JPS5852579A - Testing device of semiconductor integrated circuit - Google Patents

Testing device of semiconductor integrated circuit

Info

Publication number
JPS5852579A
JPS5852579A JP56150970A JP15097081A JPS5852579A JP S5852579 A JPS5852579 A JP S5852579A JP 56150970 A JP56150970 A JP 56150970A JP 15097081 A JP15097081 A JP 15097081A JP S5852579 A JPS5852579 A JP S5852579A
Authority
JP
Japan
Prior art keywords
test
testing
adapter
adaptor
under test
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP56150970A
Other languages
Japanese (ja)
Inventor
Hideo Ishiguro
石黒 秀男
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP56150970A priority Critical patent/JPS5852579A/en
Publication of JPS5852579A publication Critical patent/JPS5852579A/en
Pending legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F11/00Error detection; Error correction; Monitoring
    • G06F11/22Detection or location of defective computer hardware by testing during standby operation or during idle time, e.g. start-up testing

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Quality & Reliability (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

PURPOSE:To utilize an idle time between regular, tests, and to efficiently execute a self-test and calibration, by stopping an operation of an incorporated self-testing device, immediately before a testing element is connected to an adaptor for connecting an element to be tested. CONSTITUTION:To a testing signal generating and discriminating device 11, an element 13 to be tested is connected through an adaptor 12. The adaptor 12 is provided with a connection previous notice signal generating means, and in case of a regular device mode in which the element 13 is connected to the adaptor 12, a self-testing device 14 is stopped. In a state that a device test has ended and the adaptor 12 has been detached, the device 14 starts is operation as necessary, and the test and calibration regarding the device 11 and the adaptor 12 are executed. Subsequently, when the adaptor 12 is made to approach the element 13 and a connection previous notice signal is sent out to the device 14, the operation of the device 14 is stopped.

Description

【発明の詳細な説明】 本発明は半導体集積回路の試験装置に関する。[Detailed description of the invention] The present invention relates to a testing device for semiconductor integrated circuits.

半導体集積回路の試験では、被試験素子に種々の入力信
号を印加すると共に、被試験素子の出力信号があらかじ
め定められた規格と合致するか否かを判別するのである
が、被試験素子を精度よく試験するためには、これら入
力信号の発生、出力信号の判別が充分な精度でもってな
されなければならず、そのための試験装置自身の性能試
験、較正が重要な問題となる。
In testing semiconductor integrated circuits, various input signals are applied to the device under test, and it is determined whether the output signal of the device under test conforms to a predetermined standard. In order to perform a good test, generation of these input signals and discrimination of output signals must be performed with sufficient accuracy, and for this purpose, performance testing and calibration of the test equipment itself are important issues.

第1図は従来の半導体集積回路試験装置の一例のブロッ
ク図である。第1図において、試験信号発生判別装置1
が発生する入力信号は、アダプタ2を介して被試験素子
3に印加され、被試験素子30発生する出力信号はアダ
プタ2を介して試験信号発生判別装置1において合否の
判別が行なわれる。試験信号発生判別装置1は入力信号
を発生するためのパターン発生機能、タイミング発生機
能、ドライバの他に、出力信号を判別するためのコンパ
レータ、被試験素子3に直流電圧を印加するための計測
電源を有しているのが普通である。
FIG. 1 is a block diagram of an example of a conventional semiconductor integrated circuit testing apparatus. In FIG. 1, a test signal generation determination device 1
The input signal generated by the test signal is applied to the device under test 3 via the adapter 2, and the output signal generated by the device under test 30 is passed via the adapter 2 to the test signal generation/determination device 1 for pass/fail determination. The test signal generation/discrimination device 1 includes a pattern generation function, a timing generation function, and a driver for generating input signals, as well as a comparator for discriminating output signals, and a measurement power supply for applying DC voltage to the device under test 3. It is normal to have

アダプタ2は被試験素子3と試験信号発生判別装置lを
接続するもので、被試験素子3の形状がウェーハ状態の
ときはプローバ、ケースに実装されている場合はハンド
ラやICソケット、基板上に実装されている場合はコネ
クタ等が使用される。
The adapter 2 connects the device under test 3 and the test signal generation/determination device l, and is used as a prober when the device under test 3 is in the form of a wafer, or as a handler, IC socket, or on the board when the device under test 3 is mounted in a case. If it is mounted, a connector etc. will be used.

第1図の装置の場合、試験装置そのものの精度を保証す
るための試験、較正は、通常、被試験素子3のかわりに
あらかじめ特性を評価しである標準サンプルを接続し試
験する方法や、アダプタ2ごと試験・較正用の特殊治具
と交換し、試験する方法がとられてきたが、前者の方法
では標準サンプル自身の特性を精度よく保つことが困難
であり、後者の方法では、実際に被試験素子3を試験す
る場合と同一の条件を再現することが困難であるため、
いずれの方法も近年ますます高速化、大規模集積化され
てきた半導体集積回路を試験する装置 −に適している
方法とはいえない。
In the case of the device shown in Figure 1, tests and calibrations to ensure the accuracy of the test device itself are usually performed by connecting and testing a standard sample whose characteristics have been evaluated in advance in place of the device under test 3, or by using an adapter. The method used has been to replace each standard sample with a special jig for testing and calibration, but with the former method it is difficult to maintain the characteristics of the standard sample itself accurately, and with the latter method, it is difficult to actually Since it is difficult to reproduce the same conditions as when testing the device under test 3,
None of these methods can be said to be suitable for testing equipment for semiconductor integrated circuits, which have become increasingly faster and more integrated in large scale in recent years.

