JPS5925511A - Method of connecting intermediate of rubber, plastic cable - Google Patents

Abstract

(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention mainly relates to a method for intermediately connecting a rubber-plastic double pull with a special high-voltage edge. A semiconducting tape is wrapped around the second part to form an internal semiconducting layer, a self-fusing tape is wrapped on top of that to form a reinforcing insulating layer, and a semiconducting tape is further wrapped on top of that to form an external semiconducting layer. One method is to form layers. However, the method is by hand! 74].

Therefore, each of the layers in -1 and 2 was made using a shrink tube.
) is also proposed. That is, 1) first use a semiconductive shrink tube or wrap a semiconductive tape to form an internal semiconductive layer, and 2) shrink an insulating shrink tube over the insulating tube to provide reinforcement insulation. 3) further shrinking a semiconducting shrink tube thereon to form an outer semiconducting layer;

However, this method is 1) time-consuming as it requires the process of covering and shrinking the shrink tube many times, 2) adhesion between each layer is not good, and 3) dust may get between the layers. There are problems with this.

The object of the present invention is to provide an intermediate connection method for rubber/plastic cables that does not have the above-mentioned problems.

Structure of the invention (Figures 1 to 2) A multi-layer integrated heat-shrinkable tube consisting of a semiconductive layer and an insulating layer is made in advance, and the tube is placed over a predetermined position and shrunk to reinforce and insulate the connection part. It is characterized by forming a body.

Note that when contracted, the insulating layer 12 of the shrinkable tube 10 becomes the reinforcing insulating layer 32 in the reinforcing insulator 30 (first,
(Figure 2, etc.) In addition, when the semiconducting layer is provided only on the inside of the insulating layer 12 (FIG. 5), when it is provided only on the outside (FIG. 3),
Also, there are cases in which they are provided on both the inside and outside (Fig. 1). When the heat shrink tube 10 is shrunk, these become the inner semiconducting layer 34 and the outer semiconducting layer 6 (FIGS. 21, 1 and 3).

Example Eleven types of embodiments will be described.

(1) In the case of 1 Figure 1 and 2, 10 is the entire heat shrink tube. The insulating layer 12 is made of, for example, crosslinked polyethylene or EP rubber. Semiconducting layers are provided both inside and outside. 14 is an inner semiconducting layer, and an insulating layer 1
2. Provided only at the center in the length direction. Further, 16 is an outer semiconducting layer, which is provided slightly longer than the insulating layer 12.

This heat-shrinkable tube 10 is fed into the pre-warmed cable 20, and after the cable conductor 22 is connected M5, it is held at a predetermined position and shrunk (FIG. 2). Then, the inner semiconducting layer 14 becomes an inner semiconducting layer 34 by closely contacting the cable conductor 22 (FIG. 2 shows an example of a connection having the same diameter) and the inner semiconducting layer 24 of the cable. Further, the insulating layer 12 is in close contact with the cable insulator 26 to become a reinforcing insulating layer 32.

Further, the outer semiconducting layer 16 adheres tightly onto the outer semiconducting layer 28 of the cable 20 to form an outer semiconducting layer 6, thereby forming a reinforcing insulating layer 0.

(2) In the above example, the outer semiconducting layer 16 is omitted, and the heat shrink tube 10 is made by adding the insulating layer 12 and the inner semiconducting layer 14.
may also constitute.

(3) As shown in FIG. 3, there is a case where the heat-shrinkable tube 10 is composed only of the insulating layer 12 and the outer semiconductive layer 16.

However, in this case, as shown in Figure 1, the internal semiconductive layer 64 and the valley-filling insulating layer 6 are formed by wrapping semiconductive and insulating tapes, respectively, and a heat shrink tube is placed on top of them. A reinforcing insulator 60 is formed by contracting 10°.

(l rFigure S) As in “Figure 3”, above (3)
This is a case where a heat shrink tube 101 is used for the tape-wrapped portion.

That is, by shrinking the heat-shrinkable tube 101, which has an integral structure of the insulating layer 121 and the inner semiconductive layer 14, the inner semiconductive layer 64 and the valley-filling insulating layer filter 6 are formed, as shown in FIG. Form. Then, on top of that, a heat-shrinkable chip 1 consisting of an integral structure of an insulating layer 122 and an outer semiconducting layer 16 is placed.
02 to form a reinforcing insulating layer 62 and an outer semiconducting layer 6.
to form. This method can also be applied to cables with considerably high WE.

Effects of the Invention Since the reinforcing insulating filter O at the connection portion is formed by shrinking the heat-shrinkable tube 10, which is an integrated multi-layered tube made up of a semiconductive layer and an insulating layer 12, (1) the working time can be shortened;

(,2) Since each layer is bonded from the beginning, there is no possibility of dirt or air bubbles remaining between the layers. (3) No need for tape wrapping, making work management easier.

[Brief explanation of drawings]

The drawings relate to embodiments of the present invention, and FIG. 1 is an explanatory diagram of a heat-shrinkable tube 10 used in the invention, and FIG. 2 is an explanatory diagram of a reinforcing insulator 30 formed using the same. Shown below. FIG. 3 shows another example of the heat-shrinkable tube 10, and an explanatory diagram of a reinforcing insulator 60 formed using the same is shown in FIG. FIG. S is an explanatory diagram of still another example of the heat shrinkable tube 10, and an explanatory diagram of a reinforcing insulator 60 formed using the same is shown in FIG. 10.101.1.0'2: Coffin shrink tube 12.12
1.122: Insulating layer 14: Inner semiconducting layer 16: Outer semiconducting layer 30: Reinforcing insulator 62: Reinforcing insulating layer 34: Inner semiconducting layer 6: Outer semiconducting layer Patent applicant Fujikura Electric Cable Co., Ltd. Agent Keiji Kunite

Claims (1)

[Claims] (1) A rubber/plastic cable characterized in that: (1) the reinforcing insulator of the connection portion is formed from a multi-layer integrated heat-shrinkable tube consisting of a semi-conductive layer and an insulating layer; intermediate connection method. (,2) Claim 7, wherein the reinforcing insulator is a three-layer integrated heat-shrinkable tube consisting of a semiconductive layer as an inner layer, an insulating layer as an intermediate layer, and a semiconductive layer as an outer layer. How to connect terms. (3) The reinforcing insulator is a two-layer heat-shrinkable tube with the inner layer being semi-conductive and the outer layer being an insulating layer.
A connection method according to claim 1. (≠) The reinforcing insulator is a two-layer integrated heat-shrinkable tube consisting of an insulating layer as an inner layer and a semiconductive layer as an outer layer.
A connection method according to claim 1. (l The reinforcing insulator is a two-layer integrated heat shrink tube whose inner layer is a semiconducting layer and whose outer layer is an insulating layer, and the inner layer is an insulating layer.
The connection method according to claim 1, comprising laminating two integrated heat shrinkable tubes whose outer layers are semiconductive layers.