JPS5915211A - Photosemiconductor device - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed Description of the Invention] [Technical Field of the Invention] The present invention relates to an optical conductor device, and is directed to an optical semiconductor device that is capable of increasing the optical coupling efficiency between an optical semiconductor element and an external waveguide. This is related to

[Technical background of the invention and its problems]

2. Description of the Related Art Optical semiconductor devices are widely used for various purposes, and a representative example is that they are incorporated into a receiving module or a transmitting module for optical transmission and used in a wide range of optical transmission devices.

Next, several examples of optical coupling mechanisms between a light emitting semiconductor device and an optical fiber will be explained with reference to the drawings, taking a transmission module for optical transmission as an example.

First, FIG. 1 shows a light-emitting semiconductor device, such as an LED IP, hermetically sealed in a can-type envelope (1, 1).The optical semiconductor device, such as an LED IP, is optically coupled to an optical fiber attached to an optical coil/lid plug (not shown). For this purpose, the optical connector receptacle (3) is fixed to the optical connector receptacle (3) through an adapter (2) or directly.

The relationship between this optical semiconductor device and the optical fiber is as shown in FIG. In other words, in optical semiconductor devices, LED
(4) is mounted and bonded to the II header (5) and hermetically sealed with a glass window (strong shell (6)).Then, the signal light emitted from the IJD (4) is sent to the optical fiber ( 8).

In this case, as can be seen from the figure, the signal light emitted from the LED (4) is emitted in all directions, so the following two points are important in order to increase the coupling efficiency with the optical fiber (8). It is a costume. The first point is that the light emitted from the microscopic phase 1 of the LED (4) can be coupled to the optical fiber (8) before the light is transmitted to the optical fiber (8).
Make the core end face as close to LEi) (4) as possible. If the emission angle from the second handling point LED (4) is made small to prevent the signal light from spreading, the light 7
The angle of incidence on the optical fiber (8) is shifted to a small value so that it falls within the maximum acceptance angle of the optical fiber (8).

As a method to actually see this first point, the thickness of the window shown in Figure 2 is calculated as follows: (In addition to reducing the distance (1) from the core end face of the river, a part of the optical fiber (8) completely penetrates the shell (8) as shown in Fig. 3 and is LET).The light emitting surface of (4) I'm also disappointed in the Roncha or Hifter 4 yen model (made in close proximity).

In addition, as a structure to reduce the angle of emission from the I/ED, as shown in Fig. 4, a structure is provided in the concave part of the LE:D (4+) table IM1 and a ball lens (9) is inserted therein, although it is not shown in the figure. , T, ED itself is made into a spherical surface and a convex lens is used with σ(), but it has not been put into practical use.

As another example, as shown in Figures 5 and 6, 1, a plastic molded envelope Hf is used L, and the part facing the LED (14) is structured to protrude outside in a hemispherical (15) shape. Things are also known.

However, these conventional optical semiconductor devices have a structure that uses a single optical semiconductor element such as an LED that is hermetically sealed, and the above-mentioned structure improves the optical coupling between the optical semiconductor element and the optical fiber. However, recently, an optical semiconductor device that incorporates an optical semiconductor element and its auxiliary circuit in the same package has been developed, and in such an optical semiconductor device, a driver IC, a receiver IC, a bypass capacitor, and an optical semiconductor element are combined. Since a large-sized device is incorporated, there is a problem in that it is difficult to increase the coupling efficiency between the optical semiconductor element and the optical fiber.

[Purpose of the invention]

The present invention has been made in view of the above-mentioned problems, and it is possible to increase the coupling efficiency between the optical semiconductor element and the optical fiber even if an envelope in which the optical semiconductor element and the attached circuit are incorporated at the same time is used. The aim is to provide a light, half-sized body.

[Summary of the invention]

That is, the present invention provides a window h) consisting of transparent rfls 44.
In an optical semiconductor device consisting of an envelope having a It is characterized by being made up of a convex lens having a spherical shape, and having a size that allows only the optical semiconductor element to exist directly below the convex lens. Another feature is that it is provided in the recess of.

[Embodiments of the invention]

Next, an example of Mlv of an optical semiconductor device of the present invention will be explained with reference to FIGS. 7 and 8. Honji hII! In the example, it is called an optical semiconductor device whole module.

