JPS5941018A - Heat radiation controller - Google Patents
Heat radiation controllerInfo
- Publication number
- JPS5941018A JPS5941018A JP14998682A JP14998682A JPS5941018A JP S5941018 A JPS5941018 A JP S5941018A JP 14998682 A JP14998682 A JP 14998682A JP 14998682 A JP14998682 A JP 14998682A JP S5941018 A JPS5941018 A JP S5941018A
- Authority
- JP
- Japan
- Prior art keywords
- heat
- container
- temperature
- substrate
- heat radiation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
- G05D23/00—Control of temperature
- G05D23/19—Control of temperature characterised by the use of electric means
- G05D23/1919—Control of temperature characterised by the use of electric means characterised by the type of controller
- G05D23/192—Control of temperature characterised by the use of electric means characterised by the type of controller using a modification of the thermal impedance between a source and the load
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Automation & Control Theory (AREA)
- Control Of Temperature (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔発明の属する技術分野〕
本発明は例えば人工衛星等の飛翔体に塔載されて貞空中
で1v房Iてaる機器の温度制御を行う放熱器fi+1
1 ’r:’itに間する。[Detailed description of the invention] [Technical field to which the invention pertains] The present invention relates to a heat radiator fi+1 for controlling the temperature of a device mounted on a flying object such as an artificial satellite and placed in free space.
1 'r: 'it.
〔従来技術とtの間11弧点〕
1隻空中、特に宇宙空間での機器の温度制fa1は、放
射熱伝達によっての与でしか放熱ができlいlこめ 枚
熱清を制御し−〔磯冴の温度11tlJ n卸を11う
ことは帷!−い。この温度制御のできる放熱制呻器全本
発明者は提)谷している。この放熱1itlJ御層きの
+1・貴及び動作全第1図を用いて説明する。[11 arc points between conventional technology and T] Temperature control fa1 of equipment in a single ship in the air, especially in outer space, can only dissipate heat by applying radiation heat transfer. Isosae's temperature 11 tlJ n wholesale is 11 times! - Yes. The inventor of the present invention has developed a heat radiation suppressor capable of controlling the temperature. This heat dissipation process will be explained using FIG. 1.
温度制御すべき機器(1)を搭載した基板(2)は、そ
の隅部に設けた断熱スペーサー(3)を介してボルト(
4)とナツト(5)によシ、下方に配置した放熱板(6
)に間隔をおいて断熱的に固定されている。(7)は、
基板(2)と放熱板(6)との間に配置された伸縮可i
i@な容器で、この容器(7)は、上端を基板(2)の
裏面に固定したベローズ(8)と、このベローズ(8)
の下端を閉塞し、前記放熱板(6)と接離するように設
けられた接触板(9)とから構成されて込る。更にこの
容器(7)内には作動流体0Iが封入され、作動流体f
llの蒸気圧によって容器(7)が伸縮するようになっ
ている。なお図においてODは放熱板(6)に取付けた
反射板である。又、図において、温度制御すべき機器(
1)は機器本体■をパネルQυに装着して構成されてい
る。The board (2) on which the equipment (1) to be temperature controlled is mounted is connected to the bolt (
4) and the nut (5), and the heat sink (6) placed below.
) are fixed adiabatically at intervals. (7) is
Expandable i placed between the substrate (2) and the heat sink (6)
An i@ container, this container (7) has a bellows (8) whose upper end is fixed to the back surface of the substrate (2), and a bellows (8).
and a contact plate (9) which closes the lower end of the heat dissipation plate (6) and is provided in contact with and away from the heat sink (6). Further, a working fluid 0I is sealed in this container (7), and a working fluid f
The container (7) is designed to expand and contract due to the vapor pressure of 1 liters. Note that in the figure, OD is a reflection plate attached to the heat sink (6). Also, in the figure, the equipment to be temperature controlled (
1) is constructed by attaching the device main body ■ to a panel Qυ.
