JPS5893395A - Connecting method - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for connecting two objects, and in particular to a method for automatically and accurately aligning two objects, even when it is difficult to confirm the geometrical alignment of the two objects with high accuracy. It concerns possible connection methods.

In recent years, various processing techniques have become more precise, and high-precision positioning of various connections has become important. However, if the location where these connections should be made cannot be observed at the time of making the connection, it is very difficult to make accurate connections, and conventionally, a separate mark for the eyelet was used. This has either been done by carefully making the connections, or connections have been made with low precision by leaving some margin in the connection area. However, there is a drawback that the production time becomes longer if the alignment mark is made, and also, with low-precision connections, the utilization of the jaw surface becomes low, resulting in a small area and multiple points. The object of the present invention is to provide a completely new connection method that solves these drawbacks.

According to the present invention, a metal layer or an alloy layer which has a lower melting point than other parts of the two parts and has a larger surface tension when melted is provided on the surfaces of two parts to be connected, and A molten layer is formed from the metal layer or the metal alloy by bringing the parts close to each other and raising the temperature to a temperature higher than the melting point of the metal layer or the metal alloy, then welding the molten layer, and then
There is obtained a connecting method characterized in that the two parts are left to stand for a certain period of time and the two parts are automatically brought into alignment due to the surface tension of the molten layer, and then the temperature is lowered and fixed.
According to the present invention, it is possible to obtain a connection method as set forth in claim 1, in which the temperature is lowered and fixed by applying pressure to the entire member before lowering the temperature.

The details of this invention will be explained below using an example.

Figure 1 is a schematic plan view for explaining one embodiment. l is a 2.5clL square opaque quartz plate, 21,2
2.23.24.25 has a gold-tin thread low melting point solder attached on a 5ioi square thick gold plated layer (hereinafter this part will be abbreviated as the plated surface) 26 and 27 have minute dimensions It is a through hole. In this case, the plated surface 21S
I25 and through hole 26.27. It is necessary to align and bond two similar quartz plates having .

However, when cutting out the quartz plate, there was a deviation of 1 inch in both the vertical and horizontal directions from the correct cut point, so when the two cut quartz plates were overlapped with the edges of the quartz plates as a reference, the result was as shown in Figure 2.
The plated surfaces of 54 sides overlap only at the parts indicated by 31, 32, 33, 34° 35, and as for the through holes, the lower through hole 261.271 has no electrical contact with the upper through hole 262.272. Therefore, it no longer plays the role of a through hole.

However, in this case, the plated surface 2 to 5 in Figure 1 is
Gold-tin based low melting point solder is applied to a thickness of 2 on top of the gold plating layer.
Because the adhesive is as thick as microns and has a large surface tension, when the temperature is raised in the state shown in Figure 2 and the low melting point solder is melted, the upper and lower solders are connected at the contact surfaces 31-35, so the solder As if the surface area were to be reduced:::1: As if the surface area were to be reduced, the molten solder layers on the upper and lower sides would gradually move so that the overlap between them would increase, and eventually the through-holes would overlap.

Figure 3 is a schematic cross-sectional view to explain the reason why through holes overlap. It is a cross section,
(B) The figure shows the situation when the quartz plate moves due to surface tension and the upper and lower plated surfaces completely overlap.

In the figure, 11 is the lower quartz plate 12, the upper quartz plate 211 is the lower gold plating layer, 212 is the upper gold plating layer, 4
is a low melting point solder. The thick line in the figure shows the surface of the low melting point solder 4.Comparing (a) and (b), the surface area of the low melting point solder is smaller in the case of (a) and (b), and from the viewpoint of surface tension, It is clear that (b) is more stable than (e), and this is the reason why automatic number τ alignment is performed.

After this was achieved, by lowering and fixing the temperature, the two sample pieces were able to be automatically connected with high precision without having to be forcibly aligned from the outside. Furthermore, applying vibrations such as ultrasonic waves while the solder is melting has the advantage of shortening the alignment time and increasing alignment accuracy.

Furthermore, when alignment is completed, pressure is applied to the sample,
By making the solder part thinner, it is possible to connect the 12 sample surfaces more closely, and furthermore, the molten solder that seeps out at this time can be collected in the recess provided on the quartz plate near the plated surface. It was possible to prevent unnecessary solder from spreading to the surrounding area, and by placing gold-plated doves in the recesses of the quartz plates, it was also possible to eventually make the quartz plates stick together.

In addition, in this example, the solder is limited to a gold-tin thread low melting point solder, and the plating layer is limited to gold, but the plating layer is simply a metal such as aluminum obtained by vapor deposition or other techniques. It may be a layer or a multilayer structure thereof, and there is no need to limit the components of the solder; for example, a gold-silicon surface could be used. In addition, although this example describes only the case where the through holes are aligned, it is also possible that the optical fibers may be embedded in the through holes or other minute metal electrodes may be used instead of the through holes. It's self-evident. Further, although an opaque quartz plate is used in this embodiment, it is obvious that a silicon substrate, a GaAs substrate, or other opaque plate may be used.

[Brief explanation of drawings]

Fig. 81 is a diagram for explaining an embodiment of the present invention and a conventional example, and is a schematic plan view of an opaque quartz plate having a through hole and a gold-plated Jt [gold-tin based low melting point solder layer on the surface] part. It is. FIG. 2 is a schematic plan view of two quartz plates shown in FIG. 1 stacked and bonded together. FIG. 3 is a schematic cross-sectional view of two quartz plates for explaining a situation in which two quartz plates are aligned and bonded together by the method of the present invention. The numbers in the figure indicate the following, respectively. 1.
11.12-... Opaque quartz plate, 21. ,
22.23.24゜25......The part where the gold-tin based low melting point solder layer is placed on the gold plating layer, 26,
2)...-...Through hole, 31°32, 33
．． 34.35...;...-The overlapping part of the gold-tin based low melting point solder layer placed on the gold plating layer of the upper and lower quartz plates, 261.271...・Through hole in the lower quartz plate, 262.272=・・・・・・−
Through hole 4 in 411 quartz plate... Gold-tin based low melting point solder layer, 211.212...
...Gold plating layer. Hair 1 drawing semi-Otsu times

Claims (1)

[Claims] 1. The metal layer or the alloy has a melting point lower than other parts of the two parts and is heated to a temperature higher than the surface tension point during melting on the surfaces of the two parts to be connected. A molten layer is formed from the layer, and then the molten layer is brought into contact with the jaws, and then left for a certain period of time until the surface tension of the molten layer automatically brings the two parts into alignment. A patented connection method that lowers and fixes the temperature. 2. WhThe connection method according to claim 1, in which pressure is applied to the entire structure and the temperature is lowered and fixed while the pressure is applied, before overflowing. (1)