JPS59155067A - 抵抗ヒータの製造方法 - Google Patents

抵抗ヒータの製造方法

Info

Publication number: JPS59155067A
Authority: JP; Japan
Prior art keywords: layer; resistor; deposited; thin film; passivation
Prior art date: 1982-11-24
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Granted

Application number

JP58221341A

Other languages

English (en)

Japanese (ja)

Other versions

JPH0340911B2 (fr

Inventor

Jieemusu Roido Uiriamu

ウイリアム・ジエ−ムス・ロイド

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Hewlett Packard Japan Inc

Original Assignee

Yokogawa Hewlett Packard Ltd

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1982-11-24

Filing date

1983-11-24

Publication date

1984-09-04

1983-11-24 Application filed by Yokogawa Hewlett Packard Ltd filed Critical Yokogawa Hewlett Packard Ltd

1984-09-04 Publication of JPS59155067A publication Critical patent/JPS59155067A/ja

1991-06-20 Publication of JPH0340911B2 publication Critical patent/JPH0340911B2/ja

Status Granted legal-status Critical Current

Links

239000010409 thin film Substances 0.000 title claims description 14
238000002161 passivation Methods 0.000 claims abstract description 15
239000004020 conductor Substances 0.000 claims abstract description 10
238000000034 method Methods 0.000 abstract description 8
XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract description 7
239000010703 silicon Substances 0.000 abstract description 7
229910052710 silicon Inorganic materials 0.000 abstract description 7
238000005530 etching Methods 0.000 abstract description 3
239000012212 insulator Substances 0.000 abstract 2
230000007547 defect Effects 0.000 abstract 1
VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 16
239000000758 substrate Substances 0.000 description 15
235000012239 silicon dioxide Nutrition 0.000 description 8
239000000377 silicon dioxide Substances 0.000 description 8
229910052782 aluminium Inorganic materials 0.000 description 5
XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 5
PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
229910052751 metal Inorganic materials 0.000 description 4
239000002184 metal Substances 0.000 description 4
229910000838 Al alloy Inorganic materials 0.000 description 2
RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
229910001362 Ta alloys Inorganic materials 0.000 description 2
239000003795 chemical substances by application Substances 0.000 description 2
239000011248 coating agent Substances 0.000 description 2
238000000576 coating method Methods 0.000 description 2
229910052802 copper Inorganic materials 0.000 description 2
239000010949 copper Substances 0.000 description 2
239000010408 film Substances 0.000 description 2
239000013067 intermediate product Substances 0.000 description 2
238000004519 manufacturing process Methods 0.000 description 2
239000000463 material Substances 0.000 description 2
229910052759 nickel Inorganic materials 0.000 description 2
HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 2
229910010271 silicon carbide Inorganic materials 0.000 description 2
GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 2
238000007651 thermal printing Methods 0.000 description 2
229910045601 alloy Inorganic materials 0.000 description 1
239000000956 alloy Substances 0.000 description 1
230000005540 biological transmission Effects 0.000 description 1
230000007423 decrease Effects 0.000 description 1
238000000151 deposition Methods 0.000 description 1
238000010586 diagram Methods 0.000 description 1
239000005357 flat glass Substances 0.000 description 1
239000011521 glass Substances 0.000 description 1
238000000059 patterning Methods 0.000 description 1
230000010412 perfusion Effects 0.000 description 1
238000004544 sputter deposition Methods 0.000 description 1

Classifications

- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
- B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
- B41J2/335—Structure of thermal heads
- B41J2/33505—Constructional details
- B41J2/33535—Substrates
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14016—Structure of bubble jet print heads
- B41J2/14088—Structure of heating means
- B41J2/14112—Resistive element
- B41J2/14129—Layer structure
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
- B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
- B41J2/335—Structure of thermal heads
- B41J2/33545—Structure of thermal heads characterised by dimensions
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
- B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
- B41J2/335—Structure of thermal heads
- B41J2/3355—Structure of thermal heads characterised by materials
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
- B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
- B41J2/335—Structure of thermal heads
- B41J2/33555—Structure of thermal heads characterised by type
- B41J2/3357—Surface type resistors
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
- B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
- B41J2/335—Structure of thermal heads
- B41J2/3359—Manufacturing processes

