JPS5878680U - Printed wiring board connection device - Google Patents
Printed wiring board connection deviceInfo
- Publication number
- JPS5878680U JPS5878680U JP17364681U JP17364681U JPS5878680U JP S5878680 U JPS5878680 U JP S5878680U JP 17364681 U JP17364681 U JP 17364681U JP 17364681 U JP17364681 U JP 17364681U JP S5878680 U JPS5878680 U JP S5878680U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- connection device
- board connection
- soldering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Combinations Of Printed Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図は従来例を示す斜視図、第2図は同側面図、第3
図は本考案の一実施例を示す斜視図、第′4図は同要部
断面図である。
1.3・・・・・・印刷配線基板、2,6・・・・・・
端子箔、?、11.12・・・・・・半田、8・・・・
・・ランド箔、9・・・・・・電子部品、9a・・・・
・・端子、10・・・・・・導箔。Fig. 1 is a perspective view showing a conventional example, Fig. 2 is a side view of the same, and Fig. 3 is a perspective view showing a conventional example.
The figure is a perspective view showing an embodiment of the present invention, and Fig. '4 is a sectional view of the main part thereof. 1.3...Printed wiring board, 2,6...
Terminal foil? , 11.12... Solder, 8...
...Land foil, 9...Electronic parts, 9a...
...Terminal, 10... Conductive foil.
Claims (1)
設けられた端子箔を半田付けにより饗続し、かつ前記第
1の印刷配線基板の導箔に半田付けにより取付は接続さ
れたスイッチ等の電子部品の端子を第2の印刷配線基板
に設けら′れたランド箔に半田付けにより結合してなる
印刷配線基板の接続装置。A switch, wherein terminal foils provided on each of a first printed wiring board and a second printed wiring board are connected by soldering, and the switch is connected to the conductive foil of the first printed wiring board by soldering. A printed wiring board connection device in which terminals of electronic components such as the above are connected to land foils provided on a second printed wiring board by soldering.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17364681U JPS5878680U (en) | 1981-11-20 | 1981-11-20 | Printed wiring board connection device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17364681U JPS5878680U (en) | 1981-11-20 | 1981-11-20 | Printed wiring board connection device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5878680U true JPS5878680U (en) | 1983-05-27 |
Family
ID=29965518
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17364681U Pending JPS5878680U (en) | 1981-11-20 | 1981-11-20 | Printed wiring board connection device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5878680U (en) |
-
1981
- 1981-11-20 JP JP17364681U patent/JPS5878680U/en active Pending
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