JPS5857788A - Printed wiring board manufacturing method - Google Patents
Printed wiring board manufacturing methodInfo
- Publication number
- JPS5857788A JPS5857788A JP15482081A JP15482081A JPS5857788A JP S5857788 A JPS5857788 A JP S5857788A JP 15482081 A JP15482081 A JP 15482081A JP 15482081 A JP15482081 A JP 15482081A JP S5857788 A JPS5857788 A JP S5857788A
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- wiring board
- holes
- manufacturing
- board manufacturing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】 本発明は、印刷配線板の一造方法に関するものである。[Detailed description of the invention] The present invention relates to a method for manufacturing a printed wiring board.
従来の印刷配線板は、完成後の段階では第１図に示すご
とく、表面にパターン２扮凸状に形成されているので、
スクリーン印刷法によるソルダーレジストを塗布しても
均一に塗布されず、印刷量ＡＩ ハターンの一部が露出
してしまいソルダーレジストの機能を十分に発揮できな
かったり、印刷配線板の使用環境が悪い場合には耐食性
を考慮し、部品搭載後の煩わしいコーティングを実施す
るなどの方策がとられていた。又一部では多層印刷配線
板の内層印刷パターンと同様な製法により、表面パター
ンをグリプレグで被優してしまうといった高価な製法も
実施されてきた。When a conventional printed wiring board is completed, two convex patterns are formed on its surface, as shown in Figure 1.
Even if solder resist is applied using the screen printing method, it is not applied uniformly and a part of the printed wiring pattern is exposed, making it impossible to fully demonstrate the function of the solder resist, or when the environment in which the printed wiring board is used is poor. In consideration of corrosion resistance, measures were taken such as applying a cumbersome coating after parts were mounted. In addition, in some cases, an expensive manufacturing method has been implemented in which the surface pattern is softened with Gripreg using a manufacturing method similar to that used for the inner layer printing pattern of a multilayer printed wiring board.
本発明は上記した従来技術の欠点をなくし、安価な方法
により、ソルダーレジストが不要で、耐食性に強く、高
密度パターンにも適した印刷配線板の人造方法を提供す
ることを目的とする。It is an object of the present invention to eliminate the above-mentioned drawbacks of the prior art, and to provide an inexpensive method for manufacturing a printed wiring board that does not require a solder resist, has strong corrosion resistance, and is suitable for high-density patterns.
本発明は従来のスルホールメッキ印刷配線板の製造工程
の途中で、表面パターン形成後、全表Ｗ１に熱硬化性樹
脂をコーティングすることによって上記従来法の欠点を
解決したものである。The present invention solves the above-mentioned drawbacks of the conventional method by coating the entire surface W1 with a thermosetting resin after the surface pattern is formed during the manufacturing process of the conventional through-hole plating printed wiring board.
即ち、本発明は銅張積層板にエツチング工程により表面
パターン形成後、全表面に熱硬化性樹脂をコーティング
し、当該樹脂を硬化後、スルホール用の穴あけを行ない
、その故スルホール内のみメッキを施すことより成るこ
とを％徴とする印刷配線板の製造方法に存する。That is, in the present invention, after forming a surface pattern on a copper-clad laminate through an etching process, the entire surface is coated with a thermosetting resin, and after the resin is cured, holes for through-holes are drilled, and therefore plating is applied only inside the through-holes. The present invention relates to a method for manufacturing a printed wiring board comprising the following characteristics.
以下本発明を図面を併用しつつ更に具体的に説明する。Hereinafter, the present invention will be explained in more detail with reference to the drawings.
第２図は本発明（よるスルホールメツ中印刷配細板の好
ましい例を工程順に示したものである。FIG. 2 shows a preferred example of the through-hole printing plate according to the present invention in the order of steps.
