JPS5912871U - Anode device for plating - Google Patents

Anode device for plating

Info

Publication number
JPS5912871U
JPS5912871U JP10674982U JP10674982U JPS5912871U JP S5912871 U JPS5912871 U JP S5912871U JP 10674982 U JP10674982 U JP 10674982U JP 10674982 U JP10674982 U JP 10674982U JP S5912871 U JPS5912871 U JP S5912871U
Authority
JP
Japan
Prior art keywords
plating
anode device
anode
metal chips
abstract
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP10674982U
Other languages
Japanese (ja)
Other versions
JPS623399Y2 (en
Inventor
小泉　信裕
高間　政善
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Suzuki Motor Corp
Original Assignee
Suzuki Motor Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Suzuki Motor Corp filed Critical Suzuki Motor Corp
Priority to JP10674982U priority Critical patent/JPS5912871U/en
Publication of JPS5912871U publication Critical patent/JPS5912871U/en
Application granted granted Critical
Publication of JPS623399Y2 publication Critical patent/JPS623399Y2/ja
Granted legal-status Critical Current

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  • Electroplating Methods And Accessories (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図ａ、　　ｂ、　　ｃは、従来の溶解性陽極の斜視
図、金属チップを充填した状態の断面図およびメッキ時
間の経過した状態の断面図、第２図ａ、　　ｂは本考案
に係るメッキ用陽極装置に金属チップを充填した状態の
断面図およびメッキ時間の経過し　　　　゛た状態の断
面図、第３図はメッキ用陽極装置を上方から見た平面図
である。 １．６・・・陽極ケース、２，８・・・金属チップ、３
・・・溶解性陽極、４・・・空洞部、５・・・メッキ用
陽極装置、７・・・底板、９・・・押さえ板、１０・・
・留め具、１１・・・バネ。Figures 1 a, b, and c are a perspective view of a conventional soluble anode, a cross-sectional view of the state filled with metal chips, and a cross-sectional view of the state after plating time has elapsed, and Figures 2 a, b are according to the present invention. A cross-sectional view of the plating anode device filled with metal chips and a cross-sectional view of the plating time elapsed, and FIG. 3 is a plan view of the plating anode device viewed from above. 1.6...Anode case, 2,8...Metal tip, 3
...Dissolvable anode, 4...Cavity part, 5...Anode device for plating, 7...Bottom plate, 9...Pressure plate, 10...
- Fastener, 11...spring.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] メッキ用陽極装置において、陽極ケース中の金属チップ
の充填状態を一定とする手段を設け、該金属チップの溶
解に伴って生じる空洞部を強制的に消失させるようにし
たことを特徴とするメッキ用陽極装置。An anode device for plating, characterized in that a means is provided to keep the filling state of metal chips in the anode case constant, and forcibly eliminates a cavity created as the metal chips melt. Anode device.
JP10674982U 1982-07-14 1982-07-14 Anode device for plating Granted JPS5912871U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10674982U JPS5912871U (en) 1982-07-14 1982-07-14 Anode device for plating

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10674982U JPS5912871U (en) 1982-07-14 1982-07-14 Anode device for plating

Publications (2)

Publication Number Publication Date
JPS5912871U true JPS5912871U (en) 1984-01-26
JPS623399Y2 JPS623399Y2 (en) 1987-01-26

Family

ID=30249678

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10674982U Granted JPS5912871U (en) 1982-07-14 1982-07-14 Anode device for plating

Country Status (1)

Country Link
JP (1) JPS5912871U (en)

Also Published As

Publication number Publication date
JPS623399Y2 (en) 1987-01-26

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