JPS5878655U

JPS5878655U - heat sink

Info

Publication number: JPS5878655U
Application number: JP17216281U
Authority: JP
Inventors: 久野　輝夫
Original assignee: Pioneer Corp
Current assignee: Pioneer Corp
Priority date: 1981-11-20
Filing date: 1981-11-20
Publication date: 1983-05-27

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Brief explanation of drawings]

第１図〜第３図は従来の放熱体に関し、第１図は取付ね
じ、半導体、放熱体の分解斜視図である。第２′図、第３図は半導体を螺着した状態を示す斜視図
と平面図である。第４図〜第９図は本考案の実施例に関
し、第４図は側面図である。第５図は、第４図のＡ−Ａ
面での断面図である。第６図は、第４図のＢ−Ｂ面での
断面図である。第７図は、斜視図である。第８図Ｃ第９
図は、半導体を螺着した状態を示す斜視図と平面図であ
る。１・・・・・・放熱体、１１・・・・・・ねじ孔、１□
・・・・・・取付足、２・・・・・・半導体、２□・・
・・・・ねじ通し孔、２□・・・・・・接続端子、３・
・・・・・取付ねじ、４・・・・・・放熱体、４１．４
□・・・・・・弾圧板、４゜・・・・・・ねじ孔、４４
・・・・・・取付足、ａ。ａｌ・・・・・・底幅、ｂ・・・・・・半導体外形幅、
Ｃ・・・・・・弾圧板先端間隔。1 to 3 relate to a conventional heat sink, and FIG. 1 is an exploded perspective view of a mounting screw, a semiconductor, and a heat sink. FIGS. 2' and 3 are a perspective view and a plan view showing the state in which the semiconductor is screwed. 4 to 9 relate to an embodiment of the present invention, and FIG. 4 is a side view. Figure 5 shows A-A in Figure 4.
FIG. FIG. 6 is a sectional view taken along the line BB in FIG. 4. FIG. 7 is a perspective view. Figure 8 C No. 9
The figures are a perspective view and a plan view showing a state in which a semiconductor is screwed. 1...Heat sink, 11...Screw hole, 1□
...Mounting foot, 2...Semiconductor, 2□...
...Screw hole, 2□...Connection terminal, 3.
...Mounting screw, 4... Heat sink, 41.4
□・・・・・・Pressure plate, 4°・・・Screw hole, 44
...Mounting foot, a. al...Bottom width, b...Semiconductor outer width,
C: Interval between pressure plate tips.

Claims

[Scope of utility model registration request]

To attach the bottom width, make it slightly larger than the width of the semiconductor and cut it out from both the left and right walls so that a tongue shape toward the bottom remains, and press the tip of the tongue shape evenly against both sides of the inserted semiconductor. A heat dissipation body that is characterized by being bent symmetrically inward so that it can be bent.