JPS5866338A - Semiconductor mount device - Google Patents

Semiconductor mount device

Info

Publication number
JPS5866338A
JPS5866338A JP56163423A JP16342381A JPS5866338A JP S5866338 A JPS5866338 A JP S5866338A JP 56163423 A JP56163423 A JP 56163423A JP 16342381 A JP16342381 A JP 16342381A JP S5866338 A JPS5866338 A JP S5866338A
Authority
JP
Japan
Prior art keywords
opening
mount
lead frame
semiconductor
cover
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP56163423A
Other languages
Japanese (ja)
Inventor
Minoru Kagino
鍵野　実
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP56163423A priority Critical patent/JPS5866338A/en
Publication of JPS5866338A publication Critical patent/JPS5866338A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07337—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy

Landscapes

  • Die Bonding (AREA)

Abstract

PURPOSE:To prevent oxidation of mount material and reduction of mount property, by a method wherein an injection hole is provided on a cover of a semiconductor mount device and opening of the cover is cleaned by non-oxidizing gas. CONSTITUTION:A cover 11 has an air injection hole 11a at upper lateral side of an opening 3, and non-oxidizing N2 in heated state is ejected through the injection hole onto the opening 3. In this constitution, portion of a lead frame 10 at the opening 3 is set to produce maximum temperature at the mounting process, stretching of shielding screen of N2 prevents the atmospheric air flowing thereby oxidation of the mount material 6 and temperature decrease of the mount portion of the lead frame 10 are also prevented and the mount property is significantly improved.

Description

【発明の詳細な説明】 この発明は半導体マウント装置にかかり、＊＋Ｃリード
フレームに半導体ペレットをマウントするマウント装置
の改良に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a semiconductor mounting device, and relates to an improvement in a mounting device for mounting a semiconductor pellet on a *+C lead frame.

従来、半導体ペレットをリードフレームにマウントする
方法の１つに熱融着法がある。この方法に用いられるマ
ウント装置には、リードフレームをその長手方向に送る
ように第１図に一部を示すレール部（１）がその中間に
半導体ペレットをマウントするための加熱体（１１）を
備えている。また、前記レール部に対応してその上面と
の間−１（リードフレーム顛を移行させるための間隙（
２）と、半導体ペレットをマウントするための開孔（３
）　（Ｈ孔は少くとも２個設けられ、その１個はマウン
ト材（６）を蓋くための側孔、他の開孔は半導体ペレッ
トを固着させるためのもので、後者は図示を省略しであ
る）とを備えるふた部（４）が設けられている。Conventionally, one of the methods for mounting a semiconductor pellet on a lead frame is a thermal fusion method. The mounting device used in this method has a rail part (1), a part of which is shown in FIG. We are prepared. In addition, there is a gap -1 (a gap for transferring the lead frame structure) between the top surface and the rail part corresponding to the rail part.
2) and an opening (3) for mounting the semiconductor pellet.
) (At least two H holes are provided, one of which is a side hole for covering the mounting material (6), and the other hole is for fixing the semiconductor pellet; the latter is not shown in the figure. ) is provided.

錠上の従来のマウント装置ではふた体の開孔部にあるリ
ードフレームの１分がマウント工程中で最も高温になる
よう設けられているため、図中破線で示すような気流を
生じ、マウント材が外気に触れ酸化することと、温度が
低下してマウント性が悪化される欠点があった。Conventional mounting devices for locks are designed so that the lead frame in the opening of the lid reaches the highest temperature during the mounting process for 1 minute, which creates an airflow as shown by the broken line in the figure, causing the mounting material to heat up. The disadvantages are that it oxidizes when exposed to outside air, and that the temperature decreases and the mountability deteriorates.

この発明は上記従来の欠点を除去するためになされたも
ので、マウント装置のふた体における開孔部に不所望に
発生する気流による影響を改善するものである。The present invention has been made to eliminate the above-mentioned drawbacks of the conventional art, and is intended to improve the influence of airflow that occurs undesirably in the opening in the lid of the mounting device.

この発明にかかる半導体マウント装置は、リードフレー
ムを移送しその中間で半導体ペレットをマウントするた
めの加熱体を備えたレール部と、半導体ベレットマウン
トを施す部位に設けられた開孔およびレール部との間に
リードフレームを移行させる間隙を有してレール部に対
応させたふた部と、前記開孔を非酸化性ガスで掃拭する
ためふた部に設けられた噴気孔とを具備したものである
。The semiconductor mounting device according to the present invention has a rail portion equipped with a heating body for transferring a lead frame and mounting a semiconductor pellet in the middle thereof, and an opening provided in a portion where semiconductor pellet mounting is performed and a rail portion. The lid part is provided with a lid part corresponding to the rail part with a gap between which the lead frame is transferred, and a blowhole provided in the lid part for wiping out the openings with non-oxidizing gas.

以下にこの発明を１実施例ξζつき図面を参照して詳細
に説明する。なお、この発明はふた部における開孔部分
の改良であり、レール部をはじめ他の部分は従来のもの
と変らないので、改良部分についてのみ説明する。第２
図および第３図に示すようにふた部０旧こはその開孔（
３）上面の側方に噴気孔（ｌｌａ）が設けられ、ここか
ら加熱された非酸化性ガス、たとえば窒素ガスを開孔上
に同けて噴出する。第３図に噴出された非醒化性ガスの
流線を破線で示す。The present invention will be explained in detail below with reference to the drawings with one embodiment ξζ. It should be noted that this invention is an improvement of the opening part in the lid part, and since the other parts including the rail part are the same as the conventional one, only the improved part will be explained. Second
As shown in the figure and Fig. 3, the opening of the lid part 0 (
3) A fumarole hole (lla) is provided on the side of the upper surface, from which heated non-oxidizing gas, such as nitrogen gas, is ejected onto the aperture. In FIG. 3, the streamlines of the non-alarming gas ejected are shown by broken lines.

