JPS5912182U - 発光ダイオ−ド表示器 - Google Patents

発光ダイオ−ド表示器

Info

Publication number
JPS5912182U
JPS5912182U JP1982106888U JP10688882U JPS5912182U JP S5912182 U JPS5912182 U JP S5912182U JP 1982106888 U JP1982106888 U JP 1982106888U JP 10688882 U JP10688882 U JP 10688882U JP S5912182 U JPS5912182 U JP S5912182U
Authority
JP
Japan
Prior art keywords
emitting diode
light emitting
circuit board
light
printed circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1982106888U
Other languages
English (en)
Other versions
JPS6350695Y2 (ja
Inventor
鷲見 明孝
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanyo Electric Co Ltd
Original Assignee
Tottori Sanyo Electric Co Ltd
Sanyo Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tottori Sanyo Electric Co Ltd, Sanyo Electric Co Ltd filed Critical Tottori Sanyo Electric Co Ltd
Priority to JP1982106888U priority Critical patent/JPS5912182U/ja
Publication of JPS5912182U publication Critical patent/JPS5912182U/ja
Application granted granted Critical
Publication of JPS6350695Y2 publication Critical patent/JPS6350695Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/50Bond wires
    • H10W72/531Shapes of wire connectors
    • H10W72/5363Shapes of wire connectors the connected ends being wedge-shaped
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/851Dispositions of multiple connectors or interconnections
    • H10W72/874On different surfaces
    • H10W72/884Die-attach connectors and bond wires
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00Package configurations
    • H10W90/701Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00Package configurations
    • H10W90/701Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第1図は従来の表示器の断面図、第2図は本考案実施例
の発光ダイオード表示器の分解斜視図である。 1・・・プリント基板、2.2・・・導電箔、3,3・
・・透孔、4.4・・・発光ダイオード、6・・・遮光
枠、7゜7・・・透孔、8,8・・・突出ピン、10・
・・舌片。

Claims (1)

    【実用新案登録請求の範囲】
  1. 透孔を有したプリント基板と、そのプリント基板の導電
    箔上に載置固着された発光ダイオードと、その発光ダイ
    オードを覆い、突出ピンを前記透孔に挿入してプリント
    基板に固着された樹脂製の遮光枠とを具備した発光ダイ
    オード表示器に於て、前記突出ピンは遮光枠の周縁部に
    設けであると共に、その突出ピンのある遮光枠の端縁に
    はプリント基板の表面に当接する薄膜状の舌片が設けで
    ある事を特徴とする発光ダイオード表示器。
JP1982106888U 1982-07-13 1982-07-13 発光ダイオ−ド表示器 Granted JPS5912182U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1982106888U JPS5912182U (ja) 1982-07-13 1982-07-13 発光ダイオ−ド表示器

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1982106888U JPS5912182U (ja) 1982-07-13 1982-07-13 発光ダイオ−ド表示器

Publications (2)

Publication Number Publication Date
JPS5912182U true JPS5912182U (ja) 1984-01-25
JPS6350695Y2 JPS6350695Y2 (ja) 1988-12-27

Family

ID=30249953

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1982106888U Granted JPS5912182U (ja) 1982-07-13 1982-07-13 発光ダイオ−ド表示器

Country Status (1)

Country Link
JP (1) JPS5912182U (ja)

Also Published As

Publication number Publication date
JPS6350695Y2 (ja) 1988-12-27

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