次に、上記構成の放熱制御器にかいて、その作用を説明
する。Next, the operation of the heat radiation controller having the above configuration will be explained.
温度制御すべへ発熱体となる機器(1)からの発熱は基
板(2)に伝達され、更に伸縮可能な容器(万円の作動
流体0Iを加熱する。この1会、放熱板(6)と対向す
る容器(71の接触板(9)の位置は、ベローズ+81
のバネ力と、容器(7)内の作動流体illの蒸気圧が
平衡する条件で定まる。The heat generated from the device (1) that becomes the heating element for temperature control is transmitted to the substrate (2), which further heats the expandable container (10,000 yen working fluid 0I. The position of the contact plate (9) of the opposing container (71) is bellows +81
It is determined by the condition that the spring force of and the vapor pressure of the working fluid ill in the container (7) are in equilibrium.
作動流体(10が所定温度以上に加熱されて蒸気圧がヒ
昇するとベローズ(8)が伸びて容器171が膨張し、
接触板(9)が押し下げられて放熱板(6)に接触し、
この接触面で熱伝導によシ伝達され、更に放熱板(61
から放射熱伝達により放熱されて1機器(1)の冷却が
行なt)れる。When the working fluid (10) is heated to a predetermined temperature or higher and its vapor pressure rises, the bellows (8) expands and the container 171 expands.
The contact plate (9) is pushed down and comes into contact with the heat sink (6),
At this contact surface, heat is transferred by conduction, and the heat sink (61
One device (1) is cooled by dissipating heat by radiant heat transfer.
このようにして機器tgが所定の温度以下に冷却される
と、これに伴って容器(1)内の作動流体(Il′jの
蒸気圧が城少し、ベローズ(11のバネ力によって容器
(1)が収縮して接触板(9)が放熱板(61から離i
t、放熱が停止する。When the device tg is cooled down to a predetermined temperature or lower in this way, the vapor pressure of the working fluid (Il'j) in the container (1) increases, and the spring force of the bellows (11) causes the container (1 ) contracts and the contact plate (9) separates from the heat sink (61).
t, heat radiation stops.
以下、設定温度を境として容器(pの接触板(9)と放
熱板16)とが接離を繰返す。この接触板(9)と放熱
板(6)とが接離を繰り返すことにより機器0)を所定
の温度に保持することができる。Thereafter, the container (the contact plate (9) of p and the heat sink 16) repeatedly comes into contact with and separates from the set temperature. By repeating contact and separation between the contact plate (9) and the heat sink (6), the device 0) can be maintained at a predetermined temperature.
ところで最近、人工衛星等の飛翔本に対して次のような
要望がある。すなわら、
(1) コンピューター等の精度の高い温度14if
制御全行う必要のある機器全塔載したい。By the way, recently there has been the following request regarding the flight books of artificial satellites and the like. In other words, (1) Highly accurate temperature 14if of a computer, etc.
I want to install all the equipment that needs to be controlled.
(2)例えば試験機器を塔載して複数点の温度で試験を
行いたい。(2) For example, you would like to mount test equipment on a tower and conduct tests at multiple temperatures.
これらの要望に対しで従来の放熱制御器では次のような
理由から実現できなかった。すなわち、機器の急激な発
生熱量の変化に対して伸縮容器内の作動流体の温度変化
が追従できず、緩慢な温度変化しかできなかった。これ
は伸縮容器内の作動流体は割合い大きな熱入力冷却能力
を必要とするからである。Conventional heat radiation controllers have not been able to meet these demands for the following reasons. That is, the temperature change of the working fluid in the expandable container could not follow a sudden change in the amount of heat generated by the equipment, and only a slow temperature change was possible. This is because the working fluid within the telescoping vessel requires a relatively large heat input cooling capacity.
