JPS5886789A - Semiconductor laser photodetector photointegrated element - Google Patents

Semiconductor laser photodetector photointegrated element

Info

Publication number
JPS5886789A
JPS5886789A JP56184790A JP18479081A JPS5886789A JP S5886789 A JPS5886789 A JP S5886789A JP 56184790 A JP56184790 A JP 56184790A JP 18479081 A JP18479081 A JP 18479081A JP S5886789 A JPS5886789 A JP S5886789A
Authority
JP
Japan
Prior art keywords
layer
semiconductor laser
photodetector
laser
type inp
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56184790A
Other languages
Japanese (ja)
Other versions
JPS6320398B2 (en
Inventor
Mitsuhiro Kitamura
北村 光弘
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP56184790A priority Critical patent/JPS5886789A/en
Publication of JPS5886789A publication Critical patent/JPS5886789A/en
Publication of JPS6320398B2 publication Critical patent/JPS6320398B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/02Structural details or components not essential to laser action
    • H01S5/026Monolithically integrated components, e.g. waveguides, monitoring photo-detectors, drivers
    • H01S5/0262Photo-diodes, e.g. transceiver devices, bidirectional devices
    • H01S5/0264Photo-diodes, e.g. transceiver devices, bidirectional devices for monitoring the laser-output
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/04Processes or apparatus for excitation, e.g. pumping, e.g. by electron beams
    • H01S5/042Electrical excitation ; Circuits therefor
    • H01S5/0421Electrical excitation ; Circuits therefor characterised by the semiconducting contacting layers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/20Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
    • H01S5/22Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure
    • H01S5/2205Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure comprising special burying or current confinement layers
    • H01S5/2222Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure comprising special burying or current confinement layers having special electric properties
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/20Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
    • H01S5/22Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure
    • H01S5/227Buried mesa structure ; Striped active layer

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Semiconductor Lasers (AREA)
  • Led Devices (AREA)
  • Photo Coupler, Interrupter, Optical-To-Optical Conversion Devices (AREA)
  • Solid State Image Pick-Up Elements (AREA)

Abstract

PURPOSE:To improve the photodetecting sensitivity by composing a photodetector of a P-N junction laser and a photoconductor when a buried hetero structure semiconductor laser and the photodetector are arranged in parallel with each other as a photointegrated element, and connecting them in series with each other. CONSTITUTION:An N type InP buffer layer 102, an InGaAsP active layer 103, a P type InP clad layer 104, and a non-doped InGaAsP layer 105 to become a photoconductor are laminated on an N type InP substrate 101 having (011) plane, and are epitaxially grown. Then, mesa stripes 106, 107 for laser and detector are formed in parallel with the direction (110) by photoresist technique. In this structure, the layer 105 is lacked on the upper surface of the stripe 106. Thereafter, P type and N type current block layers 108, 109 are grown without presence on the stripes 106, 107, the P type InP buried layer 110 is grown on the overall surface, and a proton implanted insulating layer 114 is used to shield between the stripes 106 and 107.

Description

【発明の詳細な説明】 本発明は埋め込みへテロ構造半導体レーザと。[Detailed description of the invention] The present invention relates to a buried heterostructure semiconductor laser.

フォトダイオードおよびフォトコンダクタとからなるフ
ォトディテクタとが同一半導体基板上に集積化された半
導体レーザ・フォトダイオード光集積化素子に関する。
The present invention relates to a semiconductor laser/photodiode optical integrated device in which a photodetector including a photodiode and a photoconductor is integrated on the same semiconductor substrate.

