JPS5948986A - Mounting structure of electronic part on printed board - Google Patents
Mounting structure of electronic part on printed boardInfo
- Publication number
- JPS5948986A JPS5948986A JP16034982A JP16034982A JPS5948986A JP S5948986 A JPS5948986 A JP S5948986A JP 16034982 A JP16034982 A JP 16034982A JP 16034982 A JP16034982 A JP 16034982A JP S5948986 A JPS5948986 A JP S5948986A
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- mounting structure
- circuit board
- printed board
- electronic part
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
本発明は、導電性接着剤を用いる電子部品のプリント基
板への実装にお番づる銀マイ・グレージョンを防止する
実装構造に関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a mounting structure that prevents silver migration when electronic components are mounted on a printed circuit board using a conductive adhesive.
一般に、接合界面における電気的信頼度を向上させる目
的から導電性接層剤を用いて電子部品をプリント基板に
実装する場合が多い、これらの電子部品を実装するプリ
ント基４ノｉとしては、セラミックス、エポキシ樹脂、
フェノール樹脂などを絶縁体とした、積層板が使用され
ている。これらのプリント基板上に実装された導電性接
着剤は、高温度条件下において、電界が派生するとき、
プリント基板の表面および机内における直流漏洩電流に
よって、高電位側より低電位側への銀イオンの移動現象
が生じ絶縁抵抗の急激な劣化を引越して、最終的には短
絡状態になる欠点を有していた。Generally, electronic components are often mounted on printed circuit boards using a conductive adhesive in order to improve the electrical reliability at the bonding interface. ,Epoxy resin,
Laminated plates made of phenolic resin or other insulators are used. When an electric field is generated under high temperature conditions, the conductive adhesive mounted on these printed circuit boards
Direct current leakage current on the surface of the printed circuit board and inside the desk causes silver ions to move from the high potential side to the low potential side, leading to rapid deterioration of insulation resistance and ultimately resulting in a short circuit. Was.
本発明は以上の欠点を解消するため、プリント基板に形
成せるランド部間に、（°↓通穴部またはサライ部を設
は分離し、銀イオンの移動を防止したマイグレーション
防止法である。In order to solve the above-mentioned drawbacks, the present invention is a migration prevention method in which a through-hole section or a side section is provided between land sections formed on a printed circuit board to prevent silver ions from moving.
以下本発明の実施例の実装構造を詳細に説明する。本発
明の第１実施例を示す第１図において、まずプリント基
板２＆こ形成された、短形状の銅箔からなるランド部６
とチップ状の電子（ｉ３品１の両側の端子５部を、導電
性接着剤を用いて、接合固定するときの実装において、
ランド部３間に、貫・通水部６が設けられる。なお・、
第２図は、ランド部３の間に、サラィ部７を設けた不発
ゆ」の第２の実施例である。The mounting structure of an embodiment of the present invention will be described in detail below. In FIG. 1 showing the first embodiment of the present invention, first, a land portion 6 made of rectangular copper foil is formed on a printed circuit board 2.
and chip-shaped electronics (i3) When mounting the terminals on both sides of product 1 using conductive adhesive,
A penetration/water passage portion 6 is provided between the land portions 3. In addition·,
FIG. 2 shows a second embodiment of a non-explosion device in which a salient portion 7 is provided between the land portions 3.
以上に説明した本発明の実装も４造にすれば、銀イオン
の移動が防止でき、短絡のような回路トラブルを生じさ
せないという優れた効果を提供することができる。If the present invention described above is implemented in a four-way structure, the migration of silver ions can be prevented and circuit troubles such as short circuits will not occur, providing an excellent effect.
第１図および第２図は、それぞれ本発明の第１と第２の
実施例を示す断面図である。
１・・・・・・電子部品 ２・・・・・・プリント基
板・３・・・・・・ランド部 ４・・・・・・導電性
接着剤５・・・・・・端 子 ６・・・・・・貫通
穴部７・・・・・・サライ部
以 上
出願人 株式会社第二精工舎
代理人 弁理士 最上 務
第１図
第２図
） ） −１
３２７３FIGS. 1 and 2 are cross-sectional views showing first and second embodiments of the present invention, respectively. 1... Electronic components 2... Printed circuit board 3... Land portion 4... Conductive adhesive 5... Terminal 6. ...Through hole part 7...Sarai part and above Applicant Daini Seikosha Co., Ltd. Agent Patent attorney Mogami (Figure 1, Figure 2) -1 3273
Claims (1)
品を美装する電子部品のプリント基板への実装構造にお
いて、プリント基板にノ影成せるランド部間に、貫通さ
せうる穴部またはサライ部を設けることにより、銀マイ
グレーションを防止したことを特徴とする電子部品のプ
リント基板への実装構造。A hole that can be penetrated between lands formed on a printed circuit board in a mounting structure for electronic components on a printed circuit board in which electronic components are beautifully mounted on the copper foil surface of a printed circuit board using a conductive adhesive. Alternatively, a mounting structure for electronic components on a printed circuit board, characterized in that silver migration is prevented by providing a sidewall.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16034982A JPS5948986A (en) | 1982-09-14 | 1982-09-14 | Mounting structure of electronic part on printed board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16034982A JPS5948986A (en) | 1982-09-14 | 1982-09-14 | Mounting structure of electronic part on printed board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5948986A true JPS5948986A (en) | 1984-03-21 |
Family
ID=15713054
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16034982A Pending JPS5948986A (en) | 1982-09-14 | 1982-09-14 | Mounting structure of electronic part on printed board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5948986A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01297882A (en) * | 1988-05-26 | 1989-11-30 | Nec Corp | Printed board |
-
1982
- 1982-09-14 JP JP16034982A patent/JPS5948986A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01297882A (en) * | 1988-05-26 | 1989-11-30 | Nec Corp | Printed board |
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