又、以上のような放熱制御器にあっても伸縮容器内の作
動流体の温度を強制的に変化させることができれば複数
点での温度制御及び精度の高い温度制御を行うことがで
べろ。しかしながら、作動流体と機器とは割合い大きな
熱コンダクタンスでつながれているので機器の温度と独
立に作動流体の温度を変、えることが難しかった。Furthermore, even with the above-described heat radiation controller, if the temperature of the working fluid in the expandable container can be forcibly changed, it will be possible to perform temperature control at multiple points and highly accurate temperature control. However, since the working fluid and the equipment are connected through a relatively large thermal conductance, it has been difficult to change the temperature of the working fluid independently of the equipment temperature.
この発明の目的は、上記の放熱制御6を改良し、外部よ
り能動的に制御で趣、精度の高い温度i[ttl #の
できる放熱制御器を提供することにある。An object of the present invention is to improve the heat radiation control 6 described above and provide a heat radiation controller that can control the temperature i[ttl # with high precision and accuracy through active control from the outside.
本発明は、温度制御すべ色機器を一面に塔載する基板と
、この基板の他面側に位置し、この基板と間隔を設けて
断熱スベーザを介して固定されるに一端が固定されるベ
ローズ等の伸縮可能部材で形成される伸縮容器と、この
伸縮容器に連通ずる連;lf4管と、この連通管を介し
て前記伸縮容器に連I屯する制イ111容器と、前記伸
縮容器及び前記制御容器に封入される作動流体と、前記
制御容器を加熱。The present invention includes a board on which temperature control equipment is mounted on one side, and a bellows located on the other side of the board and fixed at one end through a heat insulating groove with a space between the board and the board. a retractable container formed of retractable members such as, a connection communicating with the retractable container; an lf4 pipe, a control 111 container connected to the retractable container via the communication pipe; The working fluid sealed in the control vessel and the control vessel are heated.
冷却するヒーター等で構成される熱源と、前記基板の温
度を検知する温度センサーと、この温度センサーの検知
信号に基づいて前記熱源を制御する制御回路とを具備し
て放熱制御器を構成し、前記温度センサーによって基板
の濡IWを検知し、この検知信号に基づいて前記制御回
路に定められた条、 件に従って前記熱源をON、O
FF等することにより前記制御容器内の作動流体の温度
を変化さき、制接触j−H力を変化させたりして放熱し
1のII例を行うようにしたもので+It、も。A heat radiation controller is configured by comprising a heat source composed of a heater or the like for cooling, a temperature sensor that detects the temperature of the substrate, and a control circuit that controls the heat source based on a detection signal from the temperature sensor, The temperature sensor detects the wetness IW of the board, and based on this detection signal, the heat source is turned on and off according to the conditions set in the control circuit.
The temperature of the working fluid in the control container is changed by FF, etc., and the contact j-H force is changed to radiate heat, and Example 1 of II is also carried out.
本発明に係る放熱flrlJ岬器を用いれば次のような
1・麦ルた〃1果を奏する。すなわち制御容器の作動?
#。If the heat dissipation flrlJ cape device according to the present invention is used, the following effects will be achieved. In other words, the operation of the control vessel?
#.
体の温度″r/:機醋の温度に応じて1]〜速に変化さ
せることにより精度の高す温度制?卸を行うことができ
る。更に制御回路にvA度制御の条(′t−全定・6る
ことにより複教点の温度制御を行うことができる。By changing the body temperature from 1 to 100% according to the temperature of the machine, it is possible to perform temperature control with high accuracy.Furthermore, the control circuit is equipped with a vA degree control clause ('t- Temperature control of multiple teaching points can be performed by setting the total temperature to 6.
〔発明の実施例) 本発明の実施例を第2図金量いて説明する。[Embodiments of the invention] An embodiment of the present invention will be described with reference to FIG.
1i’1] 、第1図と同一のものは同一符号を用いC
詳細な説明は省略する。1i'1], the same reference numerals are used for the same parts as in Fig. 1, and C
Detailed explanation will be omitted.
