JPS59124824A - 電磁波遮蔽性合成樹脂射出成形品の製造方法 - Google Patents

電磁波遮蔽性合成樹脂射出成形品の製造方法

Info

Publication number: JPS59124824A
Authority: JP; Japan
Prior art keywords: temperature; mold; synthetic resin; molds; molding
Prior art date: 1983-01-05
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Granted

Application number

JP3983A

Other languages

English (en)

Japanese (ja)

Other versions

JPH0225323B2 (2

Inventor

Toru Murayama

徹村山

Yoshinobu Ogura

小椋　慶喜

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Toshiba Chemical Products Co Ltd

Kyocera Chemical Corp

Original Assignee

Toshiba Chemical Products Co Ltd

Toshiba Chemical Corp

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1983-01-05

Filing date

1983-01-05

Publication date

1984-07-19

1983-01-05 Application filed by Toshiba Chemical Products Co Ltd, Toshiba Chemical Corp filed Critical Toshiba Chemical Products Co Ltd

1983-01-05 Priority to JP3983A priority Critical patent/JPS59124824A/ja

1984-07-19 Publication of JPS59124824A publication Critical patent/JPS59124824A/ja

1990-06-01 Publication of JPH0225323B2 publication Critical patent/JPH0225323B2/ja

Status Granted legal-status Critical Current

Links

229920003002 synthetic resin Polymers 0.000 title claims abstract description 20
239000000057 synthetic resin Substances 0.000 title claims abstract description 20
238000004519 manufacturing process Methods 0.000 title claims description 9
238000001746 injection moulding Methods 0.000 title description 4
XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 26
239000011231 conductive filler Substances 0.000 claims abstract description 8
238000002347 injection Methods 0.000 claims abstract description 8
239000007924 injection Substances 0.000 claims abstract description 8
241000257465 Echinoidea Species 0.000 claims description 2
238000000034 method Methods 0.000 abstract description 11
238000000465 moulding Methods 0.000 abstract description 10
229910000831 Steel Inorganic materials 0.000 abstract description 5
239000010959 steel Substances 0.000 abstract description 5
238000001816 cooling Methods 0.000 abstract description 4
239000000463 material Substances 0.000 abstract description 3
239000000498 cooling water Substances 0.000 abstract 1
229910052751 metal Inorganic materials 0.000 description 10
239000002184 metal Substances 0.000 description 10
230000000694 effects Effects 0.000 description 8
239000000835 fiber Substances 0.000 description 5
229920005989 resin Polymers 0.000 description 5
239000011347 resin Substances 0.000 description 5
230000000052 comparative effect Effects 0.000 description 4
PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 4
239000010931 gold Substances 0.000 description 4
229910052737 gold Inorganic materials 0.000 description 4
OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 3
DMFGNRRURHSENX-UHFFFAOYSA-N beryllium copper Chemical compound [Be].[Cu] DMFGNRRURHSENX-UHFFFAOYSA-N 0.000 description 3
229910052799 carbon Inorganic materials 0.000 description 3
239000000843 powder Substances 0.000 description 3
229920000049 Carbon (fiber) Polymers 0.000 description 2
239000004917 carbon fiber Substances 0.000 description 2
239000000945 filler Substances 0.000 description 2
VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
150000003839 salts Chemical class 0.000 description 2
229910000838 Al alloy Inorganic materials 0.000 description 1
235000017166 Bambusa arundinacea Nutrition 0.000 description 1
235000017491 Bambusa tulda Nutrition 0.000 description 1
241001330002 Bambuseae Species 0.000 description 1
229910001369 Brass Inorganic materials 0.000 description 1
RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
235000015334 Phyllostachys viridis Nutrition 0.000 description 1
239000004952 Polyamide Substances 0.000 description 1
239000004743 Polypropylene Substances 0.000 description 1
239000004793 Polystyrene Substances 0.000 description 1
208000027418 Wounds and injury Diseases 0.000 description 1
229910045601 alloy Inorganic materials 0.000 description 1
239000000956 alloy Substances 0.000 description 1
239000011425 bamboo Substances 0.000 description 1
235000021167 banquet Nutrition 0.000 description 1
229910052790 beryllium Inorganic materials 0.000 description 1
ATBAMAFKBVZNFJ-UHFFFAOYSA-N beryllium atom Chemical compound [Be] ATBAMAFKBVZNFJ-UHFFFAOYSA-N 0.000 description 1
230000015572 biosynthetic process Effects 0.000 description 1
239000010951 brass Substances 0.000 description 1
239000004020 conductor Substances 0.000 description 1
229910052802 copper Inorganic materials 0.000 description 1
239000010949 copper Substances 0.000 description 1
230000007797 corrosion Effects 0.000 description 1
238000005260 corrosion Methods 0.000 description 1
230000006378 damage Effects 0.000 description 1
230000002542 deteriorative effect Effects 0.000 description 1
238000010586 diagram Methods 0.000 description 1
239000006185 dispersion Substances 0.000 description 1
238000001035 drying Methods 0.000 description 1
238000007710 freezing Methods 0.000 description 1
230000008014 freezing Effects 0.000 description 1
208000014674 injury Diseases 0.000 description 1
238000009434 installation Methods 0.000 description 1
230000002452 interceptive effect Effects 0.000 description 1
238000002156 mixing Methods 0.000 description 1
239000012778 molding material Substances 0.000 description 1
238000010422 painting Methods 0.000 description 1
239000002245 particle Substances 0.000 description 1
238000007747 plating Methods 0.000 description 1
229920002647 polyamide Polymers 0.000 description 1
239000004431 polycarbonate resin Substances 0.000 description 1
229920005668 polycarbonate resin Polymers 0.000 description 1
229920013716 polyethylene resin Polymers 0.000 description 1
-1 polypropylene Polymers 0.000 description 1
229920001155 polypropylene Polymers 0.000 description 1
229920002223 polystyrene Polymers 0.000 description 1
239000004800 polyvinyl chloride Substances 0.000 description 1
229920000915 polyvinyl chloride Polymers 0.000 description 1
230000035939 shock Effects 0.000 description 1
238000003786 synthesis reaction Methods 0.000 description 1
238000007751 thermal spraying Methods 0.000 description 1
229920001169 thermoplastic Polymers 0.000 description 1
239000004416 thermosoftening plastic Substances 0.000 description 1
230000035922 thirst Effects 0.000 description 1
210000002105 tongue Anatomy 0.000 description 1

