JPS59208770A - ボ−ルボンデイング用アルミ合金極細線 - Google Patents

ボ−ルボンデイング用アルミ合金極細線

Info

Publication number
JPS59208770A
JPS59208770A JP58083363A JP8336383A JPS59208770A JP S59208770 A JPS59208770 A JP S59208770A JP 58083363 A JP58083363 A JP 58083363A JP 8336383 A JP8336383 A JP 8336383A JP S59208770 A JPS59208770 A JP S59208770A
Authority
JP
Japan
Prior art keywords
wire
aluminum alloy
ball
bonding
hardness
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58083363A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0412620B2 (2
Inventor
Hitoshi Onuki
仁 大貫
Masateru Suwa
正輝 諏訪
Masahiro Koizumi
小泉　正博
Masamichi Kobayashi
正道 小林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP58083363A priority Critical patent/JPS59208770A/ja
Publication of JPS59208770A publication Critical patent/JPS59208770A/ja
Publication of JPH0412620B2 publication Critical patent/JPH0412620B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/59—Bond pads specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/951—Materials of bond pads
    • H10W72/952—Materials of bond pads comprising metals or metalloids, e.g. PbSn, Ag or Cu

Landscapes

  • Wire Bonding (AREA)
JP58083363A 1983-05-12 1983-05-12 ボ−ルボンデイング用アルミ合金極細線 Granted JPS59208770A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58083363A JPS59208770A (ja) 1983-05-12 1983-05-12 ボ−ルボンデイング用アルミ合金極細線

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58083363A JPS59208770A (ja) 1983-05-12 1983-05-12 ボ−ルボンデイング用アルミ合金極細線

Publications (2)

Publication Number Publication Date
JPS59208770A true JPS59208770A (ja) 1984-11-27
JPH0412620B2 JPH0412620B2 (2) 1992-03-05

Family

ID=13800340

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58083363A Granted JPS59208770A (ja) 1983-05-12 1983-05-12 ボ−ルボンデイング用アルミ合金極細線

Country Status (1)

Country Link
JP (1) JPS59208770A (2)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100379888C (zh) * 2006-06-06 2008-04-09 洛阳张鑫合金材料厂 一种铝镁铬合金丝的制备方法
EP2189548A4 (en) * 2007-09-14 2010-10-20 Nissan Motor SPANNUNGSPUFFERUNGSMATERIAL

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5730206A (en) * 1980-06-24 1982-02-18 Heraeus Gmbh W C Contact extra fine conductor for semiconductor constituent element
JPS5887841A (ja) * 1981-11-20 1983-05-25 Tanaka Denshi Kogyo Kk 半導体素子のボンデイング用Ａｌ線
JPS58124235A (ja) * 1982-01-20 1983-07-23 Hitachi Cable Ltd 半導体装置用アルミ合金極細線

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5730206A (en) * 1980-06-24 1982-02-18 Heraeus Gmbh W C Contact extra fine conductor for semiconductor constituent element
JPS5887841A (ja) * 1981-11-20 1983-05-25 Tanaka Denshi Kogyo Kk 半導体素子のボンデイング用Ａｌ線
JPS58124235A (ja) * 1982-01-20 1983-07-23 Hitachi Cable Ltd 半導体装置用アルミ合金極細線

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100379888C (zh) * 2006-06-06 2008-04-09 洛阳张鑫合金材料厂 一种铝镁铬合金丝的制备方法
EP2189548A4 (en) * 2007-09-14 2010-10-20 Nissan Motor SPANNUNGSPUFFERUNGSMATERIAL
US8241561B2 (en) 2007-09-14 2012-08-14 Nissan Motor Co., Ltd. Stress-buffering material

Also Published As

Publication number Publication date
JPH0412620B2 (2) 1992-03-05

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