JPS589785A - Laser working device - Google Patents

Laser working device

Info

Publication number
JPS589785A
JPS589785A JP56105558A JP10555881A JPS589785A JP S589785 A JPS589785 A JP S589785A JP 56105558 A JP56105558 A JP 56105558A JP 10555881 A JP10555881 A JP 10555881A JP S589785 A JPS589785 A JP S589785A
Authority
JP
Japan
Prior art keywords
laser
laser beam
workpiece
signal
photoelectric element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56105558A
Other languages
Japanese (ja)
Other versions
JPS5933477B2 (en
Inventor
Minoru Kobayashi
実 小林
Susumu Hoshinouchi
星之内 進
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
National Institute of Advanced Industrial Science and Technology AIST
Original Assignee
Agency of Industrial Science and Technology
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Agency of Industrial Science and Technology filed Critical Agency of Industrial Science and Technology
Priority to JP56105558A priority Critical patent/JPS5933477B2/en
Publication of JPS589785A publication Critical patent/JPS589785A/en
Publication of JPS5933477B2 publication Critical patent/JPS5933477B2/en
Expired legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)

Abstract

PURPOSE:To position part to be worked of a work and a laser beam coaxial easily and perform highly accurate laser working by providing an element that detects reflected beam at the tip of a working head in a laser working device. CONSTITUTION:When a laser beam 2 is not irradiated on a welded part 7 of a work, most part of the laser beam 2 is reflected, and the reflected beam 11 passes through a filter 12 attached to the tip face of a working head 5, absorbed by a photoelectric element 10 and converted to an electric signal. A comparator circuit 13 compares the signal from the photoelectric element 10 with an electric signal corresponding to the welded part 7 set beforehand, and outputs the signal of difference to an arithmetic circuit 10. The arithmetic circuit 10 operates the amount of movement of a working stand 8 basing on the signal from the comparator circuit 13 and outputs a signal to a driving motor 9. The driving motor 9 is operated and welded part of the work 6 is set at the position of irradiation of the laser beam 2.

Description

【発明の詳細な説明】 この発明はレーザ加工装置に関するものであ)、特にレ
ーザ加工における被加工物の被加工部を検出する装置を
有するレーザ加工装置に関するものである。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a laser processing apparatus, and more particularly to a laser processing apparatus having a device for detecting a processed portion of a workpiece during laser processing.

従来、とあ種の装置−とじて第1図に示す吃のがあった
。図に・おいて、olはレーザビームを発生jるレーザ
発振器、C2)はレーザ発振器(1]よ〕出力された一
一ザビーム、(3)はレーザビームυ)の方向を変える
全反射鏡、(4Iはレーザビーム(21を集束する集光
レンズ、G5)は加工ヘッド、(6Ji被加工物、(7
)は被“加□工物(61i被゛加工部、(81Fi被ゎ
工物晶′1支持、6・加工台、(91tjm工台□ゎす
る駆動モータである。ここでは、被加工物(6)の被加
工部(7)に溶!l′を株す場合について説明する。
In the past, there was a certain type of device that stuttered, as shown in FIG. In the figure, ol is a laser oscillator that generates a laser beam, C2) is a single laser beam output from the laser oscillator (1), and (3) is a total reflection mirror that changes the direction of the laser beam υ. (4I is the condensing lens that focuses the laser beam (21), G5 is the processing head, (6Ji is the workpiece, (7
) is the workpiece (61i workpiece part, (81Fi workpiece crystal '1 support, 6-processing table, (91tjm workbench□ゎ drive motor.) Here, the workpiece ( The case of stocking the molten !l' in the processed part (7) in 6) will be explained.

次に動作につ込て説明する。レーザ発振器(l)かも放
出されたレーザビーム(21は、被加工物(61に対し
て垂直に照射されるべく全反射鏡(3)によ)折曲され
る。その後レーザビーム(21ti集光レンズ(4:に
より集束され、加工ヘッド(5)を通過して被加工物(
6)の被溶接部(7)に照射される。加工ヘッド(5)
゛には必要に応じてシールドガスが導入され、被加工物
(61へ噴射されることがある。
Next, the operation will be explained in detail. The laser beam (21) emitted by the laser oscillator (l) is bent by the total reflection mirror (3) to be irradiated perpendicularly to the workpiece (61).Then, the laser beam (21ti) is focused It is focused by the lens (4:) and passes through the processing head (5) to the workpiece (
6), the part to be welded (7) is irradiated. Processing head (5)
A shielding gas may be introduced to the workpiece (61) as needed, and may be injected to the workpiece (61).