Landscapes

Engineering & Computer Science (AREA)
Manufacturing & Machinery (AREA)
Particle Formation And Scattering Control In Inkjet Printers (AREA)
Non-Adjustable Resistors (AREA)
Electronic Switches (AREA)
Surface Heating Bodies (AREA)

JP58221341A 1982-11-24 1983-11-24 抵抗ヒータの製造方法 Granted JPS59155067A (ja)

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
US44441282A	1982-11-24	1982-11-24
US444412		1989-12-01

Publications (2)

Publication Number	Publication Date
JPS59155067A true JPS59155067A (ja)	1984-09-04
JPH0340911B2 JPH0340911B2 (fr)	1991-06-20

Family

ID=23764780

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
JP58221341A Granted JPS59155067A (ja)	1982-11-24	1983-11-24	抵抗ヒータの製造方法

Country Status (3)

Country	Link
EP (1)	EP0113950B1 (fr)
JP (1)	JPS59155067A (fr)
DE (1)	DE3379526D1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS60159062A (ja) *	1984-01-31	1985-08-20	Canon Inc	液体噴射記録ヘツド

Citations (2)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS5413031A (en) *	1977-06-29	1979-01-31	Toshiba Corp	Heating member
JPS57111983A (en) *	1980-12-27	1982-07-12	Matsushita Electric Works Ltd	Panel heater

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US4169032A (en) *	1978-05-24	1979-09-25	International Business Machines Corporation	Method of making a thin film thermal print head
EP0015100B1 (fr) *	1979-02-26	1983-08-17	National Research Development Corporation	Procédé d'incorporation d'un élément de circuit distribué à micro-ondes dans un circuit intégré à micro-ondes

1983
- 1983-08-10 EP EP19830304617 patent/EP0113950B1/fr not_active Expired
- 1983-08-10 DE DE8383304617T patent/DE3379526D1/de not_active Expired
- 1983-11-24 JP JP58221341A patent/JPS59155067A/ja active Granted

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS5413031A (en) *	1977-06-29	1979-01-31	Toshiba Corp	Heating member
JPS57111983A (en) *	1980-12-27	1982-07-12	Matsushita Electric Works Ltd	Panel heater

Also Published As

Publication number	Publication date
DE3379526D1 (en)	1989-05-03
JPH0340911B2 (fr)	1991-06-20
EP0113950A2 (fr)	1984-07-25
EP0113950B1 (fr)	1989-03-29
EP0113950A3 (en)	1985-12-18

Publication	Publication Date	Title
US4616408A (en)	1986-10-14	Inversely processed resistance heater
JPS6359541A (ja)	1988-03-15	インクジェット・プリントヘッド
US4617575A (en)	1986-10-14	Thermal head
US4734563A (en)	1988-03-29	Inversely processed resistance heater
JPS59155067A (ja)	1984-09-04	抵抗ヒータの製造方法
JPH036917B2 (fr)	1991-01-31
JPS5578549A (en)	1980-06-13	Semiconductor device
JP2642749B2 (ja)	1997-08-20	薄膜配線基板
JPH0330992B2 (fr)	1991-05-01
JPS5849027B2 (ja)	1983-11-01	半導体集積回路装置の製法
US3574932A (en)	1971-04-13	Thin-film beam-lead resistors
JPH05205913A (ja)	1993-08-13	金属皮膜固定抵抗器の製造方法
JPS6161254B2 (fr)	1986-12-24
JP2533088B2 (ja)	1996-09-11	サ−マルヘツドの製造方法
JP2518186B2 (ja)	1996-07-24	サ―マル印字ヘッド
JP2529448B2 (ja)	1996-08-28	金属突起形成基板及び金属突起の形成方法
JPH0577462A (ja)	1993-03-30	サーマルヘツドとその製造方法
JPS6242858A (ja)	1987-02-24	サ−マルヘツドの製造方法
JPH03106663A (ja)	1991-05-07	サーマルヘッドの保護膜構造
JP2763447B2 (ja)	1998-06-11	サーマルヘッドの製造方法
JPH0524234A (ja)	1993-02-02	サーマルヘツド
JPH03143642A (ja)	1991-06-19	サーマルヘッドの製造方法
JPS591276A (ja)	1984-01-06	サ−マルヘツド
JPS61137345A (ja)	1986-06-25	半導体装置の製造方法
JPS61137759A (ja)	1986-06-25	サ−マルヘツド