JPS5911679B2 - Nickel-chromium alloy plating method - Google Patents
Nickel-chromium alloy plating methodInfo
- Publication number
- JPS5911679B2 JPS5911679B2 JP12900780A JP12900780A JPS5911679B2 JP S5911679 B2 JPS5911679 B2 JP S5911679B2 JP 12900780 A JP12900780 A JP 12900780A JP 12900780 A JP12900780 A JP 12900780A JP S5911679 B2 JPS5911679 B2 JP S5911679B2
- Authority
- JP
- Japan
- Prior art keywords
- nickel
- plating
- current density
- chromium alloy
- chromium
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000007747 plating Methods 0.000 title claims description 44
- 229910000623 nickel–chromium alloy Inorganic materials 0.000 title claims description 19
- 238000000034 method Methods 0.000 title claims description 8
- 239000011651 chromium Substances 0.000 claims description 6
- 238000009713 electroplating Methods 0.000 claims description 5
- 239000011259 mixed solution Substances 0.000 claims description 3
- 150000002500 ions Chemical class 0.000 claims 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 21
- 239000000463 material Substances 0.000 description 11
- 229910052759 nickel Inorganic materials 0.000 description 11
- 239000000243 solution Substances 0.000 description 7
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 4
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 229910052804 chromium Inorganic materials 0.000 description 3
- 238000000576 coating method Methods 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 238000005336 cracking Methods 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000001878 scanning electron micrograph Methods 0.000 description 2
- 238000007751 thermal spraying Methods 0.000 description 2
- 229910000599 Cr alloy Inorganic materials 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- 229910018487 Ni—Cr Inorganic materials 0.000 description 1
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 1
- 239000000788 chromium alloy Substances 0.000 description 1
- VNNRSPGTAMTISX-UHFFFAOYSA-N chromium nickel Chemical compound [Cr].[Ni] VNNRSPGTAMTISX-UHFFFAOYSA-N 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- 239000013527 degreasing agent Substances 0.000 description 1
- 238000004070 electrodeposition Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 150000002815 nickel Chemical class 0.000 description 1
- 238000005554 pickling Methods 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 235000011149 sulphuric acid Nutrition 0.000 description 1
- 229910052720 vanadium Inorganic materials 0.000 description 1
- LEONUFNNVUYDNQ-UHFFFAOYSA-N vanadium atom Chemical compound [V] LEONUFNNVUYDNQ-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Electroplating And Plating Baths Therefor (AREA)
Description
【発明の詳細な説明】
本発明はニッケル−クロム合金の電気メッキ方法に関し
、特に例えば耐熱合金に対して厚いニッケル−クロム被
膜を与えて耐食性を持たせるようにするメッキ方法に関
する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method of electroplating nickel-chromium alloys, and more particularly to a method of plating a heat-resistant alloy by providing a thick nickel-chromium coating to provide corrosion resistance.
高温におけるバナジウムアタックに対しては、ニッケル
−クロム合金が有効であることは公知であるが、該合金
は加工性が劣る等の欠点を有するので、耐熱金属の表面
にニッケル−クロム合金層を被覆する方法を考えるべき
である。It is well known that nickel-chromium alloy is effective against vanadium attack at high temperatures, but this alloy has drawbacks such as poor workability, so a nickel-chromium alloy layer is coated on the surface of the heat-resistant metal. We should consider ways to do so.
被覆方法としては、溶射法と電気メッキ法が考えられる
。溶射法は母材との密着性が悪いことや、ク？ツクが多
い等の欠点を持つている。一方電気メッキ法によりニッ
ケル−クロム合金を被覆することを試みると、電気析出
したニッケル−クロム合金は非常に内部応力が大きい利
点を有する代りに、厚メッキを施すとクラックが入り、
もろいメッキ層となる欠点を有している。本発明は上記
欠点を除去し、密着性が良くしかもクラックのない厚ニ
ッケル−クロム合金層を得ることのできる電気メッキ方
法を提供するもので５ ある。Possible coating methods include thermal spraying and electroplating. The thermal spraying method has problems such as poor adhesion to the base material and It has drawbacks such as a lot of Tsuku. On the other hand, when attempting to coat a nickel-chromium alloy by electroplating, the electrodeposited nickel-chromium alloy has the advantage of extremely high internal stress, but cracks occur when thick plating is applied.