Classifications

- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/72—Heating or cooling
- B29C45/73—Heating or cooling of the mould
- B29C45/7306—Control circuits therefor

Landscapes

Engineering & Computer Science (AREA)
Manufacturing & Machinery (AREA)
Mechanical Engineering (AREA)
Injection Moulding Of Plastics Or The Like (AREA)

JP3983A 1983-01-05 1983-01-05 電磁波遮蔽性合成樹脂射出成形品の製造方法 Granted JPS59124824A (ja)

Priority Applications (1)

Application Number	Priority Date	Filing Date	Title
JP3983A JPS59124824A (ja)	1983-01-05	1983-01-05	電磁波遮蔽性合成樹脂射出成形品の製造方法

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
JP3983A JPS59124824A (ja)	1983-01-05	1983-01-05	電磁波遮蔽性合成樹脂射出成形品の製造方法

Publications (2)

Publication Number	Publication Date
JPS59124824A true JPS59124824A (ja)	1984-07-19
JPH0225323B2 JPH0225323B2 (2)	1990-06-01

Family

ID=11463173

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
JP3983A Granted JPS59124824A (ja)	1983-01-05	1983-01-05	電磁波遮蔽性合成樹脂射出成形品の製造方法

Country Status (1)

Country	Link
JP (1)	JPS59124824A (2)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS62178313A (ja) *	1986-01-31	1987-08-05	Toshiba Chem Corp	導電性成形品の製造方法
WO1988004986A1 (fr) *	1986-12-24	1988-07-14	Nippon Steel Corporation	Procede de moulage de compositions de resine contenant des fibres metalliques
JPH04229220A (ja) *	1990-12-27	1992-08-18	Tigers Polymer Corp	熱可塑性樹脂の導電性付与成形法
WO2001019590A1 (de) *	1999-09-14	2001-03-22	Wittmann Kunststoffgeräte Gesellschaft M.B.H.	Verfahren und vorrichtung zum temperieren von formwerkzeugen von spritzgussmaschinen
US7172674B2 (en)	2000-10-31	2007-02-06	Sez Ag	Device for liquid treatment of wafer-shaped articles

1983
- 1983-01-05 JP JP3983A patent/JPS59124824A/ja active Granted

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS62178313A (ja) *	1986-01-31	1987-08-05	Toshiba Chem Corp	導電性成形品の製造方法
WO1988004986A1 (fr) *	1986-12-24	1988-07-14	Nippon Steel Corporation	Procede de moulage de compositions de resine contenant des fibres metalliques
JPH04229220A (ja) *	1990-12-27	1992-08-18	Tigers Polymer Corp	熱可塑性樹脂の導電性付与成形法
WO2001019590A1 (de) *	1999-09-14	2001-03-22	Wittmann Kunststoffgeräte Gesellschaft M.B.H.	Verfahren und vorrichtung zum temperieren von formwerkzeugen von spritzgussmaschinen
US7172674B2 (en)	2000-10-31	2007-02-06	Sez Ag	Device for liquid treatment of wafer-shaped articles
US7799695B2 (en)	2000-10-31	2010-09-21	Lam Research Ag	Device for liquid treatment of wafer-shaped articles
US7988818B2 (en)	2000-10-31	2011-08-02	Lam Research Ag	Device for liquid treatment of wafer-shaped articles

Also Published As

Publication number	Publication date
JPH0225323B2 (2)	1990-06-01

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JPH0315358B2 (2)	1991-02-28