JPS59149698U - Taping device for electronic components with lead wires - Google Patents

Taping device for electronic components with lead wires

Info

Publication number
JPS59149698U
JPS59149698U JP4331883U JP4331883U JPS59149698U JP S59149698 U JPS59149698 U JP S59149698U JP 4331883 U JP4331883 U JP 4331883U JP 4331883 U JP4331883 U JP 4331883U JP S59149698 U JPS59149698 U JP S59149698U
Authority
JP
Japan
Prior art keywords
electronic components
lead wires
taping
electronic component
transportation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4331883U
Other languages
Japanese (ja)
Inventor
林 憲世
Original Assignee
正和産業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 正和産業株式会社 filed Critical 正和産業株式会社
Priority to JP4331883U priority Critical patent/JPS59149698U/en
Publication of JPS59149698U publication Critical patent/JPS59149698U/en
Pending legal-status Critical Current

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  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本考案のリード線付電子部品のテーピング装置
の一実施例を示す概略正面図、第2図はその要部拡大図
、第3図はその側面図、第4図は第3図のIV−IV矢
視断面図、第5図は本考案装置により電子部品をテーピ
ングした状態を示す一部平面図、第6図は本考案の他の
実施例を示す要部の正面図である。 1・・・架台、5・・・搬送用チェノ、6・・・爪、1
4・・・案内レール、16・・・供給装置、17・・・
カートリッジ、18・・・筒状ケース、19・・・排出
部材、20・・・閉塞部材、21・・・通路、41・・
・ホルダー、42・・・扉、58・・・ブラケット、5
9・・・ベアリング、62゜63・・・センサー、64
・・・制御装置、65.66・・・受渡しホイール、7
0・・・テーピング用ホイール、7B・・・受は部材、
A・・・抵抗器、a□・・・本体、a2・・・リード線
、T、、 T2・・・テープ。
Fig. 1 is a schematic front view showing an embodiment of the taping device for electronic components with lead wires of the present invention, Fig. 2 is an enlarged view of its main parts, Fig. 3 is its side view, and Fig. 4 is Fig. 3. FIG. 5 is a partial plan view showing a state in which electronic components are taped by the device of the present invention, and FIG. 6 is a front view of main parts showing another embodiment of the present invention. . 1... Frame, 5... Transport chain, 6... Claw, 1
4... Guide rail, 16... Supply device, 17...
Cartridge, 18... Cylindrical case, 19... Discharge member, 20... Closing member, 21... Passage, 41...
・Holder, 42...Door, 58...Bracket, 5
9...Bearing, 62°63...Sensor, 64
...Control device, 65.66...Delivery wheel, 7
0...Wheel for taping, 7B...Bake is a member,
A...Resistor, a□...Body, a2...Lead wire, T,, T2...Tape.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] リード線付電子部品を整列させて搬送する搬送装置と、
この搬送装置の搬送方向の複数個所に設けられ、各々同
種のリード線付電子部品を搬送装置に供給する供給装置
と、各供給装置を順次動作させる制御装置と、外周に電
子部品の両側のリード線を係合する溝を略等間隔で多数
有し、前記搬送装置により搬送された電子部品のリード
線を溝に順次係合するテーピング用ホイールと、このテ
ーピングホイールを回転させる駆動装置と、前記テーピ
ング用ホイールに供給された上テープと下テープを接着
させ、これら上テープと下テープの間に電子部品のリー
ド線を定着させる押圧部材とを備えたことを特徴とする
リード線付電子部品のテーピング装置。
A transport device that aligns and transports electronic components with lead wires;
A supply device that is installed at multiple locations in the transportation direction of this transportation device and supplies electronic components of the same type with lead wires to the transportation device, a control device that sequentially operates each supply device, and leads on both sides of the electronic component on the outer periphery. a taping wheel having a large number of grooves at approximately equal intervals for engaging wires and sequentially engaging the lead wires of electronic components transported by the transport device in the grooves; a drive device for rotating the taping wheel; An electronic component with a lead wire, characterized by comprising a pressing member that adheres an upper tape and a lower tape supplied to a taping wheel and fixes a lead wire of the electronic component between the upper tape and the lower tape. taping equipment.
JP4331883U 1983-03-28 1983-03-28 Taping device for electronic components with lead wires Pending JPS59149698U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4331883U JPS59149698U (en) 1983-03-28 1983-03-28 Taping device for electronic components with lead wires

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4331883U JPS59149698U (en) 1983-03-28 1983-03-28 Taping device for electronic components with lead wires

Publications (1)

Publication Number Publication Date
JPS59149698U true JPS59149698U (en) 1984-10-06

Family

ID=30173848

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4331883U Pending JPS59149698U (en) 1983-03-28 1983-03-28 Taping device for electronic components with lead wires

Country Status (1)

Country Link
JP (1) JPS59149698U (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS541557U (en) * 1977-06-02 1979-01-08
JPS5548480A (en) * 1978-10-03 1980-04-07 Kawasaki Steel Corp Single-electrode swing submerging arc welding method

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS541557U (en) * 1977-06-02 1979-01-08
JPS5548480A (en) * 1978-10-03 1980-04-07 Kawasaki Steel Corp Single-electrode swing submerging arc welding method

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