It has the disadvantage of resulting in a brittle plating layer. The present invention eliminates the above-mentioned drawbacks and provides an electroplating method capable of obtaining a thick nickel-chromium alloy layer with good adhesion and no cracks.
以下本発明の一実施例を図面に基づいて説明する。An embodiment of the present invention will be described below based on the drawings.
溶液中のＮｉ２＋とＣｒ３＋が電気化学的に還元されて
金属のニッケルとクロムが析出される電位はＮｉ２＋の
方がＣｒ３＋より約０．１貴にある。従つ１０てＮｉ２
＋とＣｒ３＋の混合溶液からメッキを行なう場合には、
ニッケルの方がクロムより析出し易いが、電流密度およ
び溶液中のＮｉ２＋とＣｒ３＋の濃度を適当に選定する
と、任意の組成のニッケル−クロム合金層を析出させる
ことが可能となる。こ１５こで溶液中のＮｉ２＋とＣｒ
３＋濃度が決まつているとき、電流密度をｏから徐々に
増加していくと、ニッケルが最初単独に析出される。こ
のニッケルメッキ層は下地との密着性のよい内部応力の
低いメッキである。更に電流密度を増加していき、あ２
０る電流密度（Ｉｔとする）を越えるとニッケルとクロ
ムの合金が析出されるようになる。この合金は内部応力
が高くクラックが入り易い性質を有している。勿論この
Ｉｔは溶液中のＮｉ２＋とＣｒ３＋の濃度により異なる
が、通常のメッキ液組成では２５５〜１０Ａ／ｄｍ″で
ある。本発明の特徴は、母材を脱脂、酸洗い等の前処理
をした後に、Ｎｉ２＋とＣｒ３＋の混合溶液中で、例え
ば第１回目のメッキとしてＩｔ以下の低電流密度でメッ
キを行ない、第２回目のメッキとして３０Ｉｔ以上の高
電流密度でメッキを行なうというように、交互に電流密
度を変えてメッキを行ない、内部応力の低いニッケル層
と内部応力の高いニッケル−クロム合金層を交互に析出
させることによつて厚メッキを行なう点にある。The potential at which Ni2+ and Cr3+ in the solution are electrochemically reduced and the metals nickel and chromium are deposited is about 0.1 nobler for Ni2+ than for Cr3+. Followed by 10 Ni2
When plating from a mixed solution of + and Cr3+,
Although nickel is easier to deposit than chromium, by appropriately selecting the current density and the concentrations of Ni2+ and Cr3+ in the solution, it is possible to deposit a nickel-chromium alloy layer of any composition. At this point, Ni2+ and Cr in the solution
When the 3+ concentration is fixed, when the current density is gradually increased from o, nickel is initially precipitated singly. This nickel plating layer has good adhesion to the base and has low internal stress. Further increasing the current density, A2
When the current density exceeds 0 (denoted as It), an alloy of nickel and chromium begins to be deposited. This alloy has high internal stress and is prone to cracking. Of course, this It varies depending on the concentration of Ni2+ and Cr3+ in the solution, but with a normal plating solution composition, it is 255 to 10 A/dm''. Later, in a mixed solution of Ni2+ and Cr3+, plating is performed at a low current density of It or less for the first plating, and plating is performed at a high current density of 30 It or more for the second plating. The plating process is performed by changing the current density to alternately deposit a nickel layer with low internal stress and a nickel-chromium alloy layer with high internal stress, thereby achieving thick plating.