第2図は改良された従来の半導体集積回路試験4・ 装置他の一例のブロック図である。第2図において、被
試験素子3はアダプタ2を介して試験信号発生判別装置
1に接続されている。自己試験装置4は、標準的なドラ
イバ、コンパレークヲモチ、たとえば標準的なドライバ
で発生した信号を試験信号発生判別装置11を介して送
出し、アダプタ2における被試験素子3との接続端から
の反射信号を試験信号経路判別装置1内のコンパレータ
で検出したり、逆に試験信号発生判別装B1内のドライ
バの発生する入力信号がアダプタ2における被試験素子
3との接続端からの反射された信号を自己試験装置4内
の標準的なコンパレータで検出することにより、アダプ
タ2の信号伝送系を含め実際の試験状態に近い状態で試
験、較正を行なうことができるものである。しかしなが
ら、この場合信号の反射な利用するためと、被試験素子
3を保護する必要から被試験素子3がアダプタ2に接続
されていない状態で自己試1験装置4を動作させねばな
らないため、あらかじめ試験較正用に確保された時間に
おいてのみ自己試験が可能なものである。
FIG. 2 is a block diagram of another example of an improved conventional semiconductor integrated circuit testing device. In FIG. 2, a device under test 3 is connected to a test signal generation/determination device 1 via an adapter 2. In FIG. The self-test device 4 sends a signal generated by a standard driver or comparator, for example, a standard driver, through a test signal generation determination device 11, and outputs the signal from the connection end of the adapter 2 with the device under test 3. A comparator in the test signal path discriminator 1 detects the reflected signal of By detecting the detected signal with a standard comparator in the self-testing device 4, testing and calibration can be performed in conditions close to the actual test conditions, including the signal transmission system of the adapter 2. However, in this case, in order to utilize signal reflection and to protect the device under test 3, it is necessary to operate the self-test device 4 with the device under test 3 not connected to the adapter 2. Self-testing is only possible during the time set aside for test calibration.

本発明は通常の試験と試験の間に生ずる空き時間を積極
的に活用し、効率よく自己試験・較正を行なえる半導体
集積回路試故装置を提供することを目的とするものであ
る。
SUMMARY OF THE INVENTION An object of the present invention is to provide a semiconductor integrated circuit testing device that can efficiently perform self-testing and calibration by actively utilizing the free time that occurs between normal tests.

その目的達成のために、本発明の半導体集積回路試験装
置は、被試験素子に印加する入力信号を発生するととも
に被試験素子の出力信号があらかじめさだめられた規格
を満足するか否かを判別する試験信号発生判別装置と、
該試験信号発生判別装置と被試験素子を接続するための
アダプタと、該アダプタに被試験素子が接続されていな
い状態で該アダプタの試験信号経路を含めて前記試験信
号発生判別装置を試験較正するための自己試験装置とを
有し、さらに前記アダプタには、このアダプタに被試験
素子が接続される直前に前記自己試験装置の動作を停止
させるための接続予告信号を発生する接続予告信号発生
手段を備えている。
To achieve this objective, the semiconductor integrated circuit testing apparatus of the present invention generates an input signal to be applied to a device under test, and determines whether an output signal of the device under test satisfies a predetermined standard. a test signal generation determination device;
Testing and calibrating the test signal generation discriminator including an adapter for connecting the test signal generation discriminator and the device under test, and a test signal path of the adapter in a state where the device under test is not connected to the adapter. The adapter further includes a connection notice signal generating means for generating a connection notice signal for stopping the operation of the self-test device immediately before the device under test is connected to the adapter. It is equipped with

以下、本発明を実施例ゆいて説明する。The present invention will be explained below with reference to Examples.