成鶏11i1j呻器にンいて、作11h流体11値が封
入さrt、cいるイ1リイ容器(刀に、連zl’k ’
# Q乃によりて連+11するfli’J l’叩容’
rl’s 12:9を設け、この制御容器シ東の中に伸
縮容器(7)に封入さtL−Cいる作動流体+1(Iと
同一の作動流体111身を封入する。因、伸+id容器
(7)、1lilJ呻容器jJに封入する作動流体(1
(9の徒は、接触板(9)が放熱板(6)に接触した状
態で制イ11容Zh fl’!内の一部の空間が気相で
残りの菫間が液相となるように封入する。IIIIJ御
容器Cりの周囲には作動流木116を加熱する熱源04
1をヒーター(24a)と電源(24b)で構成し、更
にその周囲を断熱材(ト)で覆っている。ベローズ18
) il: 機器(])の設定温度の下限値の蒸気圧で
は接触板(9)と放熱板(6)とは接触しないようなも
のを用いる。機器(1)が設定温度の上限値近くの温度
に達したことを例えばサーミスタ、%J、対、バイメタ
ル等で形成した温度センサー(イ)で演知するとこの検
知13号で電源(2413’lのON、OFF’を制御
する例えばスイッチ等で構成した制御回路e1を駆動し
、電源(24b)を介してヒーター(24a)で制御容
器C3内の作動流体11■を加熱して1幾−器(1)の
設定温度より充分高い温度にする。こaにより制御容器
((■内に形成される気相の作動流体、4は接触板(9
)と放熱板(6)全充分に高いj上刃で接触させるに必
要な蒸気圧となる。これにより接触板(9)と放熱板(
6)とが充分に高い圧力で接触し、迅速に磯鵡(1)か
らの熱を放熱板(6)に伝えて放熱することができる。In the adult chicken 11i1j groaning vessel, the 11h fluid 11 value is sealed, and the 1lii container (to the sword, zl'k'
#Fli'J l'Katayo' to make +11 by Qno
rl's 12:9 is provided, and a working fluid 111 (same as I) is sealed in a telescopic container (7) inside this control container. (7), working fluid (1
(In the case of 9, when the contact plate (9) is in contact with the heat dissipation plate (6), part of the space inside the 11 volume Zh fl'! is in the gas phase and the remaining space is in the liquid phase. A heat source 04 for heating the operating driftwood 116 is placed around the IIIJ control container C.
1 is composed of a heater (24a) and a power source (24b), and is further covered with a heat insulating material (g). bellows 18
) il: The contact plate (9) and the heat dissipation plate (6) are used so that they do not come into contact with each other at the vapor pressure of the lower limit of the set temperature of the device (]). When the temperature sensor (A) made of a thermistor, %J, bimetal, etc. indicates that the device (1) has reached a temperature close to the upper limit of the set temperature, this detection No. 13 turns on the power supply (2413'l). The control circuit e1, which controls ON and OFF', is driven, and the working fluid 11 in the control vessel C3 is heated by the heater (24a) via the power source (24b), and the The temperature is set to be sufficiently higher than the set temperature in (1).This allows the gas phase working fluid to be formed in the control vessel ((■), and 4 is the contact plate (9).
) and the heat dissipation plate (6) are sufficiently high to provide the vapor pressure necessary to bring them into contact with the upper blade. This allows the contact plate (9) and the heat sink (
6) come into contact with sufficiently high pressure, and the heat from the rock parrot (1) can be quickly transferred to the heat sink plate (6) and radiated.