近年光半導体素子や光ファイバの高品質化が進み、光7
アイμ通信の実用化が進んで、光集積回路という新しい
研究分野が発展しつつある。中でも半導体レーザと受光
素子との集積化は光源の光出力をモニタする必要性から
システム構成上重要である。そのひとつとして本願の発
明者らは特願昭56−25836号明細書において明ら
かにしたように埋め込みへテロ構造半導体レーザ(以下
BH−LDと略す。)とPN接合型フォトダイオード(
以下FDと略す。)とを並列に同一基板上に集積化した
光集積化素子を発明した。この光素子においてはBH−
LDの活性層の側面からのレーザ出力光をその横側に形
成されたPDによってモニタすることができ、エツチン
グ共振器面を用いるものと比べて、通常のへき開技術に
よってレーザ共振器rkJヲ形成することができるので
、BH−LDの性能?全く損なうことがないという特徴
を有している。この光素子にBH−LDに正のバイアス
をかけて電流を流し、レーザ発振させ、PDに外部抵抗
を介して負のバイアスをかけることによシレーザ光出力
をモニタすることができる。しかしながらこの例におい
てはB)l−LDの活性層側面からのレーザ散乱光が微
弱であるため、受光感度が必ずしも十分とは言えない。
In recent years, the quality of optical semiconductor devices and optical fibers has improved, and optical 7
As the practical application of I-μ communications progresses, a new research field called optical integrated circuits is developing. Among these, integration of a semiconductor laser and a light-receiving element is important in terms of system configuration because of the need to monitor the optical output of a light source. As one of these, the inventors of the present application disclosed in Japanese Patent Application No. 56-25836 that a buried heterostructure semiconductor laser (hereinafter abbreviated as BH-LD) and a PN junction photodiode (
Hereinafter abbreviated as FD. ) were integrated in parallel on the same substrate. In this optical element, BH-
The laser output light from the side of the active layer of the LD can be monitored by the PD formed on the side, and compared to the one using an etched cavity surface, the laser cavity rkJ is formed by a normal cleavage technique. So what is the performance of BH-LD? It has the characteristic of not being damaged at all. By applying a positive bias to the BH-LD in this optical element and flowing a current to cause laser oscillation, and applying a negative bias to the PD via an external resistor, the laser light output can be monitored. However, in this example, since the laser scattered light from the side surface of the active layer of B) l-LD is weak, the light receiving sensitivity cannot necessarily be said to be sufficient.

本発明の目的は上記の欠点を除去し、BH−LDと7オ
トコンダクタおよびフォトダイオードからなるフォトデ
ィテクタが並列に配列され、受光感度が向上したBH−
LD・フォトディテクタ光集積化素子を提供することに
ある。
An object of the present invention is to eliminate the above-mentioned drawbacks, and to provide a BH-LD with improved light-receiving sensitivity, in which a BH-LD, a photodetector consisting of seven otoconductors, and a photodiode are arranged in parallel.
An object of the present invention is to provide an LD/photodetector optical integrated device.

本発明によれば、活性〜の周囲をよシエネルギーギャ、
プが大きく屈折率が小さい半導体材料でおおわれた埋め
込みへテロ構造半導体レーザと7オトデイテクタとが同
一半導体基板上に集積化された半導体レーザ・フォトデ
ィテクタ光集積化素子において、埋め込みへテロ構造半
導体レーザの活性層よりもエネルギーギヤ、ブの犬きく
ない半導体でなるフォトダイオードとフォトコンダクタ
とよシなるフォトディテクタが埋め込みへテロ構造半導
体レーザのレーザ共振軸に対して垂直な方向の少なくと
も一方の側に形成されてなることを特徴とする半導体レ
ーザ・フォトディテクタ光集積化素子が得られる。
According to the present invention, the energy surrounding the active
In a semiconductor laser/photodetector optical integrated device in which a buried heterostructure semiconductor laser covered with a semiconductor material with a large refractive index and a low refractive index and a 7-photodetector are integrated on the same semiconductor substrate, the activity of the buried heterostructure semiconductor laser is A photodiode, a photoconductor, and a photodetector made of a semiconductor that is less sensitive to energy gear than the layer is formed on at least one side of the buried heterostructure semiconductor laser in a direction perpendicular to the laser resonance axis. A semiconductor laser/photodetector optical integrated device is obtained.

以下実施例を壓す図面を参照しつつ本発明を説明する。The present invention will be described below with reference to the drawings showing examples.

