JPS5922333A - Ｉｃの樹脂封止方法 - Google Patents

Ｉｃの樹脂封止方法

Info

Publication number
JPS5922333A
JPS5922333A JP57131844A JP13184482A JPS5922333A JP S5922333 A JPS5922333 A JP S5922333A JP 57131844 A JP57131844 A JP 57131844A JP 13184482 A JP13184482 A JP 13184482A JP S5922333 A JPS5922333 A JP S5922333A
Authority
JP
Japan
Prior art keywords
film carrier
sealing
resin
reel
sealing resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57131844A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0313750B2 (2
Inventor
Kenichi Yoshikawa
研一 吉川
Shingo Ichikawa
新吾 市川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Citizen Holdings Co Ltd
Citizen Watch Co Ltd
Original Assignee
Citizen Holdings Co Ltd
Citizen Watch Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Citizen Holdings Co Ltd, Citizen Watch Co Ltd filed Critical Citizen Holdings Co Ltd
Priority to JP57131844A priority Critical patent/JPS5922333A/ja
Publication of JPS5922333A publication Critical patent/JPS5922333A/ja
Publication of JPH0313750B2 publication Critical patent/JPH0313750B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/701—Tape-automated bond [TAB] connectors

Landscapes

  • Wire Bonding (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP57131844A 1982-07-28 1982-07-28 Ｉｃの樹脂封止方法 Granted JPS5922333A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57131844A JPS5922333A (ja) 1982-07-28 1982-07-28 Ｉｃの樹脂封止方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57131844A JPS5922333A (ja) 1982-07-28 1982-07-28 Ｉｃの樹脂封止方法

Publications (2)

Publication Number Publication Date
JPS5922333A true JPS5922333A (ja) 1984-02-04
JPH0313750B2 JPH0313750B2 (2) 1991-02-25

Family

ID=15067418

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57131844A Granted JPS5922333A (ja) 1982-07-28 1982-07-28 Ｉｃの樹脂封止方法

Country Status (1)

Country Link
JP (1) JPS5922333A (2)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2774810A1 (fr) * 1998-02-10 1999-08-13 St Microelectronics Sa Boitier semi-conducteur blinde et procede pour sa fabrication

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5365052A (en) * 1976-11-22 1978-06-10 Nec Corp High speed logic circuit
JPS5365062A (en) * 1976-11-24 1978-06-10 Hitachi Ltd Production of semiconductor and apparatus for the same

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5365052A (en) * 1976-11-22 1978-06-10 Nec Corp High speed logic circuit
JPS5365062A (en) * 1976-11-24 1978-06-10 Hitachi Ltd Production of semiconductor and apparatus for the same

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2774810A1 (fr) * 1998-02-10 1999-08-13 St Microelectronics Sa Boitier semi-conducteur blinde et procede pour sa fabrication
US6312975B1 (en) 1998-02-10 2001-11-06 Stmicroelectronics S.A. Semiconductor package and method of manufacturing the same

Also Published As

Publication number Publication date
JPH0313750B2 (2) 1991-02-25

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