JPS5952629U - フアインワイヤ−供給用パツケ−ジ - Google Patents

フアインワイヤ−供給用パツケ−ジ

Info

Publication number
JPS5952629U
JPS5952629U JP1982147019U JP14701982U JPS5952629U JP S5952629 U JPS5952629 U JP S5952629U JP 1982147019 U JP1982147019 U JP 1982147019U JP 14701982 U JP14701982 U JP 14701982U JP S5952629 U JPS5952629 U JP S5952629U
Authority
JP
Japan
Prior art keywords
fine wire
wire supply
supply package
aligned
winding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1982147019U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0124932Y2 (cs
Inventor
茂 安田
岸 清貴
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Metal Mining Co Ltd
Original Assignee
Sumitomo Metal Mining Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Metal Mining Co Ltd filed Critical Sumitomo Metal Mining Co Ltd
Priority to JP1982147019U priority Critical patent/JPS5952629U/ja
Publication of JPS5952629U publication Critical patent/JPS5952629U/ja
Application granted granted Critical
Publication of JPH0124932Y2 publication Critical patent/JPH0124932Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/071Connecting or disconnecting
    • H10W72/075Connecting or disconnecting of bond wires
    • H10W72/07502Connecting or disconnecting of bond wires using an auxiliary member

Landscapes

  • Filamentary Materials, Packages, And Safety Devices Therefor (AREA)
  • Wire Bonding (AREA)
JP1982147019U 1982-09-30 1982-09-30 フアインワイヤ−供給用パツケ−ジ Granted JPS5952629U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1982147019U JPS5952629U (ja) 1982-09-30 1982-09-30 フアインワイヤ−供給用パツケ−ジ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1982147019U JPS5952629U (ja) 1982-09-30 1982-09-30 フアインワイヤ−供給用パツケ−ジ

Publications (2)

Publication Number Publication Date
JPS5952629U true JPS5952629U (ja) 1984-04-06
JPH0124932Y2 JPH0124932Y2 (cs) 1989-07-27

Family

ID=30327064

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1982147019U Granted JPS5952629U (ja) 1982-09-30 1982-09-30 フアインワイヤ−供給用パツケ−ジ

Country Status (1)

Country Link
JP (1) JPS5952629U (cs)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010027941A (ja) * 2008-07-23 2010-02-04 Tdk Corp コイル部品及びコイル部品の製造方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5793144U (cs) * 1980-11-27 1982-06-08

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5793144U (cs) * 1980-11-27 1982-06-08

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010027941A (ja) * 2008-07-23 2010-02-04 Tdk Corp コイル部品及びコイル部品の製造方法

Also Published As

Publication number Publication date
JPH0124932Y2 (cs) 1989-07-27

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