機器(1)の温度が所定の温度より下がったことを温度
センサーCeによって検知すると制御回路(5)によっ
て・〔電源(24b )をOFFにしてヒーター(24
a)からの作動流体06への加熱を止めて作動流体11
イの温度を下げる。作動流体n[6の温度が下がると作
動流体F+(6の蒸気圧が下が勺、接触板(9)と放熱
板(6)とが離れ、放熱板(6)からの放熱量が下がり
機器(1)の温度低下を防ぐことがでへる。When the temperature sensor Ce detects that the temperature of the device (1) has fallen below a predetermined temperature, the control circuit (5) turns off the power supply (24b) and turns off the heater (24b).
Stop heating the working fluid 06 from a) and turn the working fluid 11
Lower the temperature. When the temperature of the working fluid n[6 decreases, the vapor pressure of the working fluid F+(6) decreases, the contact plate (9) and the heat sink (6) separate, and the amount of heat radiated from the heat sink (6) decreases. (1) The temperature drop can be prevented.
以上の動作を繰り返せば機器を高精度に所定の温度に保
持することができる。By repeating the above operations, the device can be maintained at a predetermined temperature with high precision.
尚、温度センサー■にて検知した温度の変化の割合いを
制御回路(27)にて算出し、そのU出;7た値に基づ
いてヒーター(24a)のON、OFFを制御するよう
に制御回路(27)をマイクロコンピュータ−等にて構
成すれば、更に放熱板(6)と接触板(9)とが接触。In addition, the control circuit (27) calculates the rate of change in temperature detected by the temperature sensor (2), and controls ON/OFF of the heater (24a) based on the calculated value. If the circuit (27) is composed of a microcomputer or the like, the heat dissipation plate (6) and the contact plate (9) will be in contact with each other.
離間するだけでl〈放熱板(6)と接触板(9)との接
触圧力の変化も可能となるので更に高精度の温度制御が
可能となる。Just by separating them, it is possible to change the contact pressure between the heat sink (6) and the contact plate (9), making it possible to control the temperature with even higher precision.
又、機器(1)の所定温度を変えることも制御111回
路(2ηに灸件を設定すれば可;′圭となる、向、ここ
では制御容器C!31i加熱する場合についてのみ説明
したが、制f叩答器(23+の冷却の速度全土げるため
に熱・屯材料を制御卸容器1鍾の周囲に設け′Cもよく
、又容器C31に銅板等の良熱伝導部側を設けでもよい
。In addition, the predetermined temperature of the device (1) can be changed by setting the moxibustion condition in the control 111 circuit (2η). In order to increase the cooling rate of 23+, it is also possible to install a heat-responsive material around the control container 1, or to install a good heat conductive part such as a copper plate on the container C31. good.
更に、伸縮容器(′L)内に突出EIS ’ff設けて
機器(9で発生した熱の伝達率の向上を図ってもよく、
父、伸縮容器(7)のベローズ(8)に並列にバネを設
けて機器(1)の設定温度を設定できろようにしてもよ
い。Furthermore, a protruding EIS 'ff may be provided inside the expandable container ('L) to improve the transfer rate of heat generated by the equipment (9).
Alternatively, a spring may be provided in parallel to the bellows (8) of the expandable container (7) so that the set temperature of the device (1) can be set.