錠上の如く構成することによって、ペレットマウントを
施す部位におけるふた体の開孔部に非駅化性のガスによ
る迩蔽幕が展張されるので、外気の流入が防止される。By configuring it like a lock top, a curtain of non-stationary gas is extended over the opening of the lid at the part where the pellet mount is applied, thereby preventing the inflow of outside air.

このため、マウント材の酸化が防止できる上に低温の外
気によるマウント部の温鼠低下が防止できマウント性か
顕著ｌこ同上した。そして、半導体製品の特性、信頼性
の同上が実現できる。さらに、本発明は実施ｔこあたり
装置の大輪な改良を要しないので経済的である利点もあ
る。Therefore, it is possible to prevent the mount material from being oxidized, and also to prevent the temperature of the mount portion from decreasing due to low-temperature outside air, and the mountability is significantly improved. In addition, the same characteristics and reliability of semiconductor products as described above can be realized. Furthermore, the present invention has the advantage of being economical since it does not require any major improvements to the device for implementation.

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は従来の半導体マウント装置の一部を示す断面図
、第２図以降は本発明の１実施例の半導体マウント装置
の要部を示す斜視囚、第３図は第２図の部分を示す断面
図である０ １　　　　　レール部 １１　　　　　　レール部の加熱体 ２　　　　　間隙 ３　　　　　開孔 ４．１１　　　　ふた部 ６　　　　　マウント材 ｌＯリードフレーム １１ａ　　　　　噴気孔 代理人　弁理士　井　上　−男FIG. 1 is a cross-sectional view showing a part of a conventional semiconductor mounting device, FIG. 0 1 Rail section 11 Rail section heating element 2 Gap 3 Opening 4.11 Lid section 6 Mounting material lO lead frame 11a Fumarole agent Patent attorney Inoue - Male

Claims (1)

【特許請求の範囲】[Claims] リードフレームを移送しその中間で半導体ペレットをマ
ウントするための加熱体を備えたレール部と、半導体ペ
レットマウントを施す部位に設けられた開孔およびレー
ル部との間にリードフレームを移行させる間隙を有して
レール部に対応させたふた部と、前記開孔を非酸化性ガ
スで掃拭するためふた部に設けられた噴気孔とを具備し
た半導体マウント装置。A gap is provided between a rail section equipped with a heating element for transferring the lead frame and mounting a semiconductor pellet in the middle thereof, and an opening provided at a location where the semiconductor pellet is mounted and the rail section for transferring the lead frame. What is claimed is: 1. A semiconductor mounting device comprising: a lid portion corresponding to a rail portion; and a blowhole provided in the lid portion for wiping the opening with non-oxidizing gas.
JP56163423A 1981-10-15 1981-10-15 Semiconductor mount device Pending JPS5866338A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56163423A JPS5866338A (en) 1981-10-15 1981-10-15 Semiconductor mount device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56163423A JPS5866338A (en) 1981-10-15 1981-10-15 Semiconductor mount device

Publications (1)

Publication Number Publication Date
JPS5866338A true JPS5866338A (en) 1983-04-20

Family

ID=15773614

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56163423A Pending JPS5866338A (en) 1981-10-15 1981-10-15 Semiconductor mount device

Country Status (1)

Country Link
JP (1) JPS5866338A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63142642A (en) * 1986-12-05 1988-06-15 Kuwano Denki Kk Oxidation preventive device for frame

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5687331A (en) * 1979-12-18 1981-07-15 Toshiba Corp Reducing furnace for solder-treatment

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5687331A (en) * 1979-12-18 1981-07-15 Toshiba Corp Reducing furnace for solder-treatment

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63142642A (en) * 1986-12-05 1988-06-15 Kuwano Denki Kk Oxidation preventive device for frame

Similar Documents

Publication Publication Date Title
JPS6249742B2 (en)
JPH055182B2 (en)
JP3278533B2 (en) Method for manufacturing resin-encapsulated semiconductor device
KR950015726A (en) Resin-sealed semiconductor device and manufacturing method
JPS6038844A (en) Semiconductor device
JPH032347B2 (en)
JPH047102B2 (en)
JPH04179126A (en) Semiconductor integrated circuit device in shield structure
JP3033324U (en) Semiconductor device
JP3316515B2 (en) Cover for heater rail
JPS5921049A (en) Resin seal type semiconductor device
JPS5815225A (en) Semiconductor device substrate
US5849631A (en) Method of manufacturing semiconductor device
JPS60106665A (en) Soldering device
JP3747673B2 (en) Integrated element mounting body, manufacturing method thereof, and mounting substrate mounted with the integrated element mounting body
JPS5482185A (en) Manufacture of semiconductor device
JP2666792B2 (en) Electronic component mounting structure
JPH06132288A (en) Semiconductor integrated circuit device
JPH01238099A (en) Hybrid integrated circuit device
JPS60115250A (en) Treatment of solder after dipping into solder
JPS6417422A (en) Manufacture of semiconductor device
JPS57193039A (en) Manufacture of semiconductor device
JPS5854642A (en) Semiconductor device
JPH063830B2 (en) Resin-sealed semiconductor device
JPH04206824A (en) Formation of element isolation region