In other words, the transmitting module 0η and the receiving module (18) are all mounted on the same ceramic multilayer wiring board (+6), and the transmitting module /I/(17) is equipped with a LE
Dσ9 is mounted and bonded with a driver IC (20) and a resistor (not shown), and similarly, a PiN''-PD (23) and a receiver I are mounted on the receiving module section θ8).
C (2a) and bypass capacitor 0■ are mounted and bonded.

Each module (+7) (18) is provided with a shell On made of Kovar material or the like having a window part 02 made of a transparent material such as glass in the center.
The peripheral part of 71 is hermetically sealed by seam welding to a ring-shaped ceramic (26) through a weld ring (2 camphor) through a mekrise layer, and constitutes a reliable bidirectional optical module chip assembly. do.

Such a chip assembly is obtained by, for example, a plastic mold, or is inserted and bonded into a receptacle, and is removably optically coupled to a two-core optical connector to enable bidirectional optical transmission.

Next, to explain the window part (32) and its vicinity, the window part 02 has a hemispherical surface with a radius of curvature of 0.6 mmB, which is approximately equivalent to the diameter of 9.5 mm of the optical fiber (4 wires) in the plug (41) of the optical connector. It is a convex lens formed only on the surface facing LED←l, PIN-FD (23), and the shell Q force part, which is a part of the envelope that provides this window area, is formed in a concave part. Even if the plug 00 contacts the shell, the window C3
2) does not come in contact with the window (LET 01, PIN-PI) Q3), and the bonding wires of ICs (20), (21), etc. In the vicinity, the shell force is such that it does not touch the bonding wire, so it does not touch or deform the bonding wire. In this case, even if the bonding wire from the LED (t<9, PIN-PD (23+) contacts the r'j-3 part (32), there is no gap because it is an insulating part group.

The above embodiment described an optical semiconductor device in which a transmitting module and a receiving module were formed on the same ceramic multilayer wiring board, but it is also possible to form one printed circuit board without using a ceramic multilayer wiring board. Needless to say, it is also possible to use a conventional one or a metal envelope.

〔Effect of the invention〕

As mentioned above, the optical semiconductor device of the present invention has high reliability, allows the optical semiconductor element and accessory parts to be hermetically sealed in the same envelope, and further improves the optical coupling efficiency between the optical semiconductor element and the optical fiber. Its industrial value is extremely significant.

[Brief explanation of drawings]

1 to 6 are diagrams showing conventional optical semiconductor devices; FIG. 1 is an explanatory cross-sectional view showing a state in which a can-type optical semiconductor device is incorporated into an optical connector; and FIG. is an explanatory cross-sectional view showing the relationship between the optical semiconductor device and the optical fiber in Figure 1, Figure 3 is a cross-sectional view showing an example in which the optical fiber is inserted into the shell, and Figure 4 is a cross-sectional view showing an example in which a ball lens is inserted into the four parts of the LEDO. FIG. 5 is an external view of a plastic mold type photoproducer device, FIG. 6 is a partially enlarged sectional view of A in FIG. 5, and FIGS. FIG. 7 is an explanatory cross-sectional view of the entire optical semiconductor device, and FIG. 8 is an enlarged explanatory cross-sectional view of a portion thereof. 3 Optical connector receptacle No. 1141.14.1
9...LBD7.32...Window part 8.42...
・・Optical fiber 9 Ball lens 16 Ceramic multilayer wiring board 20・Tribar ■C21, 25・Pass bus content 23・・PIN -P, D 24
・Resino IC27...Shell Agent Patent Attorney Inoue-O Figure 1 Figure 3 Figure 5 Figure 2 Figure 4 Figure 6

Claims (2)

[Claims] (1) Optical conductor device 4 consisting of an envelope having a window made of a transparent material and at least an optical semiconductor element hermetically sealed inside the envelope. In 9, the window portion is formed of a convex lens in which only the surface facing the light emitting portion or the light receiving portion of the optical semiconductor element has a substantially hemispherical shape, and the optical semiconductor element is only present directly below the convex lens. What is claimed is: 1. An optical semiconductor device characterized in that it has a size that is (2) The optical semiconductor device according to claim 1, wherein the convex lens is provided in a concave portion of the envelope.