侑1図と1従来の放熱制姉器を示す断面図、第2図は本
jl明に係る放熱制御器を示す断面図である。
(1)・機器、 (2) 基板、(3)断熱
スペーサ5
(8) ベローズ(伸縮可能>jai、−t)、+91
接触板、 (1+1)、(il 作1jj
l流体、(る鎧 連通管、 +23 制御容器
、(]、11 熱源、 (24a) ヒ
ーター、(241)) −電源、 !1シe・温
度センサー、C27)制御回路。
(7317) 代理人弁理士 則 適意 佑 (り1
か1名)第!図Figures 1 and 1 are cross-sectional views showing a conventional heat radiation controller, and Figure 2 is a cross-sectional view showing a heat radiation controller according to the present invention. (1) Equipment, (2) Board, (3) Heat insulating spacer 5 (8) Bellows (expandable>jai, -t), +91
Contact plate, (1+1), (il work 1jj
l Fluid, (Armor communication pipe, +23 Control vessel, (), 11 Heat source, (24a) Heater, (241)) - Power supply, !1 Sheet/Temperature sensor, C27) Control circuit. (7317) Representative Patent Attorney Rules Suitable Yu (Ri1)
or 1 person) No. 1! figure
Claims (1)
の基板の前記機器の他面側に位置し、この基板と間隔金
膜けて断熱スペーサを介して固定きれる放熱板と、前記
基板と前記放熱板との間に位置し、前記放熱板と接触、
離間を行う接触板及び前記基板に一端が固定される伸縮
可能部材で形成される伸縮容器と、この伸縮容器に連通
ずる連通管と、この連通Wk介して前記伸縮容器に連通
ずる制御容器と、前記伸縮容器及び前記制御容器に封入
される作動流体と、前記制御容器を加熱、冷却する熱源
と、前記基板の温度を検知する温度センサーと、この温
度センサーの検知信号に基づいて前記熱源を制f卸する
+l1tl in回路と全具備したことを特徴とする放
熱制御器。 (2) 熱源をヒーターで構成したことをIPj徴と
する特許1□n求の範囲第1項記載の放熱制御器。 (3) 熱源をヒーターで加熱、熱屈材木)で?守去
1を行うように構成してなることを特徴とする特許i請
求の範囲第1珀記載の放熱制御器。 +4) tIi制御容器の周囲を断熱材で覆ったこと
を特徴とする特許請求の範囲第1項記載の放熱制御器。 (5)制御容器の一部に良熱伝導部材を設けたことを特
徴とする特許請求の範囲第1項記式戊の放熱制御器。[Scope of Claims] (1) A substrate on which a device to be temperature controlled is mounted on one side, and the device is located on the other side of this substrate and fixed to the substrate through a heat insulating spacer with a gold film in between. a heat sink, located between the substrate and the heat sink, and in contact with the heat sink;
A contact plate for separating and a retractable container formed of a retractable member having one end fixed to the substrate, a communication pipe communicating with the retractable container, and a control container communicating with the retractable container via this communication Wk; A working fluid sealed in the expandable container and the control container, a heat source for heating and cooling the control container, a temperature sensor for detecting the temperature of the substrate, and controlling the heat source based on a detection signal from the temperature sensor. A heat dissipation controller characterized by being completely equipped with a f wholesale+l1tl in circuit. (2) The heat radiation controller according to the scope of Patent No. 1□n, item 1, characterized in that the heat source is constituted by a heater. (3) Is the heat source heated with a heater or heat-flexible wood? 1. A heat radiation controller according to claim 1, characterized in that the heat radiation controller is configured to perform the following functions. +4) The heat radiation controller according to claim 1, characterized in that the periphery of the tIi control container is covered with a heat insulating material. (5) The heat radiation controller according to claim 1, characterized in that a part of the control container is provided with a good heat conductive member.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14998682A JPS5941018A (en) | 1982-08-31 | 1982-08-31 | Heat radiation controller |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14998682A JPS5941018A (en) | 1982-08-31 | 1982-08-31 | Heat radiation controller |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5941018A true JPS5941018A (en) | 1984-03-07 |
Family
ID=15486965
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14998682A Pending JPS5941018A (en) | 1982-08-31 | 1982-08-31 | Heat radiation controller |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5941018A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009207336A (en) * | 2008-02-29 | 2009-09-10 | Denso Corp | Heat conducting structure |
| JP2010151136A (en) * | 2010-01-08 | 2010-07-08 | Denso Corp | Heat-conductive structure |
-
1982
- 1982-08-31 JP JP14998682A patent/JPS5941018A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009207336A (en) * | 2008-02-29 | 2009-09-10 | Denso Corp | Heat conducting structure |
| JP2010151136A (en) * | 2010-01-08 | 2010-07-08 | Denso Corp | Heat-conductive structure |
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