JPS5939084A - Mounting structure for optical integrated circuit - Google Patents

Abstract

PURPOSE:To simplify the connecting process of input output fiber and chip by a method wherein a reflector converting the direction of emitting beam is provided on a ceramic substrate to contain and hold the input output fiber arrays almost vertically in the fiber array connecting blocks. CONSTITUTION:An optical integrated circuit chip 1 is contained in a hollow space of the ceramic substrate 10. The part 11 opposing to the light emitting part 3 of the chip 1 is mirror ground into the gradient almost 45 deg. to be chrome plated forming a reflector of emitting beam. The input output fiber arrays 4', 5' are contained and held in the fiber array connecting blocks 13, 14 of the ceramic block 12 blazed at both side of the base. The fiber ends are respectively opposing to a light receiving part 2 of the chip 1 and the reflector 11 of the substrate 10 making a little gap 15 therebetween.

Description

DETAILED DESCRIPTION OF THE INVENTION fa+81 Field of the Invention The present invention relates to an improvement in a mounting structure for efficiently coupling input and output cuff fiber arrays to an optical integrated circuit chip. Kai・ (b) Technology background The development of semiconductor lasers, photodiodes, and optical fibers with extremely low transmission loss has led to dramatic advances in so-called optoelectronics, and has enabled large transmission capacity and resistance to electrostatic and electromagnetic influences from the outside world. Optical communication technology has already entered practical use, and the demand for it is increasing year by year.

In response to this increasing demand, improvements and miniaturization of the optical components mentioned above,
Furthermore, the development of so-called optical integrated circuit chips has progressed in order to reduce the size and reliability of component devices, and structures in which input and output cuff fiber arrays are coupled to these chips are being put into practical use.

GaAs is currently used in the configuration of semiconductor lasers and photodiodes.
Based on the production process, the semiconductor laser, i.e., the light emitting part, is formed perpendicular to the crystal growth direction, and therefore on the side end face of the chip.
That is, the light receiving part is formed on the top surface of the knob.

FIG. 1(A) schematically shows this situation in a perspective view, where 1 is a chip, 2 is a light receiving section array, and 3 is a light emitting section array.

Of course, transistors and diodes are formed on the chip, and wiring patterns for capacitors, resistors, and interconnections are formed on the surface, similar to a general integrated circuit.

By combining the input and output cuff fiber arrays with the light receiving section row 2 and the light emitting section row 3, respectively, and simply supplying power from the outside, an optical integrated circuit that operates as a repeater for optical communications, for example, can be obtained. .

fcl Prior Art and Problems Figure 1 (b) is a schematic side view showing the conventional combination of the input and output cuff fiber array 4°5, the light receiving section row 2, and the light emitting section row 3, in which the fibers are connected in the same horizontal direction. A reflective surface 6 is formed at the end of the input fiber array 4 for arranging the array 4.5.

With such a configuration, it is not easy to form an accurate reflective surface 6 at the end of the fine fiber array 4, and furthermore, alignment adjustment is required at the openings of the input section and the output section 2.
Assembly man-hours significantly increase.

fd1 OBJECTS OF THE INVENTION It is an object of the present invention to provide a new type of optical integrated circuit mounting structure which eliminates the above-mentioned drawbacks.

te) Structure of the Invention The object of the present invention is to provide a ceramic substrate accommodating an optical integrated circuit chip having a reflective surface for changing the direction of an emitted beam in front of a light emitting part, and an input/output cuff fiber array disposed on the substrate. This is achieved by an arrangement according to the invention consisting of a vertically housed fiber array coupling.

In order to provide an accurate reflective surface in front of the light emitting part of the ceramic substrate that houses the chip, the corresponding slope is mirror polished and then
For example, it can be obtained by plating with chrome, a process that is much easier and more accurate than forming reflective surfaces on the tips of fiber arrays.

In addition, a fiber array coupling part that accommodates and holds the input and output cuff fiber arrays approximately vertically is used, and the coupling part is soldered, for example, to the ceramic substrate housing the chip at the highest sensitivity position while measuring the output beam output and input beam output. The assembly can be completed in one go by combining the parts.

(Embodiments of the invention from f1) The gist of the present invention will be specifically explained below with reference to embodiments of the present invention shown in the drawings. The same reference numerals indicate the same objects throughout the drawings.

FIG. 2(A) is a perspective view of a main part of one embodiment, and FIG. 2(B) is a sectional view taken along the line A and A in FIG.

The optical integrated circuit chip 1 has a heat sink 7 made of copper on the bottom surface.
It is housed in a hollow part of a ceramic substrate 1o which is fixed with an adhesive 8 and has a predetermined wiring pattern 9 on its surface. A portion 11 of the inner wall of the hollow portion facing the light emitting portion 3 of the chip I has a mirror surface 6Jf polished to an approximately 45° slope and is plated with chrome to form a reflection surface for the emitted beam.

On the other hand, the input/output fiber arrays 4'' and 5'' are housed and fixed in fiber array coupling blocks 13 and 14 of the ceramic block 12, which are brazed and plated on both sides of the bottom surface, and one end surface of each fiber is separated by a small gap 15. They face the light receiving section 2 of the chip 1 and the inner wall reflective surface 11 of the substrate 10, respectively.

The ceramic block 12 is fixed to the ceramic substrate 1o by solder 15 on both sides of the lower surface of the bottom plate thereof. At this time, a jig is used to set the depth 1 in an operating state while the solder 15 is melting, and cool and fix it at the highest sensitivity position while measuring the output beam output and the input beam output.

In another embodiment shown in a side sectional view of the main part in FIG. 2(c), a hemispherical lens 1
6 is provided to improve the output sensitivity by converging the output beam on the end face of the output fiber array 5.

In addition, in place of the hemispherical lens 16, FIG. 2(d) shows another embodiment in which a spherical lens 17.18 is provided at the tip of the coupling portion 13.14 in order to improve the optical coupling efficiency. Shown in the figure.

(g+ As described in the detailed description of the invention, the optical integrated circuit mounting according to the present invention has a remarkable effect of simplifying the process of connecting the input/output cuff fibers and the chip.

[Brief explanation of drawings]

Fig. 1 shows an example of a conventional coupling mounting structure (b) between an optical integrated circuit chip (in-board and an input/output fiber array), and Fig. 2 is a perspective view of a main part of an embodiment of the present invention (in the figure, 1 is 4. an optical integrated circuit chip; 2 and 3 are respectively a photoreceiver section and a light emitting section;
4'', 5. 5' are input and output fiber arrays, 7 is a heat sink, 10 is a ceramic substrate, 11 is a reflective surface, 12 is a ceramic block, 13. 14 is a fiber array coupling part. (Δ)

Claims (1)

[Claims] A ceramic substrate that houses an optical integrated circuit chip that has a reflective surface for changing the direction of the emitted beam just in front of the light emitting section, and a fiber array coupling section that houses and holds an input/output fiber array disposed on the substrate in a substantially vertical manner. An optical integrated circuit mounting structure characterized by: