JPS5929443A - Lead frame for semiconductor device - Google Patents

Abstract

PURPOSE:To prevent the filling of space sections among lead wires with a synthetic resin, and to obviate the generation of crack, breaking and flaw of a synthetic resin section or the deformation of the lead wires or the like by forming a dummy board, one end thereof intrudes to the space sections among each lead wire and the other end thereof is connected to a connecting piece, in the lead frame sealing and molding a semiconductor element with the synthetic resin. CONSTITUTION:The dummy boards 10, which intrude so as to bury the space sections among the lead wires 2 and are unified with the connecting pieces 3, clearances 11 among the dummy boards 10 and the end surfaces 7 of the lead wires 2 and clearances 12 among the dummy boards 10 and the end surfaces 5 of the synthetic resin sections 4 are formed. With the lead frame for the semiconductor device of such constitution, a die bonding process through which the semiconductor element is set up and a wire bonding process are executed, and a resin seal molding process is executed. In the resin seal molding process, only the synthetic resin sections 4 crosshatched by the dummy boards 10 are sealed and molded with the resin, and the connecting pieces 3 are cut by a connecting cutter while the dummy boards 10 are cut.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a lead frame for a semiconductor device in which a semiconductor element is sealed and molded using a synthetic resin.

FIG. 1 is a plan view showing a conventional lead frame for a semiconductor device. In the figure, (1) is an outer frame, (2) is a plurality of lead wires, (3) is a connecting piece that connects the plurality of lead wires (2), and (4) is a semiconductor element (not shown). After completing the die bonding process and wire bonding process,
As shown by crosshatching, the synthetic resin part is sealed and molded, (5) is the end face of this synthetic resin part (4), (6) is the end face of the connecting piece (3), (the sword is the lead wire ( 2), and (8) is a space surrounded by the end surface (5) of the synthetic resin part (4), the end surface (6) of the connecting piece (3), and the end surface (71) of the lead wire (2). It is.

In a lead frame for a semiconductor device having this configuration, a die bonding process for mounting a semiconductor element (not shown) is performed, and then a resin sealing molding process is performed.

However, in the conventional lead frame for a semiconductor device, the space (8) is also filled with synthetic resin in the resin sealing molding process, as shown in FIG.

The lead resin (9) filled in this space (8) must be removed after the resin sealing molding process, the lead processing process, and the quality inspection before being shipped. It is very difficult to remove the interlead resin (9) using an interlead resin removal device (for example, press processing, etc.) not shown, and the punch is often damaged and worn. Despite the fact that the tips of the parts to be removed are made into various complicated and expensive shapes, it is not possible to sufficiently remove lead n month r 7 J fat < 9). Furthermore, if the lead processing step to the final inspection step is performed with the inter-lead resin (9) adhering to a part of the semiconductor device, the synthetic resin part (4) may be damaged due to the adverse effects of the inter-lead resin (9). ) may cause cracks, chips, scratches, or deformation of the lead wire (2). As described above, there have been drawbacks such as a decrease in productivity and a decrease in yield.

SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide a lead frame for a semiconductor device that can prevent synthetic resin from being filled in the spaces between lead wires.

In order to achieve such an object, the present invention forms a dummy plate having one end inserted into the space between the respective lead wires and the other end connected to the connecting piece. Explain.

FIG. 3 is a plan view showing an embodiment of a lead frame for a semiconductor device according to the present invention. In the figure, (1ω is a dummy plate that enters to fill the space between the lead wires (2) and is integrated with the connecting piece (3), and 0υ is the dummy plate (10) and the lead wire (2). The gap 021 between the end face (7) of the dummy plate 00) and the synthetic resin part (4
) and the end face (5).

A die bonding process for mounting a semiconductor element (not shown) in a lead frame for a semiconductor device having this configuration.

After a wire bonding process is performed, a resin sealing molding process is performed. In this resin-sealing molding step, only the cross-hatched synthetic resin portion (4) is resin-sealed using the dummy plate 0 (I).

Then, the connection piece (3) is cut by a connection cutting device (not shown), and the dummy plate 00) is also cut.

In addition, in the above example, the dummy plate 00) and the lead wire (2)
The gap 01) on the end face (7) of the lead frame was made to have the same dimension in the thickness direction of the lead frame, but it may have a slope as shown in Figure 4 (a) K, or it may have a slope as shown in Figure 4 (b) K Of course, steps may be added in the middle of the thickness of the lead frame, as shown in FIG. 1. Of course, the gap (11) in the longitudinal direction of the lead wire (2) may also be provided in stages as shown in FIG. Furthermore, the gap between the dummy plate 00) and the end face (5) of the synthetic resin (4) ([For force, it goes without saying that a gradient may be applied in the same way, or a step may be applied; As explained in detail, according to the V-SIREM for semiconductor devices according to the present invention, a device for removing resin between leads is completely unnecessary, and existing equipment can be reused, and at the same time, there is no cost for new equipment. In addition, the work of manually inspecting each 91 piece for the presence or absence of residual resin between the leads is completely eliminated, reducing the number of processes and manpower. This eliminates defects in the appearance of semiconductor devices caused by lead-to-lead defects, improves yield, and improves productivity.Furthermore, there is no need to remove the resin between the leads, and the negative effects of the resin between the leads are completely eliminated. , it is possible to connect the pre-process and post-process of the sealing process, which improves productivity and reduces the cost of semiconductor devices.In addition, since there is no resin between the leads, the consumption of synthetic resin can be reduced. It has the effect of reducing

[Brief explanation of the drawing]

FIG. 1 is a plan view showing a conventional lead frame for a semiconductor device, FIG. 2 is a plan view showing a state in which the lead frame for a semiconductor device shown in FIG. 1 is molded with resin, and FIG. Plan views showing one embodiment of such a lead frame for a semiconductor device, FIGS. 4(a) and 4(a) and 1(b) respectively show other examples of the shape of the gap between the dummy plate and the end face of the IJ-1. FIG. 5 is a diagram showing another example of the shape of the gap between the dummy plate and the end face of the synthetic resin. (])...Outer frame, (2)... -Lead wire, (
3)...Connecting piece, (4)...Synthetic resin part, (5
), (6) and (7)... end face, (8)...
Space part, (9)... between leads il☆1 fat, θ+l
)... Dummy board, (+11 and 0 etc.... gaps. In the figure, the same - numerals and numbers indicate the same parts as the same 1 and Q. Agent Tsuri Nobu Kuzu - Figure 4 ( ”) (b) Figure 5 0 199-

Claims (1)

[Claims] In lead frames for semiconductor devices that are sealed and molded with synthetic resin after a semiconductor element is attached to the sealing part, one end is inserted into the space between each lead wire, and the other end is connected to the connecting piece. 1. An IJ-doped frame for a semiconductor device, characterized in that a dummy plate is formed.