３５そこで本発明では低電流密度領域を１〜１０Ａ／ｄ
７７Ｚ’に、高電流密度領域を５〜４０Ａ／ｄ７ＦＩ’
に設定する。35 Therefore, in the present invention, the low current density region is 1 to 10 A/d.
77Z', high current density region 5-40A/d7FI'
Set to .
これは低電流密度領域において、１りＡウーＡ／ｄイ未
満では、ニツケルメツキ層の電着速度が低すぎるので、
メツキ時間を非常に多く必要とし、また１０Ａ／ｄイを
越えると、ニツケルメツキ層にクラツクが入つたり、ピ
ンホールが生じたりするので、ニツケルークロム合金メ
ツキ層をつなぐためのニツケルメツキとしては１〜１０
Ａ／ｄイが適当な電流密度範囲となるからである。This is because in the low current density region, if the current density is less than 1 A/d, the electrodeposition rate of the nickel plating layer is too low.
It requires a very long plating time, and if it exceeds 10 A/d, cracks or pinholes may occur in the nickel plating layer, so nickel plating for connecting the nickel-chromium alloy plating layers should be 10
This is because A/d i falls within an appropriate current density range.
また高電流密度領域において、５Ａ／ｄイ未満では溶液
中のＣｒ３＋が高濃度である場合でもクロムが析出せず
、また４０Ａ／ｄイを越えると、Ｃｒ３＋の拡散限界電
流密度以上になり、電着速度が飽和になるからである。
なお１回目のメツキを１〜１０Ａ／ｄイの低電流密度で
行なえば、母材との密着性は非常によくなる。さらに低
電流密度でのメツキと高電流密度でのメツキを行なう場
合の１周期の時間としては０〜２００分とするのがよい
。In addition, in the high current density region, if the current density is less than 5 A/d, chromium will not precipitate even if the concentration of Cr3+ in the solution is high, and if it exceeds 40 A/d, the current density will exceed the diffusion limit current density of Cr3+, and the current density will exceed the diffusion limit current density of Cr3+. This is because the arrival speed becomes saturated.
Note that if the first plating is performed at a low current density of 1 to 10 A/d, the adhesion to the base material will be very good. Furthermore, when plating at low current density and plating at high current density, the time for one cycle is preferably 0 to 200 minutes.
これは、高電流密度で２００分を越えてメツキすると、
ニツケルークロム合金層が厚くなつてクラツクが入るか
らである。次に本発明の具体的な実施例を示す。５母材
の前処理
市販の脱脂剤で脱脂した後、１０％Ｈ２ＳＯ４中で酸洗
いを行なつた。When plating for more than 200 minutes at high current density,
This is because the nickel-chromium alloy layer becomes thicker and cracks occur. Next, specific examples of the present invention will be shown. 5 Pretreatment of base material After degreasing with a commercially available degreaser, pickling was performed in 10% H2SO4.
６電解条件
下記のように低電流密度と高電流密度のメツキを１時間
ごとに繰り返し、合計８時間のメツキを行なつた。6 Electrolytic Conditions Plating at low current density and high current density was repeated every hour as described below, and plating was performed for a total of 8 hours.
上記実施例で調製された試料の断面のＳＥＭ像を観察し
たところ、第１図に示すように、母材に密着してクラツ
クのないメツキ層が見られた。When the SEM image of the cross section of the sample prepared in the above example was observed, as shown in FIG. 1, a plating layer with no cracks was observed in close contact with the base material.