ここで、被加工物(6)の被溶接部(7)と集束された
レーザビーム(2シとを一致させるために、低出力のレ
ーザビーム(2)ヲ短時間被加工物(61K照射し、そ
の溶融した跡痕によシ被溶接部(7)とレーザビーム(
21との位置関係を確認し、その都度。
Here, in order to match the part to be welded (7) of the workpiece (6) with the focused laser beam (2), the workpiece (61K) was irradiated for a short time with the low-power laser beam (2). , the welded part (7) and the laser beam (
Check the positional relationship with 21 each time.

被S接部(7)とレーザビーム+21とを一致させるべ
く加工台(8;を駆動モータ(91によ)移動させてい
た。
The processing table (8) was moved by the drive motor (91) in order to align the S-contacted part (7) with the laser beam +21.

従来のレーザ加工装置は以上のようK11ljltされ
ているので、被加工物の被加工部とレーザビームの位置
を一致させるための準備に長い時間を貴し、かつこの一
致作業において被溶接物にレーザビームの不要の跡痕を
多量に残すことになり、溶接後、被溶接物の美観を損ね
、さらには、信頼性が乏しいため、しばしば目的とする
溶接部と実際にレーザビームによシ溶接された部分との
不一致を生じ、力O工の歩留シを低下させていた。
Conventional laser processing equipment is operated as described above, so it takes a long time to prepare to match the position of the laser beam with the part to be welded. The beam leaves a large amount of unnecessary traces, spoiling the appearance of the workpiece after welding, and furthermore, due to poor reliability, it is often the case that the intended welding area is not actually welded by the laser beam. This caused discrepancies with the parts that had been applied, reducing the yield of the mechanical process.

この発明は上記のような従来のものの欠点を除去するた
め罠なされたもので、加工ヘッドのノズル部に被加工物
からの反射ビームを検出する素子を設けることによシ、
被加工物の被加よる。第2図はこの発明の一実施例を示
し2図において、 01は加工ヘッド(5)のノズル部
に配設された光電素子であシ、被加工物(6)表面から
の反   ゛射ビームαυを検出し電気信号に変えて出
力するものである。a3は光電素子軸の!!面に貼付さ
れたフィルタであシ、レーザビーム(2)より小さい波
長の電磁波を吸収する材料よシなる。Oat;を光電素
子軸から出力された電気信号を、設定値と比較して差信
号を出力する比較回路、0mは比較回路0より出力され
た信号に基づき加工台(81を適正な位tK移動させる
駆動モータ(9)を駆動するための電気信号を出力する
演算回路である。
This invention was made in order to eliminate the drawbacks of the conventional ones as described above, and by providing an element in the nozzle part of the processing head to detect the reflected beam from the workpiece,
Depends on the load applied to the workpiece. Fig. 2 shows one embodiment of the present invention, and in Fig. 2, 01 is a photoelectric element disposed in the nozzle part of the processing head (5), and a reflected beam from the surface of the workpiece (6) is emitted. It detects αυ, converts it into an electrical signal, and outputs it. a3 is the photoelectric element axis! ! The filter attached to the surface is made of a material that absorbs electromagnetic waves with a wavelength smaller than that of the laser beam (2). Oat; is a comparison circuit that compares the electric signal output from the photoelectric element axis with a set value and outputs a difference signal. This is an arithmetic circuit that outputs an electric signal to drive the drive motor (9).

図中、第1図と同一部分に/11同一同一管付しである
In the figure, /11 has the same tube attached to the same part as in FIG. 1.

次に、この実施例装置の動作にりbて説明する。ここで
は、レーザ溶接を行なう場合について説明する。レーザ
加工装置において、第2図に示すように、レーザビーム
C2Iが被加工物(6)の被溶接部(71K照射されて
いない場合は、レーザビーム(2)の大部分が反射し1
反射ビームαDは加声透過し、光!素子II・に吸収さ
れ電気信号に変―される。また、比較回路a3は、光電
素子軸か、ぶ゛ らの信号を、ibらかじめ設定された被溶接部(7)K
相当する電気信号値と比較し、その差の信号を演算回路
軸に出力する。演算回路aaでは比較回路側からの信号
に基づき、加工台(8)の移動量を演算し駆動モータ(
9)K信号を出力する。その結果、駆動モータ(9)が
作動され、被加工物(6)の被溶接部(1)はレーザビ
ーム(21の照射位置に設定されることになる。
Next, the operation of this embodiment device will be explained. Here, a case will be described in which laser welding is performed. In the laser processing device, as shown in Fig. 2, when the laser beam C2I is not irradiated with the part to be welded (71K) of the workpiece (6), most of the laser beam (2) is reflected and 1
The reflected beam αD is transmitted with added force and becomes light! It is absorbed by element II and converted into an electrical signal. Further, the comparison circuit a3 converts the signals from the photoelectric element axis to the welded part (7) K which is set in advance from ib.
It is compared with the corresponding electric signal value and outputs the difference signal to the arithmetic circuit axis. The arithmetic circuit aa calculates the amount of movement of the processing table (8) based on the signal from the comparison circuit side and controls the drive motor (
9) Output K signal. As a result, the drive motor (9) is activated, and the welded part (1) of the workpiece (6) is set at the irradiation position of the laser beam (21).

