JPS5856446U - Resin-encapsulated semiconductor device - Google Patents

Resin-encapsulated semiconductor device

Info

Publication number
JPS5856446U
JPS5856446U JP1981151199U JP15119981U JPS5856446U JP S5856446 U JPS5856446 U JP S5856446U JP 1981151199 U JP1981151199 U JP 1981151199U JP 15119981 U JP15119981 U JP 15119981U JP S5856446 U JPS5856446 U JP S5856446U
Authority
JP
Japan
Prior art keywords
resin
semiconductor device
encapsulated semiconductor
leads
integrated circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1981151199U
Other languages
Japanese (ja)
Inventor
幸仁 池田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP1981151199U priority Critical patent/JPS5856446U/en
Publication of JPS5856446U publication Critical patent/JPS5856446U/en
Pending legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は、従来のＤＩＰタイプの樹脂封止集積回路の断
面図、第２図は、本考案の実施例断面図である。 なお図において、１・・・・・・集積回路チップ、２・
・・・・・樹脂、３・・・・・・ボンディングワイヤ、
４・・・・・・外部リード、である。FIG. 1 is a sectional view of a conventional DIP type resin-sealed integrated circuit, and FIG. 2 is a sectional view of an embodiment of the present invention. In the figure, 1...integrated circuit chip, 2...
...Resin, 3...Bonding wire,
4...External lead.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] ＤＩＰタイプの集積回路において、−外部リードを垂直
に曲げ、パッケージ裏面より、リードが取り出せる様に
樹脂でモールドしたことを特徴とする樹脂封止半導体装
置。A resin-sealed semiconductor device in a DIP type integrated circuit, characterized in that - external leads are bent vertically and molded with resin so that the leads can be taken out from the back side of the package.
JP1981151199U 1981-10-12 1981-10-12 Resin-encapsulated semiconductor device Pending JPS5856446U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1981151199U JPS5856446U (en) 1981-10-12 1981-10-12 Resin-encapsulated semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1981151199U JPS5856446U (en) 1981-10-12 1981-10-12 Resin-encapsulated semiconductor device

Publications (1)

Publication Number Publication Date
JPS5856446U true JPS5856446U (en) 1983-04-16

Family

ID=29943891

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1981151199U Pending JPS5856446U (en) 1981-10-12 1981-10-12 Resin-encapsulated semiconductor device

Country Status (1)

Country Link
JP (1) JPS5856446U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6281739A (en) * 1985-10-05 1987-04-15 Yamaichi Electric Mfg Co Ltd Ic package

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6281739A (en) * 1985-10-05 1987-04-15 Yamaichi Electric Mfg Co Ltd Ic package

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