JPS59173690A - ヒ−トパイプ構造ic基板 - Google Patents
ヒ−トパイプ構造ic基板Info
- Publication number
- JPS59173690A JPS59173690A JP4677483A JP4677483A JPS59173690A JP S59173690 A JPS59173690 A JP S59173690A JP 4677483 A JP4677483 A JP 4677483A JP 4677483 A JP4677483 A JP 4677483A JP S59173690 A JPS59173690 A JP S59173690A
- Authority
- JP
- Japan
- Prior art keywords
- board
- heat
- spacer
- base plate
- heat pipe
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
Landscapes
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Structure Of Printed Boards (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4677483A JPS59173690A (ja) | 1983-03-18 | 1983-03-18 | ヒ−トパイプ構造ic基板 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4677483A JPS59173690A (ja) | 1983-03-18 | 1983-03-18 | ヒ−トパイプ構造ic基板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59173690A true JPS59173690A (ja) | 1984-10-01 |
| JPS6239358B2 JPS6239358B2 (mo) | 1987-08-22 |
Family
ID=12756670
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4677483A Granted JPS59173690A (ja) | 1983-03-18 | 1983-03-18 | ヒ−トパイプ構造ic基板 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59173690A (mo) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1930682A4 (en) * | 2005-09-01 | 2011-04-06 | Fuchigami Micro Co | HEATHER AND MANUFACTURING METHOD THEREFOR |
| US8534348B2 (en) | 2005-09-01 | 2013-09-17 | Molex Incorporated | Heat pipe and method for manufacturing same |
| WO2021172479A1 (ja) | 2020-02-26 | 2021-09-02 | 京セラ株式会社 | 放熱部材 |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63111051U (mo) * | 1987-01-07 | 1988-07-16 | ||
| JPH01133852U (mo) * | 1988-03-07 | 1989-09-12 | ||
| JPH01169897U (mo) * | 1988-05-20 | 1989-11-30 | ||
| JPH0273856U (mo) * | 1988-07-18 | 1990-06-06 | ||
| JPH0314861U (mo) * | 1989-06-26 | 1991-02-14 |
-
1983
- 1983-03-18 JP JP4677483A patent/JPS59173690A/ja active Granted
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1930682A4 (en) * | 2005-09-01 | 2011-04-06 | Fuchigami Micro Co | HEATHER AND MANUFACTURING METHOD THEREFOR |
| US8534348B2 (en) | 2005-09-01 | 2013-09-17 | Molex Incorporated | Heat pipe and method for manufacturing same |
| WO2021172479A1 (ja) | 2020-02-26 | 2021-09-02 | 京セラ株式会社 | 放熱部材 |
| US12292238B2 (en) | 2020-02-26 | 2025-05-06 | Kyocera Corporation | Heat dissipation member |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6239358B2 (mo) | 1987-08-22 |
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