第１図で１は母材、２はニツケルメツキ層、３はニツケ
ルークロム合金メツキ層を示し、ニツケルメツキ層２お
よびニツケルークロム合金メツキ層３はそれぞれ２μｍ
および１０μｍであつた。次に比較例として上記実施例
のうち１〜５までを同じにし、母材の前処理後ＦｌＣ．
２ＯＡ／Ｄｗｌで６時間メツキを行なつて試料を調製し
た。この試料の断面のＳＥＭ像を観察したところ、メツ
キ層にクラツクが入り、母材から剥離しているのが見ら
れた。第２図はこの状態のメツキ層を示し、１１は母材
、１２はニツケルークロム合金メツキ層である。以上本
発明によれば、母材に内部応力の低いニツケルメツキ層
と内部応力の高いニツケルークロム合金メツキ層を交互
に析出させるので、クラツクのない状態で厚メツキを施
すことができ、さらに母材への密着性を良くできるもの
であり、しかも同一メツキ溶液中で単に電流密度を変え
るという操作のみで厚メツキができるので、工程が極め
て単純になる利点を有する。In Fig. 1, 1 is the base material, 2 is the nickel plating layer, and 3 is the nickel-chromium alloy plating layer, and the nickel-plated layer 2 and the nickel-chromium alloy plating layer 3 are each 2 μm thick.
and 10 μm. Next, as a comparative example, 1 to 5 of the above embodiments were the same, and after pretreatment of the base material, FlC.
Samples were prepared by plating at 2OA/Dwl for 6 hours. When the SEM image of the cross section of this sample was observed, it was observed that the plating layer had cracks and had peeled off from the base material. FIG. 2 shows the plating layer in this state, where 11 is the base material and 12 is the nickel-chromium alloy plating layer. As described above, according to the present invention, since the nickel plating layer with low internal stress and the nickel-chromium alloy plating layer with high internal stress are deposited alternately on the base material, thick plating can be performed without cracking, and furthermore, the base material can be plated thickly without cracks. Moreover, thick plating can be achieved by simply changing the current density in the same plating solution, which has the advantage of making the process extremely simple.
第１図は本発明の一実施例によるメツキ層の拡大断面図
、第２図は比較例によるメツキ層の拡大断面図である。
１・・・・・・母材、２・・・・・・ニツケルメツキ層
、３・・・・・・ニツケルークロム合金メツキ層。FIG. 1 is an enlarged sectional view of a plating layer according to an embodiment of the present invention, and FIG. 2 is an enlarged sectional view of a plating layer according to a comparative example. 1... Base material, 2... Nickel plating layer, 3... Nickel-chromium alloy plating layer.
Claims (1)
メッキを行ない、ニッケル−クロム合金層を得る際に、
低電流密度によるメッキと高電流密度によるメッキとを
交互に行ない、厚いニッケル−クロム合金層を得ること
を特徴とするニッケル−クロム合金メッキ方法。1 When electroplating is performed in a mixed solution containing Ni ions and Cr ions to obtain a nickel-chromium alloy layer,
A nickel-chromium alloy plating method characterized by alternately performing plating with low current density and plating with high current density to obtain a thick nickel-chromium alloy layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12900780A JPS5911679B2 (en) | 1980-09-16 | 1980-09-16 | Nickel-chromium alloy plating method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12900780A JPS5911679B2 (en) | 1980-09-16 | 1980-09-16 | Nickel-chromium alloy plating method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5754295A JPS5754295A (en) | 1982-03-31 |
| JPS5911679B2 true JPS5911679B2 (en) | 1984-03-16 |
Family
ID=14998846
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12900780A Expired JPS5911679B2 (en) | 1980-09-16 | 1980-09-16 | Nickel-chromium alloy plating method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5911679B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0331865U (en) * | 1989-08-08 | 1991-03-28 | ||
| CN106929888A (en) * | 2017-05-03 | 2017-07-07 | 上海电力学院 | A kind of preparation method of lamellar composite nanostructured nickel |
-
1980
- 1980-09-16 JP JP12900780A patent/JPS5911679B2/en not_active Expired
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0331865U (en) * | 1989-08-08 | 1991-03-28 | ||
| CN106929888A (en) * | 2017-05-03 | 2017-07-07 | 上海电力学院 | A kind of preparation method of lamellar composite nanostructured nickel |
| CN106929888B (en) * | 2017-05-03 | 2018-12-14 | 上海电力学院 | A kind of preparation method of lamellar composite nanostructure nickel |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5754295A (en) | 1982-03-31 |
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