JPS59155156A - Module of integrated circuit - Google Patents
Module of integrated circuitInfo
- Publication number
- JPS59155156A JPS59155156A JP58028506A JP2850683A JPS59155156A JP S59155156 A JPS59155156 A JP S59155156A JP 58028506 A JP58028506 A JP 58028506A JP 2850683 A JP2850683 A JP 2850683A JP S59155156 A JPS59155156 A JP S59155156A
- Authority
- JP
- Japan
- Prior art keywords
- wax
- substrate
- mixture
- cap
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
【発明の詳細な説明】 ［発明の属する技術分野］ この発明はＩＣモジュールの冷却に関する。[Detailed description of the invention] [Technical field to which the invention pertains] This invention relates to cooling of IC modules.
［従来技術とその問題点］
航空産業の特殊な用途にＩＣモジニールが使われはじめ
、特に過渡的な用途としての需要が多い。[Prior art and its problems] IC modular is beginning to be used for special applications in the aviation industry, and there is a strong demand for it especially for transitional applications.
この場合、従来のようにＩＣモジュール基板のチップ搭
載面と反対側の面に、板状のアルミフィンをつけ、伝導
によって放熱をしていたのでは、応答性に問題が生じる
。特に、最近になってＩＣの高密度実装化が急速に進み
、モジー−ル内の温度上昇が著しい場合、問題は切実で
ある。さらに、重量軽減化の動きから、アルミフィンの
面積も拡大できず、熱容量も金属なので小さくＩＣモジ
一ルの過渡的冷却としては効果が薄い。In this case, if a plate-shaped aluminum fin is attached to the surface of the IC module substrate opposite to the chip mounting surface and heat is dissipated by conduction as in the past, a problem arises in response. In particular, the problem is acute when ICs are rapidly becoming more densely packaged and the temperature inside the module increases significantly. Furthermore, due to the trend toward weight reduction, the area of aluminum fins cannot be increased, and since the heat capacity is a metal, it is small and is not effective for transient cooling of IC modules.
［発明の目的］
この発明は、上述した従来の冷却方法を改良したもので
、ワックスの相変化熱を利用して、冷却応答の速いＩＣ
モジ−−ルを提供することを目的とする。[Object of the Invention] The present invention is an improvement on the conventional cooling method described above, and utilizes the phase change heat of wax to produce an IC with a fast cooling response.
The purpose is to provide modules.
［発明の概要］
本発明は、ＩＣを搭載する基板面き反対側にもキャップ
を設け、キャップと基板との密閉空間の中にワックスと
粉末金属の混合物を封入したものである。さらに、ＩＣ
搭載基板面と反対側の面白体力伝導フィンを形成してい
る。ＩＣの発熱によシ基板が熱せられると熱は基板゛か
らワックスへと伝わシ、ワックス温度が融点を越えると
固体から液体へと相変化し、その潜熱によって大容量の
蓄熱材として働く。その間、温度は一定である。さらに
ワックス内の粉末金属は、基板からワックスへの熱の伝
導を助ける役目を持つ。また、基板の裏面自体がフィン
を形成しているので伝導面積は大きくなっている。[Summary of the Invention] According to the present invention, a cap is also provided on the opposite side of the substrate on which an IC is mounted, and a mixture of wax and powder metal is sealed in a sealed space between the cap and the substrate. Furthermore, I.C.
Forms an interesting physical force conducting fin on the opposite side to the mounting board surface. When the substrate is heated by the heat generated by the IC, the heat is transferred from the substrate to the wax, and when the wax temperature exceeds the melting point, the phase changes from solid to liquid, and the latent heat acts as a large-capacity heat storage material. During this time, the temperature remains constant. Additionally, the powdered metal within the wax helps conduct heat from the substrate to the wax. Furthermore, since the back surface of the substrate itself forms a fin, the conduction area is large.
［発明の効果コ
上述のように、本発明によれば、ワックスの相変化熱と
金属の伝導性と基板自体の伝導面積の拡大を計っている
ので、軽量、小型でＩＣＧ、）高密度実装化と過渡冷却
に十分適応できる等の優れた効果を奏する。[Effects of the Invention] As mentioned above, according to the present invention, the phase change heat of the wax, the conductivity of the metal, and the conduction area of the board itself are expanded, so it is lightweight, compact, and capable of high-density mounting. It has excellent effects such as being fully adaptable to temperature change and transient cooling.