第ｉ図（ａ）は通常の銅張り積層板ｌを示す。先ずこの
積層板に第２図色）の如く表面パターン２を通常のエツ
チング工法により形成する。そのｖｋｔＫ２図（ｅ）に
示す如く、全表面に例えばエポキシ樹脂系の熱硬化性樹
脂３をディッピングあるいはスダレ−法により塗布し、
硬化させる。FIG. i(a) shows a conventional copper-clad laminate l. First, a surface pattern 2 as shown in Figure 2 (color) is formed on this laminate by a normal etching method. As shown in FIG.
Let it harden.
次いで以降第２図（ｄ） 、 （ｅ）に示す如く、スル
ホール４用の穴あけを行ない、セミアデイテイプエ法。Next, as shown in FIGS. 2(d) and 2(e), holes for the through holes 4 were drilled using the semi-adjusting method.
無電解メッキ工法等通常工法によりスルホール４内にの
みメッキ５を行なうことによってスルホールメッキ印刷
配線板を製造するものである。A through-hole plated printed wiring board is manufactured by plating 5 only inside the through-holes 4 using a conventional method such as electroless plating.
以上のような製造工程にすることによって、第２図（ｅ
）に示す如く、製造工程途中の段階で、ディッピングの
ような安価で簡単な方法により熱硬化性樹脂を必要な厚
さまでコーティングすることによって、スルホールの穴
の入口附近までコーティング層で被覆されることになり
、耐食性、耐環境性にも極めて強く、又印刷配線板完成
後には、通常のソルダーレジストを塗布する必要もなく
、且ツコーティング層は通常のソルダーレジスト層ヨり
もち密であるため、パターン間の絶縁特性の向上にもな
り、パターン間に従来よりも高電圧が印加されるような
高密度印刷配線板に対しても通雨できるなど数多くの効
果が期待できる。By using the manufacturing process as described above, Figure 2 (e
), by coating the thermosetting resin to the required thickness during the manufacturing process using an inexpensive and simple method such as dipping, the coating layer can be applied up to the entrance of the through-hole. It has excellent corrosion resistance and environmental resistance, and there is no need to apply a normal solder resist after the printed wiring board is completed, and the coating layer is denser than a normal solder resist layer. It can also be expected to have many effects, such as improving the insulation properties between patterns and allowing rain to pass through high-density printed wiring boards, where a higher voltage than before is applied between patterns.
よるスルホールメッキ印刷配線板の製造方法ヲ断面図に
よって工程順に示したものである。
１・・・銅張積層板、２・・・パターン、３・・・熱硬
化性樹＆、４・・・スルホール、５・・・メッキ。
代理人 弁理士 秋 本 正 実The method for manufacturing a through-hole plating printed wiring board is shown in the order of steps using cross-sectional views. 1... Copper-clad laminate, 2... Pattern, 3... Thermosetting wood &, 4... Through hole, 5... Plating. Agent Patent Attorney Masami Akimoto
Claims (1)
、全表面に熱硬化性樹脂をコーティングし、当該樹脂を
硬化後、スルホール用の穴あけを行ない、その後スルホ
ール内のみメッキを施すことより成ることを特徴とする
印刷配線板の製造方法ＯAfter forming a surface pattern on a steel clad laminate using an etching process, the entire surface is coated with a thermosetting resin, after the resin is cured, holes are drilled for through holes, and then plating is applied only inside the through holes. A method for manufacturing a printed wiring board O
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15482081A JPS5857788A (en) | 1981-10-01 | 1981-10-01 | Printed wiring board manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15482081A JPS5857788A (en) | 1981-10-01 | 1981-10-01 | Printed wiring board manufacturing method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5857788A true JPS5857788A (en) | 1983-04-06 |
Family
ID=15592582
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15482081A Pending JPS5857788A (en) | 1981-10-01 | 1981-10-01 | Printed wiring board manufacturing method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5857788A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01295491A (en) * | 1988-05-24 | 1989-11-29 | Hitachi Chem Co Ltd | Manufacture of wiring board |
-
1981
- 1981-10-01 JP JP15482081A patent/JPS5857788A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01295491A (en) * | 1988-05-24 | 1989-11-29 | Hitachi Chem Co Ltd | Manufacture of wiring board |
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