第3図は本発明の一実施例を示すブロック図である。同
図中11は試験信号発生判別装置、125− はアダプタ、3は被試験素子、14は自己試験装置であ
り、特にアダプタ12には接続予告信号発生手段を備え
ている。このような試験装置において、被試験素子3が
アダプタ12に接続されている状態、つまり、通常のデ
バイステストモードでは、自己試験装置14は停止して
いるが、デバイステストが終了し、被試験素子3がアダ
プタ12から切離された状態では必要に応じ自己試験装
置14が動作を開始し、試験信号発生判別装jttll
およびアダプタ12について試験較正が行なわれる。続
いて次の被試験素子3がアダプタ12に接続される場合
、アダプタ12が、例えば、被試験素子が実装されてい
る基板に対するコネクタとすれば、基板の接続端子とコ
ネクタの接融子を接続するための両者を互いに接近させ
たとき、この接近を検知して、アダプタJ2は自己試験
装置14に対し接続予告信号を送出することにより自己
試験装置14の動作を停止せしめ、通常のデバイステス
トモードに復帰させた後、被試験素子3とアダプタ12
の接続を行ない、その後、試験信号発 6− 虫刺別装置11によるデバイステストを開始する。
FIG. 3 is a block diagram showing one embodiment of the present invention. In the figure, 11 is a test signal generation determination device, 125- is an adapter, 3 is a device under test, and 14 is a self-test device. In particular, the adapter 12 is equipped with a connection notice signal generating means. In such a test device, when the device under test 3 is connected to the adapter 12, that is, in the normal device test mode, the self-test device 14 is stopped, but when the device test is completed, the device under test 3 is disconnected from the adapter 12, the self-test device 14 starts operating as necessary, and the test signal generation discriminator jttll
A test calibration is performed on and adapter 12. Subsequently, when the next device under test 3 is connected to the adapter 12, if the adapter 12 is, for example, a connector for a board on which the device under test is mounted, the connecting terminal of the board and the welder of the connector are connected. When the two are brought close to each other for the purpose of testing, the adapter J2 detects this approach and sends a connection notice signal to the self-testing device 14 to stop the operation of the self-testing device 14 and return to the normal device test mode. After returning to , the device under test 3 and adapter 12
After that, a test signal is generated. 6- A device test using the insect bite separation device 11 is started.

このように、本発明によれば、通常のデバイステストに
何の影響をおよぼすこともなく、又、何らかの人為的操
作を追加することもなく、デバイステストとデバイステ
ストの間の空き時間のほとんどを安全かつ確実に半導体
試験装置自身の自己較正に活用することが可能となるた
め、機能が複雑化し、高精度が要求される半導体集積回
路試験装置の性能維持を比較的容易に行なうことが可能
となる。
As described above, according to the present invention, most of the free time between device tests can be saved without affecting normal device tests or adding any human operations. Since it can be used safely and reliably to self-calibrate semiconductor test equipment itself, it is relatively easy to maintain the performance of semiconductor integrated circuit test equipment, which has complex functions and requires high accuracy. Become.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は従来の半導体集積回路試験装置の一例のブロッ
ク図、第2図は他の従来例のブロック図、第3図は本発
明の一実施例のブロック図である。 1.11・・・・・・試験信号発生判別装置、2,12
・・・・・・アダプタ、3・・・・・・被試験素子、4
,14・・・・・・自己試験装置。 7− 第 / 図 第 2 図 第3 図
FIG. 1 is a block diagram of an example of a conventional semiconductor integrated circuit testing apparatus, FIG. 2 is a block diagram of another conventional example, and FIG. 3 is a block diagram of an embodiment of the present invention. 1.11...Test signal generation determination device, 2,12
...adapter, 3...device under test, 4
, 14... Self-test device. 7- Figure / Figure 2 Figure 3

Claims (1)

【特許請求の範囲】[Claims] 被試験素子に印加する入力信号を発生するとともに被試
験素子の出力信号があらかじめさだめられた規格を満足
するか否かを判別する試験信号発生判別装置と、該試験
信号発生判別装置と被試験素子とを接続するだめのアダ
プタと、該アダプタに被試験素子が接続されていない状
態で該アダプタの試験信号経路を含めて前記試験信号発
生判別装置を試験較正するための自己試験装置とを有し
さらに前記アダプタにはこのアダプタに被試験素子が接
続される直前に前記自己試験装置の動作を停止させるた
めの接続予告信号を発生する接続予告信号発生手段を備
えていることを特徴とする半導体集積回路の試験装置。
A test signal generation/discrimination device that generates an input signal to be applied to a device under test and determines whether an output signal of the device under test satisfies a predetermined standard; the test signal generation/discrimination device and the device under test; and a self-test device for testing and calibrating the test signal generation discriminating device including the test signal path of the adapter when no device under test is connected to the adapter. The semiconductor integrated device further comprises a connection notice signal generating means for generating a connection notice signal for stopping the operation of the self-test device immediately before the device under test is connected to the adapter. Circuit testing equipment.
JP56150970A 1981-09-24 1981-09-24 Testing device of semiconductor integrated circuit Pending JPS5852579A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56150970A JPS5852579A (en) 1981-09-24 1981-09-24 Testing device of semiconductor integrated circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56150970A JPS5852579A (en) 1981-09-24 1981-09-24 Testing device of semiconductor integrated circuit

Publications (1)

Publication Number Publication Date
JPS5852579A true JPS5852579A (en) 1983-03-28

Family

ID=15508413

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56150970A Pending JPS5852579A (en) 1981-09-24 1981-09-24 Testing device of semiconductor integrated circuit

Country Status (1)

Country Link
JP (1) JPS5852579A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6057947A (en) * 1983-09-09 1985-04-03 Toshiba Corp Measuring apparatus for semiconductor

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6057947A (en) * 1983-09-09 1985-04-03 Toshiba Corp Measuring apparatus for semiconductor

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