［本発明の実施例］
第１図は本発明の実施例である□
ＩＣチップ１を搭載する面と反対側の面にフィンを有し
ている基板２と、フィン側の面にロウ付されたキャップ
３とから成る空間に、ワックスと粉末金属の混合物４が
封入されている。基板２を通過した熱は、混合物４に吸
収される。その際。[Embodiment of the present invention] Fig. 1 shows an embodiment of the present invention □ A substrate 2 having a fin on the surface opposite to the surface on which the IC chip 1 is mounted, and a substrate 2 having a fin on the surface on the fin side. A mixture 4 of wax and powdered metal is sealed in the space formed by the cap 3. The heat passing through the substrate 2 is absorbed by the mixture 4. that time.
ワックスの相変化熱を利用するので、温度は一定のまま
であり粉末金属とフィンによって伝導性を高めている〇
そのため、効果的な過渡冷却を可能にしている。Since it uses the phase change heat of the wax, the temperature remains constant and the conductivity is increased by the powder metal and fins. Therefore, effective transient cooling is possible.
なお、キャップ内に封入する物質はＩＣモジュールの動
作温度範囲で、融解する物質であれば、ワックスに限ら
ないことはいうまでもない。It goes without saying that the substance sealed in the cap is not limited to wax as long as it melts within the operating temperature range of the IC module.
図面は本発明に係るＩＣモジュールの実施例の断面図で
ある。
１・・・ＩＣチップ、２・・・フィン付き基板、３・・
・キャップ、 ４・・・ワックスと粉末金属との混合
物。The drawing is a sectional view of an embodiment of an IC module according to the present invention. 1... IC chip, 2... Substrate with fins, 3...
- Cap, 4...Mixture of wax and powdered metal.
Claims (3)
基板のＩＣを搭載する面と反対側の面に気密性を保たせ
るように取シ付けたキャップとから成シ、前記基板のＩ
Ｃを搭載する面と反対の面及び前記キャップから構成さ
れる密閉空間部にワックスを封入して成ることを特徴と
するＩＣモジュール０(1) Consisting of a board on which one or more ICs are mounted and a cap attached to the surface of the board opposite to the surface on which the IC is mounted to maintain airtightness;
IC module 0 characterized in that wax is sealed in a sealed space formed by the surface opposite to the surface on which C is mounted and the cap.
けたことを特徴とする特許請求の範囲第１項記載のＩＣ
モジニール。(2) The IC according to claim 1, characterized in that a fin is provided on the surface opposite to the surface on which the IC is mounted.
Mojinir.
する特許請求の範囲第１項記載のＩＣモジュール。(3) The IC module according to claim 1, characterized in that powder metal is mixed into the wax.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58028506A JPS59155156A (en) | 1983-02-24 | 1983-02-24 | Module of integrated circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58028506A JPS59155156A (en) | 1983-02-24 | 1983-02-24 | Module of integrated circuit |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59155156A true JPS59155156A (en) | 1984-09-04 |
| JPH04391B2 JPH04391B2 (en) | 1992-01-07 |
Family
ID=12250559
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58028506A Granted JPS59155156A (en) | 1983-02-24 | 1983-02-24 | Module of integrated circuit |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59155156A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5014777A (en) * | 1988-09-20 | 1991-05-14 | Nec Corporation | Cooling structure |
| DE10347518A1 (en) * | 2003-10-13 | 2005-05-25 | Siemens Ag | Electronic component, circuit carrier assembly and electronic unit with heat accumulator |
-
1983
- 1983-02-24 JP JP58028506A patent/JPS59155156A/en active Granted
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5014777A (en) * | 1988-09-20 | 1991-05-14 | Nec Corporation | Cooling structure |
| DE10347518A1 (en) * | 2003-10-13 | 2005-05-25 | Siemens Ag | Electronic component, circuit carrier assembly and electronic unit with heat accumulator |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH04391B2 (en) | 1992-01-07 |
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