第1図は本発明による光集積化素子の断面図である。こ
のような素子を得るには、まず(001)n−InP基
板101上にn−InPバッファ層102、発光波長1
.3μmに対応するI n6?tG 863g A B
OJI P6)*活性層103、p−InPクラッド層
104、発光波長1.44mに対応するノンドープ”@
U Ga63@ ASOJI P(1,18層105(
厚さ2μm)を順次積層させた半導体つ工7アに通常の
7オトレジスト技術によ、り、<110>方向に平行に
BH−LD用のメチストライプ106およびフォトディ
テクタ用のメサストライプ107を形成する。この際フ
ォトコンダクタとなるノンドーグIn61110m、、
 As、)、、 PtIJI層105はI n6.q 
Ga63@ A’%ntP6J。活性層103よシもエ
ネルギーギャップの小さな半導体材料から成っておfi
、BH−LD用メサストライプの上i1[iFiこのI
n6JIGg、)、 A”IIJI P(LSI層10
5を含まないことが必ヤである。このようにメサストラ
イプを形成した半導体ウェファに埋め込み成長を行ない
、p−InP電流プロ、り層108、n−InP[流ブ
ロック71109を2つのメサストライプの上面のみ積
層しないiうに、またp−InP埋め込み層110、発
光波長1.1μm組成のn−Ina、。
FIG. 1 is a sectional view of an optical integrated device according to the present invention. To obtain such a device, first, an n-InP buffer layer 102 is formed on a (001) n-InP substrate 101, and an emission wavelength of 1
.. I n6 corresponding to 3 μm? tG 863g A B
OJI P6) *Active layer 103, p-InP cladding layer 104, non-doped corresponding to emission wavelength 1.44 m”@
U Ga63@ASOJI P(1,18 layer 105(
A mesa stripe 106 for a BH-LD and a mesa stripe 107 for a photodetector are formed in parallel to the <110> direction on a semiconductor structure 7A in which layers (thickness 2 μm) are sequentially laminated using a normal photoresist technique. . At this time, the non-dawg In61110m, which becomes the photoconductor,
As, ), PtIJI layer 105 is In6. q
Ga63@A'%ntP6J. The active layer 103 is also made of a semiconductor material with a small energy gap.
, i1 above the mesa stripe for BH-LD [iFi this I
n6JIGg, ), A”IIJIP (LSI layer 10
It is essential that it does not contain 5. Embedded growth is performed on the semiconductor wafer with mesa stripes formed in this way. The buried layer 110 is n-Ina with an emission wavelength of 1.1 μm.

”e、ts ASaJ自pox’r電極層111を全面
にわたって連続して成長させる。この光素子ではBH−
LD151と7オトテイテクタ152とがプロトン注入
絶縁化層114によって電気的に絶縁されており、BH
−LD 151に正のバイアスをかけて電流を流し、レ
ーザ発振させ、フォトディテクタ152に外部抵抗を介
して負のバイアス電圧をかけることにより、レーザ出力
光をモニタすることができた。
"e,ts The ASaJ self-pox'r electrode layer 111 is grown continuously over the entire surface. In this optical device, the BH-
The LD 151 and the 7-point protector 152 are electrically insulated by the proton injection insulating layer 114, and the BH
- Laser output light could be monitored by applying a positive bias to the LD 151 to cause current to flow, causing laser oscillation, and applying a negative bias voltage to the photodetector 152 via an external resistor.

本発明の実施例においては、フォトコンダクタ152F
iPN接合型のPDと光を照射していないときには抵抗
の簡い低不純物a度のフォトコンダクタとの直列接続に
よって成シ、このようにPDの真上にフォトコンダクタ
を形成したことにより。
In the embodiment of the present invention, the photoconductor 152F
This is achieved by connecting an iPN junction type PD in series with a photoconductor with low impurity a degree, which has a low resistance when not irradiated with light, and by forming the photoconductor directly above the PD in this way.

微弱なレーザの散乱光をさらにI&度よく受光すること
ができた。
We were able to receive even more weak scattered light from the laser.

なお本発明の実施例においてはInPを基板とする波長
1μm帯の光半導体素子を示したが、この材料系に限る
ことなく、他の材料を用いても何ら差しつかえない。ま
た電流ブロック層としてInPのかわシに活性層よシも
エネルギーギヤ、プの大きなInGaAsP層を用いて
もよく、その場合にはこの屑が光ガイド層としての役割
をし、受光効率がさらに向上するものと期待できる。
In the embodiment of the present invention, an optical semiconductor element with a wavelength of 1 μm using InP as a substrate is shown, but the material is not limited to this material, and other materials may be used without any problem. In addition, an InGaAsP layer with a large energy gap may be used as the current blocking layer instead of the InP layer and the active layer. In that case, this scrap serves as a light guide layer, further improving the light receiving efficiency. You can expect that.

