JPS593565U - Wiring structure of multilayer printed board - Google Patents
Wiring structure of multilayer printed boardInfo
- Publication number
- JPS593565U JPS593565U JP9830882U JP9830882U JPS593565U JP S593565 U JPS593565 U JP S593565U JP 9830882 U JP9830882 U JP 9830882U JP 9830882 U JP9830882 U JP 9830882U JP S593565 U JPS593565 U JP S593565U
- Authority
- JP
- Japan
- Prior art keywords
- printed board
- holes
- multilayer printed
- wiring structure
- wiring pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
図面は本考案に係る多層プリント板の配線構造の実施例
を示すもので、第１図は信号層のパターン配置図、第２
図は配線パターン形成方向説明図、第３図は各方向パタ
ーンと中継ホール設置可能位置の関係説明図である。
図中、１はスルーホール、２は配線パターンである。The drawings show an embodiment of the wiring structure of a multilayer printed board according to the present invention.
The figure is an explanatory diagram of wiring pattern formation directions, and FIG. 3 is an explanatory diagram of the relationship between patterns in each direction and positions where relay holes can be installed. In the figure, 1 is a through hole and 2 is a wiring pattern.
Claims (1)
るスルーホールを備えた多層プリント板において、前記
スルーホールをＸ方向に対し千鳥状に配設するとともに
、前記各信号層の前記各スルーホールおよび該各スルー
ホール間を２等分する位置を通りＸ方向に対しそれぞれ
０°、４５°、。 ９０°、１３５°傾斜する４方向の配線パターンを形成
し、該配線パターンの前記スルーホールを除く交点のす
べてに層間接続用の微小ホールが設置できるように構成
したことを特徴とする多層プリント板の配線構造。[Claims for Utility Model Registration] A multilayer printed board made of a plurality of layered signal layers and provided with through holes for connecting terminals of mounted components, wherein the through holes are arranged in a staggered manner in the X direction, and , 0° and 45°, respectively, with respect to the X direction passing through each of the through holes of each of the signal layers and a position that bisects the space between the through holes. A multilayer printed board, characterized in that a wiring pattern is formed in four directions inclined at 90° and 135°, and is configured such that micro holes for interlayer connection can be installed at all intersections of the wiring pattern except for the through hole. wiring structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9830882U JPS593565U (en) | 1982-06-30 | 1982-06-30 | Wiring structure of multilayer printed board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9830882U JPS593565U (en) | 1982-06-30 | 1982-06-30 | Wiring structure of multilayer printed board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS593565U true JPS593565U (en) | 1984-01-11 |
Family
ID=30233472
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9830882U Pending JPS593565U (en) | 1982-06-30 | 1982-06-30 | Wiring structure of multilayer printed board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS593565U (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5530822A (en) * | 1978-08-25 | 1980-03-04 | Fujitsu Ltd | Printed board |
| JPS562271B2 (en) * | 1976-08-13 | 1981-01-19 | ||
| JPS5612179B2 (en) * | 1975-10-11 | 1981-03-19 |
-
1982
- 1982-06-30 JP JP9830882U patent/JPS593565U/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5612179B2 (en) * | 1975-10-11 | 1981-03-19 | ||
| JPS562271B2 (en) * | 1976-08-13 | 1981-01-19 | ||
| JPS5530822A (en) * | 1978-08-25 | 1980-03-04 | Fujitsu Ltd | Printed board |
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