JPS5935010U - Resin mold equipment - Google Patents
Resin mold equipmentInfo
- Publication number
- JPS5935010U JPS5935010U JP13193882U JP13193882U JPS5935010U JP S5935010 U JPS5935010 U JP S5935010U JP 13193882 U JP13193882 U JP 13193882U JP 13193882 U JP13193882 U JP 13193882U JP S5935010 U JPS5935010 U JP S5935010U
- Authority
- JP
- Japan
- Prior art keywords
- lower mold
- resin mold
- mold equipment
- heating body
- resin molding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図は在来の樹脂モールド装置を例示する一部破断正
面図、第2図は本考案に係る樹脂モールド装置を例示す
る一部破断圧面図である。
K・・・エジェクタビン、M・・・エジェクタロッド、
H・・・下部金型、G・・・金型支持体、F・・・加熱
体、E・・・バックアッププレート、C・・・プラテン
、■・・・成形品搬送手段、S・・・成形品、P・・・
パーチイングラ ″イン。FIG. 1 is a partially cutaway front view illustrating a conventional resin molding device, and FIG. 2 is a partially cutaway pressure side view illustrating a resin molding device according to the present invention. K...Ejector bin, M...Ejector rod,
H... Lower mold, G... Mold support, F... Heating body, E... Backup plate, C... Platen, ■... Molded product conveyance means, S... Molded product, P...
Perch Ingra ″in.
Claims (1)
を固定すると共に、加熱体より下部金型のキャビティ部
に連通ずる貫通孔にエジェクタビンを挿通してなる樹脂
モールド装置であって、成形後の製品の下部金型からの
離形に際し前記エジェクタビンの突出量を少な(とも該
エジェクタビンの先端が下部金型のパーティングライン
よりも上方に位置するように設定し、該パーティングラ
インと成形品との間に成形品搬送手段を挿入し得るよう
にしたことを特徴とする前記樹脂モールド装置。A resin molding device in which a heating body, a mold support, and a lower mold are fixed on a platen that moves up and down, and an ejector bin is inserted into a through hole that communicates with the cavity of the lower mold from the heating body. When releasing the molded product from the lower mold, the amount of protrusion of the ejector bin is set to be small (in other words, the tip of the ejector bin is positioned above the parting line of the lower mold, and the parting The resin molding apparatus described above is characterized in that a molded article conveying means can be inserted between the molding line and the molded article.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13193882U JPS5935010U (en) | 1982-08-30 | 1982-08-30 | Resin mold equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13193882U JPS5935010U (en) | 1982-08-30 | 1982-08-30 | Resin mold equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5935010U true JPS5935010U (en) | 1984-03-05 |
Family
ID=30298121
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13193882U Pending JPS5935010U (en) | 1982-08-30 | 1982-08-30 | Resin mold equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5935010U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6356604U (en) * | 1986-09-30 | 1988-04-15 |
-
1982
- 1982-08-30 JP JP13193882U patent/JPS5935010U/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6356604U (en) * | 1986-09-30 | 1988-04-15 |
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