as to be placed on the substrate. The part is long enough to be latched to the board, and the lead located in the middle is bent at approximately the center so that the tip is located almost on the extension of the base to give it elasticity. After fixing the transistor to the printed circuit board, even if a force is applied in the direction in which the leads are inserted, the bent portion absorbs the force, so the force is not directly transmitted to the soldered tip of the lead, and the foil floats. It never happens.

Furthermore, since the middle lead is processed so that its tip is located substantially on the extension of the base, the area occupied by the lead tip p4 on the substrate is not expanded.

[Brief explanation of the drawing]

Figures 1, 2, and 3 are perspective views showing the state in which the leads of a conventional transistor are inserted into a board, and Figure 4 is a perspective view of a transistor mounting device that is an embodiment of the present invention. be. 1... Board, 2... Passing, 3...
...Transistor body, 12.13.14...
Lead.

Claims (4)

[Scope of utility model registration request] (1) Out of the three leads that protrude from the base end surface of the transistor body, the leads on both sides are bent into an L-shape with their tips long enough to be secured to the board, and The located leads have an elastic part bent so that the central part is located within the extension line of the base of the transistor body, and only the tips of each of the three leads are inserted into the board and the back side is inserted. A transistor mounting device in which a transistor is mounted on a board by soldering to foil so that it can stand on its own using only the above three leads. (2) The transistor mounting device according to claim 1, in which the elastic portion has a square shape. (3) The transistor mounting device according to claim 1, in which the elastic portion has a semicircular shape. (4) The transistor mounting device according to claim 1, wherein the elastic portion is coiled.