また、第3図及び第4図は2本発明の詳細な説明するた
めのものである。第3図(a>に示すように、レーザビ
ーム(2)の照射部が継手部(7)から完全に逸脱して
いる場合、被加工物(6)の平坦な表面からの反射ビー
ム(IIは大部分が上方に設けられた光電素子−に吸収
されるととKなる。したがって、第4図alliに示す
ように検出される電流も大きな値(工a)となる。また
、第3図(1))に示すように、レーザビ、 −A (
11が竺加工物(2)のダレ部分に照射された場合9反
射ビーム仙の方向が不規則になシ、光電素子員に吸収さ
れるビーム量も第3図(a) K示す場合よシ少なくな
る。
Further, FIGS. 3 and 4 are for explaining the present invention in detail. As shown in FIG. 3(a), when the irradiation part of the laser beam (2) completely deviates from the joint part (7), the reflected beam (II) from the flat surface of the workpiece (6) If most of the current is absorbed by the photoelectric element provided above, it becomes K. Therefore, the current detected as shown in FIG. As shown in (1)), laser beam, −A (
When 11 is irradiated onto the sagging part of the textile workpiece (2), the direction of the reflected beam 9 will be irregular, and the amount of beam absorbed by the photoelectric element will also be similar to that shown in Figure 3(a) K. It becomes less.

従って、@4図blis[示すような電流が検出される
ことになる。さらKjlI1図(C)に示すように。
Therefore, a current as shown in Figure 4 blis will be detected. Further KjlI1 as shown in Figure (C).

レーザビーム(21が被加工物(6)の継手部(7)K
完全に照射された場合、被加工物(61の上方への反射
はほとんど起こらなくなり、光電素子aOK検出、され
る反射ビーム量も、第4図cs4c示すよう;に、a小
値(工。)を示すことになる。 したがって、光電素子
61に検出される反射ビームが最小値を示す位置を連続
して溶接することによ〕。
Laser beam (21 is the joint part (7) K of the workpiece (6)
When the workpiece is completely irradiated, there is almost no upward reflection of the workpiece (61), and the amount of reflected beam detected by the photoelectric element aOK is as shown in Fig. 4 cs4c; Therefore, by continuously welding the positions where the reflected beam detected by the photoelectric element 61 shows the minimum value].

継手部の溶接が達成される。Welding of the joint is achieved.

なお、上記実施例でFi、レーザビームを固定させた例
を示したが、レーザビームを振動もしくは水平移動させ
ても溶接線を検出することができる。
In the above embodiment, an example was shown in which Fi and the laser beam were fixed, but the weld line can also be detected even if the laser beam is vibrated or moved horizontally.

また、上記実施例ではレーザ溶接における被溶接部、即
ち突合せ継手部の検出について説明したが、被加工部表
面がケガキ線などの屈曲部を有しておれば、切断、穴あ
け、トリミング等信のレーザ加工にも本発明装!!を適
用できる。
In addition, in the above embodiment, detection of the welded part in laser welding, that is, the butt joint part, was explained, but if the surface of the part to be processed has a bent part such as a marking line, cutting, drilling, trimming, etc. This invention also applies to laser processing! ! can be applied.

