JPS585278Y2 - electronic clock - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an electronic timepiece, and more particularly to an electronic timepiece having a circuit board integrally molded by transfer molding.

An electronic watch made by coating a circuit board with synthetic resin using transfer molding can reduce the number of parts and cost, simplify the manufacturing process, and increase mechanical strength.

The present invention provides an electronic timepiece in which a covering portion is formed on a circuit board by such transfer molding, in which the covering portion is configured to have a shape and structure suitable for a member such as a display device to which the circuit board is attached. The purpose of this feature is to facilitate attachment of the member to the circuit board, reduce the number of parts, and simplify the structure.

Embodiments of the present invention will be described below with reference to the drawings.

Reference numeral 1 denotes a circuit board, which has a recess 1a for inserting an IC (integrated circuit) 2, holes 1b and 1C for attaching a crystal resonator 3, a pattern 1d for attaching an electric element, and an output of the IC2 to a liquid crystal panel 4. It has an electrode pattern 1e for connection.

A liquid crystal panel 4 is provided opposite the circuit board 1.

Reference numeral 5 denotes a covering portion made of synthetic resin formed by transfer molding to cover the circuit board 1;
is provided with a convex portion 5a, a concave portion 5b for attaching the liquid crystal panel 4, and a hole portion 5C for attaching the connector 6, as well as an oscillation stabilizing capacitor 7, a trimmer capacitor 8 for frequency adjustment, and a crystal vibration capacitor 7. child 3 lead terminal 3
A recessed notch 5d is provided in each mounting portion of the ground pin 3b and the ground pin 3b.

In this way, the covering portion 5 has a shape and structure suitable for the circuit components attached to the circuit board 1, the liquid crystal panel 4, and other various members.

The connector 6 is made of silicone rubber on which conductive layers 6a and insulating layers 6b are alternately provided, and the pitch of the conductive layers 6a is smaller than the pitch of the electrode patterns 1e of the circuit board 1.

(Figures 2 and 3).

Thereby, in the connection relationship between the electrode pattern 1e and the connector 6, even if the position of the connector 6 is shifted, no problem occurs in the electrical connection.

4a is a transparent electrode provided on the liquid crystal panel 4.

9 is a panel presser.

The lower surface of the IC 2 is fixed to the recess 1a of the circuit board 1 with an adhesive or the like, the output of the IC 2 is connected to the pattern of the circuit board 1 by wire bonding, and the covering part 5 is formed by sealing with resin by transfer molding.

Lead terminals 3a and ground pins 3b of crystal resonator 3 are inserted into holes 1b and ICs of circuit board 1, respectively, and fixed by soldering.

The oscillation stabilizing capacitor 7 and the trimmer capacitor 8 are soldered and fixed to the pattern 1d of the circuit board 1.

The liquid crystal panel 4 is held in the concave portion 5 of the covering portion 5 by the panel presser 9.
It is pressed to the b side.

Insert the connector 6 into the hole 5C of the covering part 5, and connect the circuit board 1.
The electrode pattern 1e and the transparent electrode 4a of the liquid crystal panel 4 are connected.

Here, to explain the manufacturing method and transfer molding of the circuit board 1, in order to manufacture the circuit board 1, a board having a recess 1a is made by transfer molding a synthetic resin, and this board is electrolessly plated. Then, a pattern is formed by a method such as etching.

Next, when transfer molding is carried out, the upper and lower surfaces of the circuit board 1 manufactured as described above are pressed with a mold so that the pattern for soldering the elements, etc., is molded so that no part of the synthetic resin appears.

Epoxy resin is used as the material for transfer molding.

This epoxy resin has the characteristics of having few impurities, excellent moisture resistance and heat resistance, low shrinkage rate, good flow, and high mechanical strength.

Furthermore, it is desirable to use a material whose coefficient of linear expansion is very similar to the material of the circuit board 1, such as Polyset 410B (trade name).

As explained above, in the present invention, the covering portion formed by transfer molding is configured to have a shape and structure suitable for circuit components to be attached to a circuit board, display devices, etc. When attaching the component to the circuit board, it is not only easy to attach it without any problems, but also has a positioning function with respect to the component due to its structure, so it is easy to properly place the component in the predetermined position. There is an effect that can be attached.

In addition, according to the present invention, holes for storing connectors and batteries can also be provided, so there is no need to use the conventional connector frame,
There is no need to use a resin frame having a battery storage hole, and as a result, the number of parts is reduced and the structure becomes extremely simple.

[Brief explanation of drawings]

The drawings show an embodiment of the present invention; FIG. 1 is a vertical cross-sectional view of a main part of the electronic timepiece of the present invention, FIG. 2 is a plan view of a circuit board, and FIG. 3 is a perspective view of a connector. 1...Circuit board, 2...Integrated circuit, 3
...Crystal resonator, 4...Liquid crystal panel,
5... Covering part, 7... Capacitor for oscillation stabilization, 8... Trimmer capacitor.

Claims (1)

[Scope of utility model registration request] An electronic device comprising a circuit board having circuit components, an integrated circuit section provided on the circuit board, a covering section formed by transfer molding to cover the circuit board, and a display device provided facing the circuit board. clock? Here, the integrated circuit is housed in a recess provided in the circuit board, and this is hermetically sealed by a covering part, and the covering part is sealed leaving at least the electrically connected parts on the front and back sides of the circuit board. stop,
The front and back surfaces of the covering part have recesses for accommodating the circuit components and the display device, and the covering part on the surface to which the display device is attached has a hole for electrically connecting the display device and the circuit board. 1. An electronic timepiece, characterized in that a connector made of conductive rubber is housed in the hole so that the circuit board and the display device are pressed into contact with each other.