JPS5892055U - thermal head - Google Patents

thermal head

Info

Publication number
JPS5892055U
JPS5892055U JP18813581U JP18813581U JPS5892055U JP S5892055 U JPS5892055 U JP S5892055U JP 18813581 U JP18813581 U JP 18813581U JP 18813581 U JP18813581 U JP 18813581U JP S5892055 U JPS5892055 U JP S5892055U
Authority
JP
Japan
Prior art keywords
ceramic substrate
support plate
adhesive
thermal head
groove
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP18813581U
Other languages
Japanese (ja)
Inventor
高橋　豊彦
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ricoh Co Ltd
Original Assignee
Ricoh Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ricoh Co Ltd filed Critical Ricoh Co Ltd
Priority to JP18813581U priority Critical patent/JPS5892055U/en
Publication of JPS5892055U publication Critical patent/JPS5892055U/en
Pending legal-status Critical Current

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Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は従来知られているサーマルヘッドを示す部分斜
視図、第２図は本考案の一実施例を示す部分斜視図、第
３図は他の実施例を示す支持板の側面図である。 １・・・・・・支持板、２・・・・・・接着剤、３・・
・・・・セラミック基板、５・・・・・・発熱抵抗体、
８・・・・・・高熱伝導性媒体、９．９′・・・・・・
接着剤充填溝、１０・・・・・・弾性接着剤、１１・・
・・・・溝。FIG. 1 is a partial perspective view showing a conventionally known thermal head, FIG. 2 is a partial perspective view showing one embodiment of the present invention, and FIG. 3 is a side view of a support plate showing another embodiment. . 1...Support plate, 2...Adhesive, 3...
... Ceramic substrate, 5 ... Heat generating resistor,
8...High thermal conductivity medium, 9.9'...
Adhesive filling groove, 10... Elastic adhesive, 11...
····groove.

Claims (2)

【実用新案登録請求の範囲】[Scope of utility model registration request] （１）発熱抵抗体をセラミック基板の長手方向に沿って
セラミック基板表面上に配列し、上記セラミック基板を
接着剤により支持板表面上に接着゛してなるサーマルヘ
ッドにおいて、上記発熱抵抗体直下位置から離れた上記
支持板表面の位置にセラミック基板の長手方向に沿って
接着剤充填溝を設けて該溝に接着剤として弾性接着剤を
充填し、発熱抵抗体直下を含むセラミック基板裏面と支
持板表面とが直接又は高熱伝導率媒体を介して接触する
ようにセラミック基板と支持板とを接着させたことを特
徴とするサーマルヘッド。(1) In a thermal head in which heating resistors are arranged on the surface of a ceramic substrate along the longitudinal direction of the ceramic substrate, and the ceramic substrate is bonded to the surface of a support plate with an adhesive, a position directly below the heating resistor is provided. An adhesive-filled groove is provided along the longitudinal direction of the ceramic substrate at a position on the surface of the support plate away from the ceramic substrate, and an elastic adhesive is filled in the groove as an adhesive, so that the back surface of the ceramic substrate including the area immediately below the heating resistor and the support plate are A thermal head characterized in that a ceramic substrate and a support plate are bonded to each other so that the surfaces thereof are in direct contact or through a high thermal conductivity medium. （２）発熱抵抗体直下を含むセラミック基板裏面と支持
板表面とが高熱伝導率媒体を介して接触している構造で
あって、支持板表面に接着剤充填溝に沿って細い溝を設
けた実用新案登録請求の範囲第１項に記載のサーマルヘ
ッド。　゛(2) A structure in which the back surface of the ceramic substrate, including the area immediately below the heating resistor, and the surface of the support plate are in contact with each other via a high thermal conductivity medium, and a narrow groove is provided on the surface of the support plate along the adhesive filling groove. A thermal head according to claim 1 of the utility model registration claim.゛
JP18813581U 1981-12-16 1981-12-16 thermal head Pending JPS5892055U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18813581U JPS5892055U (en) 1981-12-16 1981-12-16 thermal head

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18813581U JPS5892055U (en) 1981-12-16 1981-12-16 thermal head

Publications (1)

Publication Number Publication Date
JPS5892055U true JPS5892055U (en) 1983-06-22

Family

ID=29991447

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18813581U Pending JPS5892055U (en) 1981-12-16 1981-12-16 thermal head

Country Status (1)

Country Link
JP (1) JPS5892055U (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5863473A (en) * 1981-10-13 1983-04-15 Oki Electric Ind Co Ltd thermal head
JPH02229052A (en) * 1989-03-01 1990-09-11 Kyocera Corp Thermal head
JP2013071365A (en) * 2011-09-28 2013-04-22 Toshiba Hokuto Electronics Corp Thermal print head

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5070037A (en) * 1973-10-24 1975-06-11

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5070037A (en) * 1973-10-24 1975-06-11

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5863473A (en) * 1981-10-13 1983-04-15 Oki Electric Ind Co Ltd thermal head
JPH02229052A (en) * 1989-03-01 1990-09-11 Kyocera Corp Thermal head
JP2013071365A (en) * 2011-09-28 2013-04-22 Toshiba Hokuto Electronics Corp Thermal print head

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