本発明の%徴は、HH−LDと7オトデイテクタとを並
列に配置した光集積化素子において、フォトディテクタ
がPN接合型のPDと、フォトコンダクタよシ成ること
であ、9、PDK直列に7オトコンダクタを形成したた
めに受光感eを向上することができた。
The percent feature of the present invention is that in an optical integrated device in which an HH-LD and a 7-meter detector are arranged in parallel, the photodetector is composed of a PN junction type PD and a photoconductor; Since the conductor was formed, the light receiving sensitivity e could be improved.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本発明による光集積化素子の素子断面図である
。 図中1011in−InP基板、102はn−InPバ
ッファ層、103はI n6.q G m(1,HA 
IIIJI P6g活性層。 104はp−InPクラッド層、105はフォトコンダ
クタとなるノンドープI noJt G aOM A 
1(Lll Po、11層、106Fi、B)i−LD
用のメサストライプ、107は7オトデイテクタ用のメ
サストライプ、108ijp−1nP@1流プロ、り層
、109はn−InP電流プロ、り層、110はp−I
nP埋め込み層、111F′i、n  I n611 
G aO,tl A 8631 P6jy電極層、11
2,113はZn拡散層、114はプロトン注入絶縁化
層、115はSin、絶縁膜、116.117はp形オ
ーミ、り電極、118はn形オーミック電極である。
FIG. 1 is a sectional view of an optical integrated device according to the present invention. In the figure, 1011in-InP substrate, 102 is n-InP buffer layer, 103 is In6. q G m(1, HA
IIIJI P6g active layer. 104 is a p-InP cladding layer, and 105 is a non-doped I noJt GaOM A that becomes a photoconductor.
1 (Lll Po, 11 layers, 106Fi, B) i-LD
107 is a mesa stripe for 7 Oto detector, 108 ijp-1nP@1 style pro, layer, 109 is n-InP current pro, layer, 110 is p-I
nP buried layer, 111F'i, n I n611
G aO,tl A 8631 P6jy electrode layer, 11
2, 113 is a Zn diffusion layer, 114 is a proton injection insulating layer, 115 is a Sin insulating film, 116, 117 is a p-type ohmic electrode, and 118 is an n-type ohmic electrode.

Claims (1)

【特許請求の範囲】[Claims] 活性層の周囲をよシエネルギーギャ、プが大きく屈折率
が小さい半導体材料でおおわれた埋め込みへテロ構造半
導体レーザと7オトテイテクタとが同一半導体基板上に
集積化された半導体レーザ・フォトディテクタ光集積化
素子において、前記埋め込みへテロ構造半導体レーザの
活性〜よりもエネルギーギャップの大きくない半導体で
なるフォトダイオードと7オトコンダクタとよりなる前
記フォトディテクタが、前記埋め込みへテロ構造半導体
レーザのレーザ共振軸に対して垂直外方向の少々くとも
一方の側に形成されてなることを特徴とする半導体レー
ザ・フォトディテクタ光集積化素子。
A semiconductor laser/photodetector optical integrated element in which a buried heterostructure semiconductor laser in which the active layer is surrounded by a semiconductor material with a large energy gap and a low refractive index and a seven-point detector are integrated on the same semiconductor substrate. , the photodetector including a photodiode made of a semiconductor having an energy gap not larger than the active level of the buried heterostructure semiconductor laser and an otoconductor is perpendicular to the laser resonance axis of the buried heterostructure semiconductor laser. A semiconductor laser/photodetector optical integrated element, characterized in that it is formed on at least one side in an outward direction.
JP56184790A 1981-11-18 1981-11-18 Semiconductor laser photodetector photointegrated element Granted JPS5886789A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56184790A JPS5886789A (en) 1981-11-18 1981-11-18 Semiconductor laser photodetector photointegrated element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56184790A JPS5886789A (en) 1981-11-18 1981-11-18 Semiconductor laser photodetector photointegrated element

Publications (2)

Publication Number Publication Date
JPS5886789A true JPS5886789A (en) 1983-05-24
JPS6320398B2 JPS6320398B2 (en) 1988-04-27

Family

ID=16159333

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56184790A Granted JPS5886789A (en) 1981-11-18 1981-11-18 Semiconductor laser photodetector photointegrated element

Country Status (1)

Country Link
JP (1) JPS5886789A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4948753A (en) * 1984-03-27 1990-08-14 Matsushita Electric Industrial Co., Ltd. Method of producing stripe-structure semiconductor laser
US5075239A (en) * 1989-03-30 1991-12-24 Alcatel N.V. Method of making monolithic integrated optoelectronic modules
US5086004A (en) * 1988-03-14 1992-02-04 Polaroid Corporation Isolation of layered P-N junctions by diffusion to semi-insulating substrate and implantation of top layer

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4948753A (en) * 1984-03-27 1990-08-14 Matsushita Electric Industrial Co., Ltd. Method of producing stripe-structure semiconductor laser
US5086004A (en) * 1988-03-14 1992-02-04 Polaroid Corporation Isolation of layered P-N junctions by diffusion to semi-insulating substrate and implantation of top layer
US5075239A (en) * 1989-03-30 1991-12-24 Alcatel N.V. Method of making monolithic integrated optoelectronic modules

Also Published As

Publication number Publication date
JPS6320398B2 (en) 1988-04-27

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