JPS5885341U - printed circuit board - Google Patents

printed circuit board

Info

Publication number
JPS5885341U
JPS5885341U JP18209481U JP18209481U JPS5885341U JP S5885341 U JPS5885341 U JP S5885341U JP 18209481 U JP18209481 U JP 18209481U JP 18209481 U JP18209481 U JP 18209481U JP S5885341 U JPS5885341 U JP S5885341U
Authority
JP
Japan
Prior art keywords
circuit board
printed circuit
conductor
wired
pellet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP18209481U
Other languages
Japanese (ja)
Inventor
小池　保久
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP18209481U priority Critical patent/JPS5885341U/en
Publication of JPS5885341U publication Critical patent/JPS5885341U/en
Pending legal-status Critical Current

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  • Die Bonding (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は従来の厚膜印刷基板のペレットマウント部を示
す平面図、第２図は本考案の実施例を示す平面図である
。 １・・・・・・ポンディングパッド、２．　２’・・・
・・・保護ガラス、３・・・・・・導体、１０・・・・
・・ペレット搭載部。FIG. 1 is a plan view showing a pellet mount portion of a conventional thick film printed circuit board, and FIG. 2 is a plan view showing an embodiment of the present invention. 1...Ponding pad, 2. 2'...
...protective glass, 3...conductor, 10...
...Pellet loading section.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 半導体ペレットを搭載すべきマウントランド上に導体を
配線した構造を持つ印刷基板において、その配線された
導体を被覆する保護層を前記マウントランド上に搭載さ
れる。ペレットと同程度の形状にしたことを特徴とする
印刷基板。In a printed circuit board having a structure in which a conductor is wired on a mount land on which a semiconductor pellet is to be mounted, a protective layer covering the wired conductor is mounted on the mount land. A printed circuit board characterized by having a shape similar to that of a pellet.
JP18209481U 1981-12-07 1981-12-07 printed circuit board Pending JPS5885341U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18209481U JPS5885341U (en) 1981-12-07 1981-12-07 printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18209481U JPS5885341U (en) 1981-12-07 1981-12-07 printed circuit board

Publications (1)

Publication Number Publication Date
JPS5885341U true JPS5885341U (en) 1983-06-09

Family

ID=29980154

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18209481U Pending JPS5885341U (en) 1981-12-07 1981-12-07 printed circuit board

Country Status (1)

Country Link
JP (1) JPS5885341U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63159261U (en) * 1987-04-06 1988-10-18

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63159261U (en) * 1987-04-06 1988-10-18

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