以上のように、この発明装置によれば1反射ビームを検
出する素子を加工ヘッド先端に設けているので、被加工
物の被加工部とレーザビームとの同軸化が容易にfk6
.かクレーザ加工中においてもレーザビーム照射位置の
良否の判定が可能となシ、高精度のレーザ加工が行なえ
る効果がある。
As described above, according to the device of the present invention, since the element for detecting one reflected beam is provided at the tip of the processing head, it is easy to make the processing part of the workpiece and the laser beam coaxial.
.. Moreover, it is possible to judge whether the laser beam irradiation position is good or bad even during laser processing, and it is possible to perform highly accurate laser processing.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は従来のレーザ加工装置を示す概略図。 !ビーム照射点との距離とそれに対応して検出される電
流との関係を示す図である。 (21レーザビーム、(6)被加工物、 (71’突合
せ部。 αυ反射レーザビーム、鱒光電素子、aυフィルタ。 a薯比較回路、 Q41演算回路。 なお1図中、同一符号は同一、又は相当部分を示す。 出願人 工業技術院長 石板誠− 第4図 唾讃乎末撃力゛5の距1佳
FIG. 1 is a schematic diagram showing a conventional laser processing device. ! FIG. 6 is a diagram showing the relationship between the distance to the beam irradiation point and the detected current corresponding thereto. (21 laser beam, (6) workpiece, (71' butt part. αυ reflected laser beam, trout photoelectric element, aυ filter. Applicant Makoto Ishiita, Director General of the Agency of Industrial Science and Technology

Claims (1)

【特許請求の範囲】[Claims] (1) 被加工物の被加工部である屈曲部にレーザ発振
器よシ発生したレーザビームを集光させ照射しレーザ加
工を施すレーザ加工装置において、上記レーザ発振器の
レーザビームの出力部近傍に配設され、上記被加工物表
面からの反射ビームを検出し電気信号を出力する光電素
子と、上記光電素子の被加工物側に取付けられたレーザ
光透過フィルタと、上記光電素子からの出力信号と上記
屈曲部に対応する基準信号とを比較し差信号を出力する
比較回路と、上記比較回路からの出力信号によ)し□−
ザビーム照射の麺正位置を演°算し、上記被加工物tた
けレーザ発振器の位置゛を修正゛する駆動装置に信号を
出力する演算回路とを備えたことを特徴とするレーザ加
工装置。 +21  被加工物の屈曲部を二個の被加工物端面を突
合せた継手部としたことを特徴とする特許請求の範囲第
(11項゛記載のレーザ加工装置。□(3)  レーザ
加工はレーザ溶接とした仁とi特徴とする特許請求の範
囲第12)項記載のレーザ加工装置。
(1) In a laser processing device that performs laser processing by condensing and irradiating a laser beam generated by a laser oscillator onto a bent portion of a workpiece, which is the processed portion, a laser beam disposed near the output portion of the laser beam of the laser oscillator is used. a photoelectric element configured to detect a reflected beam from the surface of the workpiece and output an electric signal; a laser light transmission filter attached to the workpiece side of the photoelectric element; and an output signal from the photoelectric element. A comparison circuit that compares the reference signal corresponding to the bent portion and outputs a difference signal, and an output signal from the comparison circuit
1. A laser processing device comprising: a calculation circuit that calculates the correct position of the laser beam irradiation and outputs a signal to a drive device that corrects the position of the laser oscillator by the amount of the workpiece. +21 The laser processing apparatus according to claim 11 (claim 11), characterized in that the bent portion of the workpiece is a joint portion where the end surfaces of two workpieces abut against each other. A laser processing apparatus according to claim 12, characterized in that the welding process is performed by welding.
JP56105558A 1981-07-08 1981-07-08 Laser processing equipment Expired JPS5933477B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56105558A JPS5933477B2 (en) 1981-07-08 1981-07-08 Laser processing equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56105558A JPS5933477B2 (en) 1981-07-08 1981-07-08 Laser processing equipment

Publications (2)

Publication Number Publication Date
JPS589785A true JPS589785A (en) 1983-01-20
JPS5933477B2 JPS5933477B2 (en) 1984-08-16

Family

ID=14410871

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56105558A Expired JPS5933477B2 (en) 1981-07-08 1981-07-08 Laser processing equipment

Country Status (1)

Country Link
JP (1) JPS5933477B2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61206584A (en) * 1985-03-08 1986-09-12 Nippon Kogaku Kk <Nikon> Substrate processing equipment
JPS63184810A (en) * 1987-01-28 1988-07-30 Amada Co Ltd Working locus tracking device for work
JPS63184809A (en) * 1987-01-28 1988-07-30 Amada Co Ltd Working locus tracking device for three-dimensional work

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61206584A (en) * 1985-03-08 1986-09-12 Nippon Kogaku Kk <Nikon> Substrate processing equipment
JPS63184810A (en) * 1987-01-28 1988-07-30 Amada Co Ltd Working locus tracking device for work
JPS63184809A (en) * 1987-01-28 1988-07-30 Amada Co Ltd Working locus tracking device for three-dimensional work

Also Published As

Publication number Publication date
JPS5933477B2 (en) 1984-08-16

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